Semiconductor light emitting device
First Claim
1. A semiconductor light emitting device, comprising:
- an LED chip;
a case on which the LED chip is mounted,wherein the LED chip comprises an n-type semiconductor layer, a p-type semiconductor layer, an anode electrode electrically connected to the p-type semiconductor layer, and an cathode electrode electrically connected to the n-type semiconductor layer, and the anode electrode and the cathode electrode facing the case when the LED chip is mounted on the case, andwherein the case comprises a base member including a front surface and a rear surface, a front surface layer including an anode pad and a cathode pad which are formed at the front surface;
a rear surface layer including an anode mounting electrode and a cathode mounting electrode which are formed at the rear surface, and a reflective resin inclined to be receded from the front surface; and
a bypass function element preventing a reverse overvoltage from being applied to the LED chip, and the reflective resin covers at least a portion of the bypass function element.
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Accused Products
Abstract
A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member.
7 Citations
18 Claims
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1. A semiconductor light emitting device, comprising:
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an LED chip; a case on which the LED chip is mounted, wherein the LED chip comprises an n-type semiconductor layer, a p-type semiconductor layer, an anode electrode electrically connected to the p-type semiconductor layer, and an cathode electrode electrically connected to the n-type semiconductor layer, and the anode electrode and the cathode electrode facing the case when the LED chip is mounted on the case, and wherein the case comprises a base member including a front surface and a rear surface, a front surface layer including an anode pad and a cathode pad which are formed at the front surface;
a rear surface layer including an anode mounting electrode and a cathode mounting electrode which are formed at the rear surface, and a reflective resin inclined to be receded from the front surface; anda bypass function element preventing a reverse overvoltage from being applied to the LED chip, and the reflective resin covers at least a portion of the bypass function element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification