Lead wire for solar cell, manufacturing method and storage method thereof, and solar cell
First Claim
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1. A solar cell lead wire, comprising:
- a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bondable to a solar cell using a flux,wherein a thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnO2 layer, is not more than 7 nm,said thickness predetermined as permitting an effect of breaking through the oxide film during a low temperature bonding process that is near a melting point of the molten solder plated layer and predetermined as sufficiently low in temperature to avoid a cracking of a substrate of the solar cell due to a thermal stress during said bonding process.
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Abstract
A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bonded by soldering to an electrode of a solar cell, using a flux. A thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnO2 layer on the surface of the molten solder plated layer, is not more than 7 nm.
21 Citations
1 Claim
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1. A solar cell lead wire, comprising:
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a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bondable to a solar cell using a flux, wherein a thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnO2 layer, is not more than 7 nm, said thickness predetermined as permitting an effect of breaking through the oxide film during a low temperature bonding process that is near a melting point of the molten solder plated layer and predetermined as sufficiently low in temperature to avoid a cracking of a substrate of the solar cell due to a thermal stress during said bonding process.
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Specification