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Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip

  • US 9,275,926 B2
  • Filed: 05/03/2013
  • Issued: 03/01/2016
  • Est. Priority Date: 05/03/2013
  • Status: Active Grant
First Claim
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1. A power module, comprising:

  • a semiconductor chip having a first main surface and a second main surface opposing the first main surface;

    a first bonding substrate having a first bonding surface coupled to the first main surface of the semiconductor chip and having a first heat removal surface opposing the first bonding surface;

    a second bonding substrate having a second bonding surface coupled to the second main surface of the semiconductor chip and having a second heat removal surface opposing the second bonding surface;

    a first cooling structure on the first heat removal surface configured for removing heat from the semiconductor chip when interacting with cooling fluid; and

    a second cooling structure on the second heat removal surface configured for removing heat from the semiconductor chip when interacting with cooling fluid;

    wherein at least one of the first cooling structure and the second cooling structure comprises an array of cooling loops;

    wherein the array of cooling loops comprises at least one of the group consisting of meandrically bent bond wires and meandrically bent bond ribbons.

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