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Bonded abrasive article and method of grinding

  • US 9,278,431 B2
  • Filed: 12/30/2013
  • Issued: 03/08/2016
  • Est. Priority Date: 12/31/2012
  • Status: Active Grant
First Claim
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1. An abrasive article configured to grind a silicon nitride workpiece having a fracture toughness of less than about 6 MPa·

  • m0.5, the abrasive article comprising;

    a body comprising abrasive particles contained within a bond material comprising a metal, wherein the body comprises a ratio of VAG/VBM of at least about 1.3, wherein VAG is a volume percent of abrasive particles within a total volume of the body and VBM is a volume percent of bond material within the total volume of the body,wherein the abrasive particles have an average particle size of about 1 to about 45 microns;

    wherein during a periphery insert grinding test operation of the abrasive article on at least one edge of the silicon nitride workpiece, the edge of the silicon nitride workpiece has a maximum chip size of less than about 0.0025 inches and the maximum chip size is at least 8% less than the maximum chip size achieved during a periphery insert grinding test operation of a conventional metal-bonded abrasive article on the at least one edge of the silicon nitride workpiece; and

    wherein the periphery insert grinding test operation is conducted at a rough feed rate of 2 inches/min and a finish feed rate of 1.0 inches/min with the abrasive article operating at 8500 SFPM and a cut depth of 0.025 inches.

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