Metalized pad to electrical contact interface
First Claim
1. A surface mount electrical interconnect to provide an interface between a PCB and contacts on an integrated circuit device, the electrical interconnect comprising:
- an interconnect assembly comprising a plurality of layers bonded together with a plurality of recesses extending through the plurality of bonded layers, the plurality of recesses being arranged on a first surface of the plurality of layers to correspond to the contacts on the integrated circuit device;
contact members located in a plurality of the recesses, the contact members comprising contact tips configured to electrically couple with the contacts on the integrated circuit device;
at least one circuit trace formed on a second surface of the plurality of layers electrically coupling the contact members to metalized pads located on the second surface of the plurality of layers at a location offset from a corresponding contact members;
solder balls attached to a plurality of the metalized pads; and
elongated springs located and arranged along in the plurality of the recesses of the bonded layers configured to bias the contact tips away from the first surface of a to layer.
2 Assignments
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Accused Products
Abstract
A surface mount electrical interconnect to provide an interface between a PCB and contacts on an integrated circuit device. The electrical interconnect includes a substrate with a plurality of recesses arranged along a first surface to correspond to the contacts on the integrated circuit device. Contact members are located in a plurality of the recess. The contact members include contact tips adapted to electrically couple with the contacts on the integrated circuit device. An electrical interface including at least one circuit trace electrically couples the contact member to metalized pads located along a second surface of the substrate at a location offset from a corresponding contact member. A solder ball is attached to a plurality of the metalized pads.
404 Citations
20 Claims
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1. A surface mount electrical interconnect to provide an interface between a PCB and contacts on an integrated circuit device, the electrical interconnect comprising:
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an interconnect assembly comprising a plurality of layers bonded together with a plurality of recesses extending through the plurality of bonded layers, the plurality of recesses being arranged on a first surface of the plurality of layers to correspond to the contacts on the integrated circuit device; contact members located in a plurality of the recesses, the contact members comprising contact tips configured to electrically couple with the contacts on the integrated circuit device; at least one circuit trace formed on a second surface of the plurality of layers electrically coupling the contact members to metalized pads located on the second surface of the plurality of layers at a location offset from a corresponding contact members; solder balls attached to a plurality of the metalized pads; and elongated springs located and arranged along in the plurality of the recesses of the bonded layers configured to bias the contact tips away from the first surface of a to layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 17, 19)
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9. A method of making a surface mount electrical interconnect to provide an interface between a PCB and contacts on an integrated circuit device, the method comprising the steps of:
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forming an interconnect assembly comprising a plurality of layers bonded together and a plurality of recesses extending through the plurality of layers, the plurality of recesses being arranged along a first surface of the plurality of layers to correspond to the contacts on the integrated circuit device; locating contact members in a plurality of the recess so that contact tips on the contact members are positioned to electrically couple with the contacts on the integrated circuit device; forming at least one circuit trace on a second surface of the plurality of layers that electrically couples the contact members to metalized pads located on the second surface of the plurality of layers at a location offset from a corresponding contact members; attaching solder balls to a plurality of the metalized pads; and locating elongated springs arranged along in the plurality of the recesses of the bonded layers to bias the contact tips away from the first surface of a top layer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 18, 20)
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Specification