Semiconductor device
First Claim
1. A semiconductor device comprising:
- a first semiconductor region, which has a first conductivity type;
a second semiconductor region, which has a second conductivity type and is arranged on the first semiconductor region;
a third semiconductor region, which has the first conductivity type and is arranged on the second semiconductor region;
a fourth semiconductor region, which has the second conductivity type and is arranged on the third semiconductor region;
an insulation film, which is arranged on an inner wall of a recess that extends from an upper surface of the fourth semiconductor region and reaches the second semiconductor region with penetrating the fourth semiconductor region and the third semiconductor region, wherein the recess is configured by a plurality of recesses arranged in parallel and connected to each other by a connection recess, the connection recess being formed to extend from an upper surface of the third semiconductor region and to reach the second semiconductor region with penetrating the third semiconductor region, and wherein a width of the connection recess is wider than an interval between the plurality of recesses;
a control electrode, which is arranged on the insulation film on a side surface of the recess and faces the third semiconductor region;
a first main electrode, which is electrically connected to the first semiconductor region; and
a second main electrode, which is electrically connected to the fourth semiconductor region,wherein a ratio of a width of the recess to a width of the third semiconductor region contacting the second main electrode is 1 or larger.
1 Assignment
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Accused Products
Abstract
A semiconductor device includes: a first semiconductor region; a second semiconductor region; a third semiconductor region; a fourth semiconductor region; an insulation film, which is arranged on an inner wall of a recess that extends from an upper surface of the fourth semiconductor region and reaches the second semiconductor region with penetrating the fourth semiconductor region and the third semiconductor region; a control electrode, which is arranged on the insulation film on a side surface of the recess and faces the third semiconductor region; a first main electrode, which is electrically connected to the first semiconductor region, and a second main electrode, which is electrically connected to the fourth semiconductor region, wherein a ratio of a width of the recess to a width of the third semiconductor region contacting the second main electrode is 1 or larger.
14 Citations
9 Claims
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1. A semiconductor device comprising:
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a first semiconductor region, which has a first conductivity type; a second semiconductor region, which has a second conductivity type and is arranged on the first semiconductor region; a third semiconductor region, which has the first conductivity type and is arranged on the second semiconductor region; a fourth semiconductor region, which has the second conductivity type and is arranged on the third semiconductor region; an insulation film, which is arranged on an inner wall of a recess that extends from an upper surface of the fourth semiconductor region and reaches the second semiconductor region with penetrating the fourth semiconductor region and the third semiconductor region, wherein the recess is configured by a plurality of recesses arranged in parallel and connected to each other by a connection recess, the connection recess being formed to extend from an upper surface of the third semiconductor region and to reach the second semiconductor region with penetrating the third semiconductor region, and wherein a width of the connection recess is wider than an interval between the plurality of recesses; a control electrode, which is arranged on the insulation film on a side surface of the recess and faces the third semiconductor region; a first main electrode, which is electrically connected to the first semiconductor region; and a second main electrode, which is electrically connected to the fourth semiconductor region, wherein a ratio of a width of the recess to a width of the third semiconductor region contacting the second main electrode is 1 or larger. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9)
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2. A semiconductor device comprising:
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a first semiconductor region, which has a first conductivity type; a second semiconductor region, which has a second conductivity type and that is arranged on the first semiconductor region; a third semiconductor region, which has the first conductivity type and that is arranged on the second semiconductor region; a fourth semiconductor region, which has the second conductivity type and that is arranged on the third semiconductor region; an insulation film, which is arranged on an inner wall of a recess that extends from an upper surface of the fourth semiconductor region and reaches the second semiconductor region with penetrating the fourth semiconductor region and the third semiconductor region; a control electrode arranged on the insulation film on a side surface of the recess and facing the third semiconductor region; a first main electrode electrically connected to the first semiconductor region; and a second main electrode electrically connected to the fourth semiconductor region, wherein a ratio of a total area of the recess on an extension of an interface between the second semiconductor region and the third semiconductor region to a total area of a region of the third semiconductor region contacting the second main electrode is 1 or larger.
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Specification