Wafer inspection
First Claim
1. A system configured to inspect a wafer, comprising:
- an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas;
a scanning subsystem configured to scan the multiple illumination areas across the wafer;
a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors, wherein characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors, and wherein the two or more sensors generate output responsive to the scattered light;
an optical element configured to simultaneously and separately divide the light scattered from a first of the areas collected in different segments of a collection numerical aperture of the collection subsystem, wherein the two or more sensors are further configured to detect one of the different segments, and wherein the system further comprises another two or more sensors configured to detect another of the different segments;
wherein the optical element is further configured to simultaneously and separately divide the light scattered from a second of the areas collected in additional different segments of the collection numerical aperture, wherein the two or more sensors are further configured to detect one of the additional different segments, and wherein the other two or more sensors are further configured to detect another of the additional different segments; and
a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors and output of the other two or more sensors.
2 Assignments
0 Petitions
Accused Products
Abstract
Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas. The system also includes a scanning subsystem configured to scan the multiple illumination areas across the wafer. In addition, the system includes a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors. Characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors. The two or more sensors generate output responsive to the scattered light. The system further includes a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors.
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Citations
19 Claims
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1. A system configured to inspect a wafer, comprising:
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an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas; a scanning subsystem configured to scan the multiple illumination areas across the wafer; a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors, wherein characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors, and wherein the two or more sensors generate output responsive to the scattered light; an optical element configured to simultaneously and separately divide the light scattered from a first of the areas collected in different segments of a collection numerical aperture of the collection subsystem, wherein the two or more sensors are further configured to detect one of the different segments, and wherein the system further comprises another two or more sensors configured to detect another of the different segments; wherein the optical element is further configured to simultaneously and separately divide the light scattered from a second of the areas collected in additional different segments of the collection numerical aperture, wherein the two or more sensors are further configured to detect one of the additional different segments, and wherein the other two or more sensors are further configured to detect another of the additional different segments; and a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors and output of the other two or more sensors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A system configured to inspect a wafer, comprising:
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an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas, wherein the illumination subsystem is further configured to simultaneously form the multiple illumination areas using pulses of light; a scanning subsystem configured to scan the multiple illumination areas across the wafer; a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors, wherein the light scattered from each of the areas comprises pulses of scattered light, wherein characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors, and wherein the two or more sensors generate output responsive to the scattered light; a micro-electro-mechanical system-based optical switching device positioned between the collection subsystem and the two or more sensors; an additional two or more sensors, wherein the optical switching device is configured to direct a first set of the pulses of scattered light generated by a first set of the pulses of light to the two or more sensors and a second set of the pulses of scattered light generated by a second set of the pulses of light, subsequent to the first set of the pulses of light, to the additional two or more sensors; and a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors and the additional two or more sensors.
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19. A system configured to inspect a wafer, comprising:
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an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas, wherein the illumination subsystem is further configured to simultaneously form the multiple illumination areas using pulses of light; a scanning subsystem configured to scan the multiple illumination areas across the wafer; a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors, wherein the light scattered from each of the areas comprises pulses of scattered light, wherein characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors, and wherein the two or more sensors generate output responsive to the scattered light; a micro-electro-mechanical system-based optical switching device positioned between the collection subsystem and the two or more sensors, wherein the optical switching device is further configured to simultaneously and separately divide the pulses of scattered light from each of the areas collected in different segments of a collection numerical aperture of the collection subsystem, and wherein the optical switching device is further configured to direct only one of the different segments of a first set of the pulses of scattered light generated by a first set of the pulses of light to the two or more sensors and then to direct only another one of the different segments of a second set of the pulses of the scattered light generated by a second set of the pulses of light, subsequent to the first set of pulses of light, to the two or more sensors; and a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors.
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Specification