System and method for high resolution, high throughput processing of conductive patterns of flexible substrates
First Claim
1. An alignment feedback apparatus for aligning multiple substrate layers, the apparatus comprising:
- a. a first substrate layer having a first portion of an alignment target area formed on a surface, wherein the first portion of the alignment target area includes a first manual alignment marker and a first machine alignment marker, further wherein the first portion of the alignment target area further includes a registration coupon; and
b. a second substrate layer having a second portion of the alignment target area formed on a surface, the second substrate layer coupled to the first substrate layer, wherein the second portion of the alignment target area includes a second manual alignment marker and a second machine alignment marker,wherein when the first substrate layer and the second substrate layer are properly aligned with each other, the first manual alignment marker is aligned with the second manual alignment marker, and the first machine alignment marker is aligned with the second machine alignment marker.
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Abstract
Alignment markers are added to each layer of a multiple layer substrate for proper alignment. Optical alignment markers are applied on the surface of each substrate layer. Groups of alignment markers are arranged in localized areas on each substrate layer. Each localized group of alignment markers are referred to as alignment target areas. The alignment markers in a first alignment target area on the first substrate layer are to be aligned with corresponding alignment markers in a second alignment target area on the second substrate layer. In some embodiments, the first alignment target area includes an alignment marker configured for manual alignment and another alignment marker configured for machine alignment. The second alignment target area has a corresponding manual alignment marker and machine alignment marker.
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Citations
36 Claims
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1. An alignment feedback apparatus for aligning multiple substrate layers, the apparatus comprising:
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a. a first substrate layer having a first portion of an alignment target area formed on a surface, wherein the first portion of the alignment target area includes a first manual alignment marker and a first machine alignment marker, further wherein the first portion of the alignment target area further includes a registration coupon; and b. a second substrate layer having a second portion of the alignment target area formed on a surface, the second substrate layer coupled to the first substrate layer, wherein the second portion of the alignment target area includes a second manual alignment marker and a second machine alignment marker, wherein when the first substrate layer and the second substrate layer are properly aligned with each other, the first manual alignment marker is aligned with the second manual alignment marker, and the first machine alignment marker is aligned with the second machine alignment marker. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of aligning multiple substrate layers, the method comprising:
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a. forming a first substrate layer having a first portion of an alignment target area formed on a surface, wherein the first portion of the alignment target area includes a first manual alignment marker and a first machine alignment marker, further wherein the first portion of the alignment target area further includes a registration coupon; b. forming a second substrate layer having a second portion of the alignment target area formed on a surface, the second substrate layer coupled to the first substrate layer, wherein the second portion of the alignment target area includes a second manual alignment marker and a second machine alignment marker; and c. aligning the first substrate layer and the second substrate layer such that the first manual alignment marker is aligned with the second manual alignment marker, and the first machine alignment marker is aligned with the second machine alignment marker. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. An alignment feedback apparatus for aligning multiple substrate layers, the apparatus comprising:
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a. a first substrate layer having a first portion of an alignment target area formed on a surface, wherein the first portion of the alignment target area includes a first manual alignment marker and a first machine alignment marker; and b. a second substrate layer having a second portion of the alignment target area formed on a surface, the second substrate layer coupled to the first substrate layer, wherein the second portion of the alignment target area includes a second manual alignment marker and a second machine alignment marker, further wherein the second portion of the alignment target area further includes an etch coupon, wherein when the first substrate layer and the second substrate layer are properly aligned with each other, the first manual alignment marker is aligned with the second manual alignment marker, and the first machine alignment marker is aligned with the second machine alignment marker. - View Dependent Claims (23, 24, 25, 26, 27, 28)
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29. A method of aligning multiple substrate layers, the method comprising:
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a. forming a first substrate layer having a first portion of an alignment target area formed on a surface, wherein the first portion of the alignment target area includes a first manual alignment marker and a first machine alignment marker; b. forming a second substrate layer having a second portion of the alignment target area formed on a surface, the second substrate layer coupled to the first substrate layer, wherein the second portion of the alignment target area includes a second manual alignment marker and a second machine alignment marker, further wherein the second portion of the alignment target area further includes an etch coupon; and c. aligning the first substrate layer and the second substrate layer such that the first manual alignment marker is aligned with the second manual alignment marker, and the first machine alignment marker is aligned with the second machine alignment marker. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36)
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Specification