Method for embedding a LED network

• US 9,275,980 B2
• Filed: 01/12/2012
• Issued: 03/01/2016
• Est. Priority Date: 01/12/2011
• Status: Expired due to Fees

• Current Assignee: Sioen Industries NV (Sioen Family)
• Original Assignee: Sioen Industries NV (Sioen Family)
• Inventors: Groenendaal, Bert, Wille, Joost
• Primary Examiner(s): Pert, Evan
• Application Number:
  US13/979,604
• Publication Number:
  US 20140092598A1
• Time in Patent Office: 1,510 Days
• US Class Current: 1/1
• CPC Class Codes: B32B 2037/243 Coating
• CPC Class Codes: B32B 2038/0076 Curing, vulcanising, cross-linking
• CPC Class Codes: B32B 2305/34 Inserts
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 37/24 with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate B32B37/15 takes precedence
• CPC Class Codes: F21S 4/15 the cables forming a grid, net or web structure
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

The invention relates to a method for embedding a non-embedded or bare LED network. To this end, the method of embedding a non-embedded LED network comprises the steps of: •(a) providing said non-embedded LED network associated with a continuous flexible support; •(b) applying in a continuous manner a flexible insulation layer on a liquid basis onto said non-embedded LED network associated with said continuous flexible support.

Claims

1. A method for embedding a non-embedded LED network comprising the steps of:

(a) providing a non-embedded LED network fixed into or onto a continuous flexible textile; and

(b) embedding the non-embedded LED network fixed into or onto a continuous flexible textile to produce a flexible, plane-parallel textile by applying in a continuous manner at least one flexible insulation layer on a liquid basis onto said non-embedded LED network which is fixed into or onto said continuous flexible textile.

2. The method according to claim 1, which comprises the step of winding, folding, cutting and/or stacking the product that is at least obtained with the steps (a) and (b).

3. The method according to claim 1, wherein said non-embedded LED network comprises a network of conductors which provides a set of bare LEDs with energy, and which connects said set of bare LEDs in a pattern with each other.

4. The method according to claim 1, wherein successively:

(a1) a continuous flexible support is provided;

(b1) a first flexible insulation layer on a liquid basis is applied in a continuous manner onto said continuous flexible support;

(c1) said non-embedded LED network fixed into or onto a continuous flexible textile is positioned onto said first flexible insulation layer;

(d1) a second flexible insulation layer on a liquid basis is applied in a continuous manner onto said non-embedded LED network and said first insulation layer; and

(e1) optionally, said winding, folding, cutting and/or stacking is carried out.

5. The method according to claim 4, wherein the method between applying the first insulation layer on a liquid basis and placing the non-embedded LED network onto the first insulation layer comprises the step of:

(f1) applying an adhesive layer onto said first insulation layer, wherein into or onto said adhesive layer said non-embedded LED network may be adhered.

6. The method according to claim 4, wherein said applying the first insulation layer comprises the following steps:

applying an insulation layer paste onto said support;

spreading said insulation layer paste up to a predetermined first insulation layer thickness; and

at least partially curing said first insulation layer paste to obtain the first insulation layer.

7. The method according to claim 5, wherein said placing the non-embedded LED network onto said first insulation layer comprises the following steps:

focusing the LEDs in order to emit light in the same direction; and

pressing the LEDs in the adhesive layer until the LEDs abut against said first insulation layer.

8. The method according to claim 4, wherein said continuous flexible support has a surface which exhibits a predetermined texture.

9. The method according to claim 4, wherein after the step of applying said second insulation layer on a liquid basis the method comprises the step of removing said support of said first insulation layer.

10. The method according to claim 1, wherein a second insulation layer on a liquid basis is applied onto one side of the support which is different from the side onto which said flexible insulation layer on a liquid basis has been applied.

11. The method according to claim 1, wherein said continuous flexible textile is a textile on a roll which is at least partly unwound prior to applying said insulation layer on a liquid basis.

12. The method according to claim 4, wherein said continuous flexible support comprises a plastics foil or a paper.

13. An embedded LED network, obtained with the method according to claim 1, or a functional part of it.

15. A lighting unit comprising an embedded LED network according to claim 13.

14. An embedded LED network associated with a flexible textile and provided with a continuous flexible insulation layer on a liquid basis based on a non-thermoplastic material applied onto said LED network associated with said flexible textile.

16. A lighting unit comprising an embedded LED network according to claim 14.

17. An embedded LED network according to claim 14, wherein said non-thermoplastic material is a silicone derivative.

18. A lighting unit comprising an embedded LED network according to claim 17.