Electrical interconnect IC device socket

• US 9,276,339 B2
• Filed: 11/29/2011
• Issued: 03/01/2016
• Est. Priority Date: 06/02/2009
• Status: Active Grant

• Current Assignee: HSIO Technologies LLC
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James
• Primary Examiner(s): Hammond, Briggitte R
• Application Number:
  US13/880,231
• Publication Number:
  US 20130210276A1
• Time in Patent Office: 1,554 Days
• US Class Current: 1/1
• CPC Class Codes: H01R 11/16 End pieces terminating in a soldering tip or socket
• CPC Class Codes: H01R 12/7082 Coupling device supported only by cooperation with PCB
• CPC Class Codes: H01R 12/714 with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H01R 13/24 resilient; resiliently-mounted
• CPC Class Codes: H01R 43/00 Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors of trolley lines B60M1/28
• CPC Class Codes: H05K 7/1061 co-operating by abutting
• CPC Class Codes: Y10T 29/49208 by assembling plural parts

Abstract

A surface mount electrical interconnect adapted to provide an interface between contact pads on an LGA device and a PCB. The electrical interconnect includes a socket substrate having a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings. The center openings include at least one cross-section greater than the first and second cross-sections. A plurality of contact members are located in the socket substrate such that first contact tips are located proximate the first openings, second contact tips are located proximate the second openings, and center portions located in the center openings.

Claims

1. A surface mount electrical interconnect providing an interface between contact pads on an LGA device and a PCB, the electrical interconnect comprising:

a socket substrate comprising a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings, the center openings comprising at least one cross-section greater than the first and second cross-sections;

a plurality of contact members comprising first contact tips locating proximate the first openings, second contact tips located proximate the second openings, and center portions located in the center openings, the center portions comprising a shape adapted to promote flexure of the contact members within the center openings, the contact members comprise a plurality of beams secured together by the first and second sleeves;

first sleeves attached to the first contact tips, the first sleeves to slide in the first openings generally along axes generally perpendicular to the first surface as the center portions of the contact members flex in the center openings; and

second sleeves attached to the second contact tips, the second sleeves located in the second openings.

2. The electrical interconnect of claim 1 wherein the second sleeves slides in the second openings generally along axes generally perpendicular to the second surface as the center portions of the contact members flex in the center openings.

3. The electrical interconnect of claim 1 wherein the second sleeves are secured in the second openings.

4. The electrical interconnect of claim 1 comprising solder balls attached to the second contact tips, the solder balls are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

5. The electrical interconnect of claim 1 comprising flexure members located in the center openings adapted to promote flexure of the center portions of the contact members.

6. The electrical interconnect of claim 5 wherein the flexure members are secured to one of the center portions of the contact members or the socket substrate.

7. The electrical interconnect of claim 1 wherein, the center portions of the contact members comprise a serpentine shape.

8. The electrical interconnect of claim 1 wherein the shape of the center portions of the contact members comprises a cross-section greater than the cross-sections of the first and second openings.

9. The electrical interconnect of claim 1 comprising:

at least one dielectric layer printed on one of the first or second surfaces of the socket substrate, the dielectric layer comprising a plurality recesses; and

a conductive material deposited in at least a portion of the recesses comprising a circuit geometry electrically coupling at least two of the contact tips.

10. The electrical interconnect of claim 6 wherein the conductive material comprises one of electro-less or electrolytic plating.

11. The electrical interconnect of claim 6 wherein the dielectric layers comprise at least one additional circuitry plane selected from one of a ground plane, a power plane, an electrical connection to other circuit members, a dielectric layer, or a flexible circuit.

12. The electrical interconnect of claim 1 comprising at least one printed electrical device located on the socket substrate and electrically coupled to at least one of the contact members.

13. The electrical interconnect of claim 12 wherein the electrical device is selected from one of shielding, near device decoupling, capacitors, transistors, resistors, filters, signal or power altering and enhancing devices, memory devices, embedded IC devices, RF antennae, and the like.

14. The electrical interconnect of claim 1 comprising:

at least one dielectric layer printed on one of the first or second surfaces of the socket substrate, the dielectric layer comprising a plurality recesses; and

an optical quality material deposited in recesses.

15. The electrical interconnect of claim 1 wherein the socket substrate comprises a multi-layered structure.

16. The electrical interconnect of claim 1 wherein the socket substrate comprises a non-moldable feature.

17. An electrical interconnect assembly comprising:

a housing that retains the electrical interconnect of claim 1;

an LGA device located in the housing with contact pads electrically coupled to the first contact tips of the contact members; and

a PCB soldered to the second contact tips located at the second surface of the socket substrate.

18. A surface mount electrical interconnect providing an, interface between contact pads on an LGA device and a PCB, the electrical interconnect comprising:

a socket substrate comprising a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings, the center openings comprising at least one cross-section greater than the first and second cross-sections;

a plurality of contact members comprising first contact tips locating proximate the first openings, second contact tips located proximate the second openings, and center portions located in the center openings, the center portions flexing in the center openings in response to an axial force applied to the first contact tips;

flexure members located in the center openings adapted to promote flexure of the center portions of the contact members;

first sleeves attached to the first contact tips and located in the first openings, the first sleeves slide in, the first openings generally along axes generally perpendicular to the first surface as the center portions of the contact members flex in the center openings; and

second sleeves attached to the second contact tips and located in the second openings.

19. A surface mount electrical interconnect providing an interface between, contact pads on an LGA device and a PCB, the electrical interconnect comprising:

a socket substrate comprising a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings, the center openings comprising at least one cross-section greater than the first and second cross-sections;

a plurality of contact members comprising first contact tips locating proximate the first openings, second contact tips located proximate the second openings, and center portions located in the center openings, the center portions flexing in the center openings in response to an axial force applied to the first contact tips;

first sleeves attached to the first contact tips and located in the first openings, the first sleeves slide in, the first openings generally along axes generally perpendicular to the first surface as the center portions of the contact members flex in the center openings; and

second sleeves attached to the second contact tips and located in the second openings.

20. The electrical interconnect of claim 19 wherein the second sleeves slide in the second openings generally along axes generally perpendicular to the second surface as the center portions of the contact members flex in the center openings.