Auto-sequencing multi-directional inline processing method

• US 9,287,152 B2
• Filed: 05/20/2013
• Issued: 03/15/2016
• Est. Priority Date: 12/10/2009
• Status: Active Grant

• Current Assignee: KLA Corporation
• Original Assignee: Orbotech LT Solar LLC (KLA Corporation)
• Inventors: Blonigan, Wendell Thomas, Toshima, Masato, Law, Kam S., Berkstresser, David Eric, Kleinke, Steve, Stevens, Craig Lyle
• Primary Examiner(s): Myers, Glenn
• Application Number:
  US13/898,353
• Publication Number:
  US 20130294678A1
• Time in Patent Office: 1,030 Days
• US Class Current: 1/1
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: G06T 7/0004 Industrial image inspection
• CPC Class Codes: H01J 37/32733 Means for moving the material to be treated
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67739 into and out of processing chamber
• CPC Class Codes: H01L 21/67745 characterized by movements or sequence of movements of transfer devices
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: H01L 21/67754 horizontal transfer of a batch of workpieces
• CPC Class Codes: Y10T 29/49948 Multipart cooperating fastener [e.g., bolt and nut]

Abstract

A method for auto-sequencing of plasma processing system for concurrent processing of several substrates. The method autonomously sequence processing and move substrates in different directions as necessary. The method moves two substrate trays together into the processing chamber for substrate exchange, and remove the trays from the chamber one at a time. When needed, the method moves one tray into the processing chamber for removal of the susceptor without exposing the chamber to atmospheric environment.

Claims

1. A method for auto-sequencing operation of a dual-load processing system having a controller, wherein the processing system comprises a vacuum processing chamber that has two loading ports on two opposing sides of the vacuum processing chamber, and two loadlock chambers, each loadlock chamber coupled to one of the two ports via a vacuum valve, comprising:

when fresh substrates are introduced into either one of the loadlock chambers, initiating vacuum pumping thereby reducing pressure at that loadlock chamber;

when a desired vacuum level is achieved at either one of the loadlock chambers, sending a ready signal to the controller, indicating that loadlock chamber is ready for substrates exchange;

when processing is completed in the vacuum processing chamber, causing the controller to determine which loadlock chamber has first sent the ready signal and initiating substrates exchange with the loadlock chamber that has first sent the ready signal, indicated as a first ready loadlock, wherein the initiating substrates exchange is performed by unloading processed substrates into the first ready loadlock and loading fresh substrates from the first ready loadlock chamber.

2. The method of claim 1, wherein initiating substrates exchange comprises:

opening the vacuum valve corresponding to the loadlock chamber from which the ready signal has been received;

transporting the processed substrates from within the vacuum processing chamber out to the loadlock from which the ready signal has been received;

transporting the fresh substrates into the vacuum processing chamber.

3. The method of claim 1, further comprising maintaining top substrate hanger and a bottom substrate hanger, one above the other, inside each of the loadlock chamber.

4. The method of claim 3, wherein initiating substrates exchange comprises:

opening the vacuum valve corresponding to the first ready loadlock chamber from which the ready signal has been received;

transporting both the top substrate hanger and the bottom substrate hanger from the first ready loadlock chamber and into the vacuum processing chamber;

loading the processed substrates from the vacuum processing chamber onto the top substrate hanger and transporting that hanger from the vacuum processing chamber back to the first ready loadlock chamber; and

,

loading fresh substrates from the bottom substrate hanger into the vacuum processing chamber and then transporting the bottom hanger from the vacuum processing chamber back to the first ready loadlock chamber.

5. The method of claim 3, further comprising taking an image each time that one of the top substrate hanger and the bottom substrate hanger is in position to expose one line of substrates.

6. The method of claim 3, wherein hooks are affixed to one of the top substrate hanger and the bottom substrate hanger to thereby form hanger with hooks, and wherein the method further comprises:

transporting into the vacuum processing chamber the hanger with hooks, moving a susceptor positioned within the vacuum processing chamber into a removal position so as to engage the hooks, and transporting the hanger with hooks out to the loadlock chamber, to thereby remove the susceptor from the vacuum processing chamber without breaking vacuum inside the vacuum processing chamber.

7. The method of claim 3, wherein a susceptor is positioned inside the vacuum processing chamber and wherein one of the top substrate hanger and the bottom substrate hanger comprises a floating plate, and wherein the method further comprises:

transporting both the top substrate hanger and the bottom substrate hanger from the f ready loadlock chamber and into the vacuum processing chamber; and

,

moving the susceptor so as to lift the floating plate by the susceptor to thereby align the floating plate to the susceptor.

8. The method of claim 2, further comprising flipping the processed substrates.

9. The method of claim 3, wherein at any given time a processor maintains one of the top substrate hanger and the bottom substrate hanger with substrates and the other of the top substrate hanger and the bottom substrate hanger without substrates.

10. The method of claim 3, wherein one of the top substrate hanger and the bottom substrate hanger is transported to exclusively introduce fresh substrates into the vacuum processing chamber, while the other one of the top substrate hanger and the bottom substrate hanger is transported to exclusively remove processed substrates from the vacuum processing chamber.

11. The method of claim 1, further comprising taking an image of substrates inside the vacuum processing chamber and processing the image to determine whether any of the substrates are broken.

12. The method of claim 11, wherein the image is sent to a processor and the processor transposes the image from a camera view angle.

13. The method of claim 12, wherein the processor removes lens distortions and calibrates the image for constant size and orientation.

14. The method of claim 12, wherein the processor identifies expected substrate locations and detects whether substrates are present in the expected substrate locations.

15. The method of claim 1, further comprising taking an image of substrates inside the vacuum processing chamber before processing of the substrates has began, and processing the image to determine whether the substrates are properly seated on a susceptor.

16. The method of claim 1, wherein inside the processing system substrates are supported on hangers and a susceptor is positioned inside the vacuum processing chamber, the method further comprising moving the susceptor in a vertical motion and position the susceptor in three positions:

a lower position for hanger transfer, an intermediate position for substrates exchange, and an upper position for substrate processing.

17. The method of claim 1, wherein when processing is completed on the substrates delivered to the vacuum processing chamber from one of the two loadlock chambers, the substrates are removed via the other one of the two loadlock chambers and fresh substrates are loaded into the vacuum processing chamber from the other one of the two loadlock chambers.

18. The method of claim 1, wherein substrates exchange is alternated between the two loadlock chambers.