Method for forming normally closed micromechanical device comprising a laterally movable element

• US 9,284,183 B2
• Filed: 02/11/2013
• Issued: 03/15/2016
• Est. Priority Date: 03/04/2005
• Status: Expired due to Fees

• Current Assignee: HT Microanalytical, Inc. (Rosenberger Technology (Kunshan) Co., Ltd.)
• Original Assignee: HT Microanalytical, Inc. (Rosenberger Technology (Kunshan) Co., Ltd.)
• Inventors: Christenson, Todd Richard
• Primary Examiner(s): PHAN, THIEM D
• Application Number:
  US13/764,424
• Publication Number:
  US 20140048395A1
• Time in Patent Office: 1,128 Days
• Field of Search: 296/22, 294/28, 298/25, 298/46, 298/76, 257/254, 257/415, 333/101, 333/105, 333/133, 333/187, 333/189, 333/262
• US Class Current: 1/1
• CPC Class Codes: B81B 3/0054 For holding or placing an element in a given position
• CPC Class Codes: H01H 2001/0078 with parallel movement of the movable contact relative to the substrate
• CPC Class Codes: H01H 2050/007 Relays of the polarised type, e.g. the MEMS relay beam having a preferential magnetisation direction
• CPC Class Codes: H01H 50/005 using micromechanics
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

A micromechanical device and a method for forming the device is disclosed, wherein the micromechanical device has a laterally movable mechanically active element that has a quiescent position in which it is in physical contact with a second structural element. The device is fabricating by disposing the mechanically active element on a first substrate and disposing the second structural element on a second substrate. After the two substrates are aligned and joined such that both the mechanically active element and the second structural element are in contact and affixed to one of the substrates, the other substrate is removed leaving all structural elements disposed on a single substrate.

Claims

1. A method for forming a micromechanical device, the method comprising:

providing a first substrate that defines a first plane, the first substrate comprising a first base substrate and a first element, the first element having a first end that is operable to move along a first direction that is substantially parallel with the first plane;

providing a second substrate that defines a second plane, the second substrate comprising a second base substrate and a first contact structure;

bonding the first substrate and the second substrate such that (1) the first plane and second plane are substantially parallel, (2) the first end is in physical contact with the first contact structure, (3) motion of the first end along the first direction moves the first end out of physical contact with the first contact structure, and (4) the first element is operatively coupled with an actuator operable for moving the first end along the first direction; and

removing at least one of the first base substrate and the second base substrate.

2. The method of claim 1 wherein the first substrate and second substrate are bonded such that a strain is induced in the first element, the strain having a component along a direction substantially parallel with the first plane.

3. The method of claim 1 wherein the first substrate is provided such that the first end comprises a first material and has a first surface that is non-co-planar with the first plane, and wherein the method further comprises:

forming a first layer on the first surface, the first layer comprising a second material that is different than the first material.

4. The method of claim 1 wherein the first substrate is provided such that it further includes a first terminal that is in electrical communication with the first end, and wherein the second substrate is provided such that it further includes a second terminal that is in electrical communication with the first contact structure, and further wherein the first terminal and second terminal are in electrical communication when the first end and first contact structure are in physical contact and are not in electrical communication when the first end and first contact structure are not in physical contact.

5. The method of claim 1 wherein the first substrate and second substrate are bonded by operations comprising:

placing the first substrate and second substrate into physical contact such that the first end and the first contact structure are not in physical contact;

moving the first substrate and second substrate relative to one another with a first motion along a second direction to put a first feature disposed on the first substrate into physical contact with a second feature disposed on the second substrate, wherein physical contact between the first feature and second feature limits the first motion; and

moving the first substrate and second substrate relative to one another with a second motion along a third direction to put a third feature disposed on the first substrate into physical contact with a fourth feature disposed on the second substrate, wherein the second motion places the first end and the first contact structure into physical contact, and wherein physical contact between the third feature and fourth feature limits the second motion.

6. The method of claim 5 further comprising providing the third feature and the fourth feature such that they collectively define a latch that locks the relative position of the first substrate and second substrate along the first direction.

7. The method of claim 6 wherein the third feature and the fourth feature are provided such that the latch locks the relative position of the first substrate and second substrate in a plane substantially parallel with the first plane.

8. The method of claim 1 wherein the first substrate and second substrate are provided such that the actuator moves the first end along the first direction in response to the application of a first magnetic field.