Light emitting device package and method of manufacturing the same

• US 9,287,466 B2
• Filed: 11/22/2013
• Issued: 03/15/2016
• Est. Priority Date: 07/25/2007
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Cho, Bum Chul, Park, Jin Soo
• Primary Examiner(s): Lam, Cathy N
• Application Number:
  US14/088,180
• Publication Number:
  US 20140077249A1
• Time in Patent Office: 844 Days
• Field of Search: 257/81, 257/95, 257/98, 257/99, 257/100, 257/117, 257/118
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device package is provided. The light emitting device package comprises a substrate comprising a plurality of protrusions, an insulating layer on the substrate, a metal layer on the insulating layer, and a light emitting device on the substrate electrically connected to the metal layer.

Claims

1. A light emitting device package, comprising:

a substrate with a recess, the substrate including a border portion disposed around the recess, and a base portion including a top surface forming a bottom of the recess, a bottom surface opposing the top surface of the base portion, and a side surface disposed between the top surface of the base portion and the bottom surface of the base portion, the top surface of the base portion being planar;

a metal layer on the top surface of the base portion including protrusions such that a top surface of the metal layer has roughness, the metal layer extended to the bottom surface of the base portion; and

a light emitting device on the metal layer on the top surface of the base portion,

wherein an end of the metal layer on the bottom surface of the base portion is disposed between the light emitting device and a top surface of the border portion of the substrate so as not to be disposed under the light emitting device.

2. The light emitting device package according to claim 1, wherein the border portion of the substrate includes an inner side surface toward the recess and an outer side surface, and

wherein the end of the metal layer on the bottom surface of the base portion is disposed between the light emitting device and the inner side surface of the border portion of the substrate.

3. The light emitting device package according to claim 2, wherein the metal layer on the top surface of the base portion is extended to the bottom surface of the base portion via the side surface of the base portion, and

wherein the metal layer on the side surface of the base portion is exposed outside.

4. The light emitting device package according to claim 2, wherein an entire portion of the metal layer located on the top surface of the base portion includes the protrusions.

5. The light emitting device package according to claim 2, wherein both the inner side surface of the border portion and the outer side surface of the border portion is inclined with reference to the top surface of the base portion.

6. The light emitting device package according to claim 5, wherein the metal layer on the top surface of the base portion is extended to the bottom surface of the base portion via the inner side surface of the border portion, the top surface of the border portion, and the outer side surface of the border portion, and

wherein the metal layer on the inner side surface of the border portion includes protrusions.

7. The light emitting device package according to claim 2, wherein a portion of the bottom surface of the base portion which the light emitting device is disposed under is exposed outside.

8. The light emitting device package according to claim 2, wherein the light emitting device is positioned at a center of the base portion.

9. The light emitting device package according to claim 2, further comprising a conductive metal layer disposed between the metal layer and the substrate.

10. The light emitting device package according to claim 9, wherein the metal layer comprises aluminum or silver.

11. The light emitting device package according to claim 9, wherein the conductive metal layer comprises copper.

12. The light emitting device package according to claim 2, further comprising a molding member filled in the recess.

13. The light emitting device package according to claim 12, wherein the molding member includes phosphors, and

wherein the molding member has a top surface having a concave shape.

14. The light emitting device package according to claim 1, further comprising an insulating layer disposed between the substrate and the metal layer.

15. The light emitting device package according to claim 14, wherein the substrate comprises silicon, and

wherein the insulating layer comprises silicon oxide.

16. The light emitting device package according to claim 14, wherein the insulating layer includes protrusions such that a top surface of the insulating layer has roughness.

17. The light emitting device package according to claim 15, wherein the protrusions of the insulating layer corresponds to the protrusions of the metal layer.

18. A lighting device, comprising:

a light emitting device package comprising

a substrate with a recess, the substrate including a border portion disposed around the recess, and a base portion including a top surface forming a bottom of the recess, a bottom surface opposing the top surface of the base portion, and a side surface disposed between the top surface of the base portion and the bottom surface of the base portion, the top surface of the base portion being planar;

a metal layer on the top surface of the base portion including protrusions such that a top surface of the metal layer has roughness, the metal layer extended to the bottom surface of the base portion; and

a light emitting device on the metal layer on the top surface of the base portion,

wherein an end of the metal layer on the bottom surface of the base portion is disposed between the light emitting device and a top surface of the border portion of the substrate so as not to be disposed under the light emitting device,

wherein the border portion of the substrate includes an inner side surface toward the recess and an outer side surface, and

wherein the end of the metal layer on the bottom surface of the base portion is disposed between the light emitting device and the inner side surface of the border portion of the substrate.

19. The lighting device according to claim 18, further comprising a molding member filled in the recess,

wherein the molding member includes phosphors, and

wherein the molding member has a top surface in a concave shape.

20. The lighting device according to claim 19, wherein the metal layer on the top surface of the base portion is extended to the bottom surface of the base portion via the side surface of the base portion,

wherein the metal layer on the side surface of the base portion is exposed outside, and

wherein an entire portion of the metal layer located on the top surface of the base portion includes the protrusions.