Integrated circuit switches, design structure and methods of fabricating the same
First Claim
Patent Images
1. A method of manufacturing a structure, comprising:
- depositing a first sacrificial material directly on a contact electrode and a forcing electrode of a switching device;
forming the switching device on the first sacrificial material;
forming at least one tab on a side of the switching device, which is embedded in the first sacrificial material, wherein the at least one tab is formed by depositing additional sacrificial material over a dielectric layer in a separate deposition process from that of the depositing of the first sacrificial material directly on the contact electrode and the forcing electrode;
depositing a second sacrificial material in a separate deposition process from that of the deposition of the additional sacrificial material, and the second sacrificial material is deposited on the switching device, on a side of the at least one tab formed with the additional sacrificial material;
depositing a cap layer on the second sacrificial material over the switching device and the at least one tab formed with the additional sacrificial material;
stripping the first sacrificial material, the second sacrificial material and the at least one tab through at least one opening formed in the cap layer on the at least one tab which is on the side of the switching device; and
sealing the at least one opening with an additional layer.
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Abstract
Integrated MEMS switches, design structures and methods of fabricating such switches are provided. The method includes forming at least one tab of sacrificial material on a side of a switching device which is embedded in the sacrificial material. The method further includes stripping the sacrificial material through at least one opening formed on the at least one tab which is on the side of the switching device, and sealing the at least one opening with a capping material.
31 Citations
16 Claims
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1. A method of manufacturing a structure, comprising:
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depositing a first sacrificial material directly on a contact electrode and a forcing electrode of a switching device; forming the switching device on the first sacrificial material; forming at least one tab on a side of the switching device, which is embedded in the first sacrificial material, wherein the at least one tab is formed by depositing additional sacrificial material over a dielectric layer in a separate deposition process from that of the depositing of the first sacrificial material directly on the contact electrode and the forcing electrode; depositing a second sacrificial material in a separate deposition process from that of the deposition of the additional sacrificial material, and the second sacrificial material is deposited on the switching device, on a side of the at least one tab formed with the additional sacrificial material; depositing a cap layer on the second sacrificial material over the switching device and the at least one tab formed with the additional sacrificial material; stripping the first sacrificial material, the second sacrificial material and the at least one tab through at least one opening formed in the cap layer on the at least one tab which is on the side of the switching device; and sealing the at least one opening with an additional layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method in a computer-aided design system for generating a functional design model for manufacturing a physical MEMS structure, said method comprising:
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generating a functional representation of a first sacrificial material deposited directly on a contact electrode and a forcing electrode of a switching device; generating a functional representation of the switching device deposited on the first sacrificial material; generating a functional representation of at least one tab deposited on a side of the switching device, which is embedded in the first sacrificial material, wherein the at least one tab is formed by depositing additional sacrificial material only directly on a dielectric layer in a separate deposition process from that of a deposition process used to deposit the first sacrificial material directly on the contact electrode and the forcing electrode; generating a function representation of a second sacrificial material deposited in a separate deposition process from that of the deposition of the additional sacrificial material, and the second sacrificial material is deposited on the switching device, on a side of the at least one tab formed with the additional sacrificial material; generating a functional representation of the first sacrificial material, the second sacrificial material and the at least one tab stripped through at least one opening formed on the at least one tab which is on the side of the switching device; and generating a functional representation of the at least one opening sealed with a capping material deposited on the second sacrificial material over the switching device and the at least tab deposited with the additional sacrificial material. - View Dependent Claims (14, 15, 16)
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Specification