Optoelectronic packages having magnetic field cancelation

• US 9,293,422 B1
• Filed: 04/28/2015
• Issued: 03/22/2016
• Est. Priority Date: 09/26/2014
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: French, William, Parsa, Roozbeh
• Primary Examiner(s): Blum, David S
• Application Number:
  US14/697,792
• Publication Number:
  US 20160093575A1
• Time in Patent Office: 329 Days
• Field of Search: 257/675, 438/24
• US Class Current: 1/1
• CPC Class Codes: G01R 33/26 using optical pumping
• CPC Class Codes: G04F 5/14 using atomic clocks
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05669 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/17181 On opposite sides of the body
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/345 Arrangements for heating thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 31/02005 : for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/02327 : the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 31/024 : Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: H01L 31/109 : the potential barrier being of the PN heterojunction type
• CPC Class Codes: H01L 31/167 : the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H01L 31/18 : Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H01S 5/005 : Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping H01S5/026, H01S5/18388 take precedence
• CPC Class Codes: H01S 5/02208 : characterised by the shape of the housings
• CPC Class Codes: H01S 5/02325 : Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/02326 : Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
• CPC Class Codes: H01S 5/02345 : Wire-bonding
• CPC Class Codes: H01S 5/02453 : Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment H01S5/0612 takes precedence, for monolithically integrated heaters see also H01S5/0261
• CPC Class Codes: H01S 5/0683 : by monitoring the optical output parameters
• CPC Class Codes: H01S 5/183 : having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Abstract

A stacked optoelectronic packaged device includes a bottom die having a top surface including bottom electrical traces and a light source die coupled to ≧1 bottom electrical traces. A first cavity die is on the bottom die. An optics die is on the first cavity die and a second cavity die on the optics die. A mounting substrate is on the second cavity die including top electrical traces. A photodetector die is optically coupled to receive light from the light source. The bottom and top electrical traces are both positioned substantially symmetrically on sides of a mirror plane so that when conducting equal and opposite currents a first magnetic field emanating from the first side and a second magnetic field emanating from the second side cancel one another to provide a reduction in magnetic flux density by more than 50% at one or more die locations on the optics die.

Claims

1. A stacked optoelectronic packaged device (packaged device), comprising:

a plurality of stacked components within a package comprising a package material having a package body providing side walls and a bottom wall for said package, and a lid for sealing a top of said package, said plurality of stacked components including;

a bottom die on said bottom wall having a top surface including a plurality of bottom electrical traces and a light source die for emitting light coupled to at least one of said plurality of bottom electrical traces;

a first cavity die having a top surface and a bottom surface on said top surface of said bottom die;

at least one optics die on said top surface of said first cavity die;

a second cavity die on said optics die;

a second mounting substrate on said second cavity die having a top surface including a plurality of top electrical traces, and

a photodetector (PD) die optically coupled to receive said light originating from said light source die,

wherein said plurality of bottom electrical traces and said plurality of top electrical traces are both positioned substantially symmetrically on a first side and a second side of a bottom mirror plane and a top mirror plane, respectively, so that when conducting equal and opposite currents a first magnetic field emanating from said first side and a second magnetic field emanating from said second side cancel one another to provide a reduction in magnetic flux density by more than 50% at one or more die locations on said optics die.

2. The packaged device of claim 1, wherein said plurality of bottom electrical traces provide mirror images about said bottom mirror plane and said plurality of top electrical traces provide mirror images about said top mirror plane.

3. The packaged device of claim 1, wherein said optics die comprises a polarizer.

4. The packaged device of claim 1, wherein said plurality of bottom electrical traces provide a first heater trace and a separate first driver trace on said first side and a second driver trace and a separate second heater trace on said second side.

5. The packaged device of claim 4, further comprising a first bond wire shorting said first heater trace to a first one of said plurality of top electrical traces on said first side and a second bond wire shorting said second heater trace to a second one of said plurality of top electrical traces on said second side.

6. The packaged device of claim 1, wherein said first cavity die comprises glass.

7. The packaged device of claim 1, wherein said first cavity die comprises silicon.

8. The packaged device of claim 1, wherein said PD die is mounted on a base portion of an inner package that is inside said package, wherein said inner package has an open top opposite said base portion that faces said bottom wall of said package.

9. A method, comprising:

providing a stacked optoelectronic packaged device (packaged device) including a plurality of stacked components including a bottom die on a bottom wall having a top surface including a plurality of bottom electrical traces and a light source die for emitting light coupled to at least one of said plurality of bottom electrical traces, a first cavity die having a top surface and a bottom surface on said top surface of said bottom die, an optics die on said top surface of said first cavity die, a second cavity die on said optics die, a second mounting substrate on said second cavity die having a top surface including a plurality of top electrical traces, and a photodetector (PD) die optically coupled to receive said light originating from said light source die, wherein said plurality of bottom electrical traces and said plurality of top electrical traces are both positioned substantially symmetrically on a first side and a second side of a bottom mirror plane and a top mirror plane, respectively, and

oppositely biasing said plurality of bottom electrical traces to conduct respective currents on said first and said second sides flowing in opposite directions and oppositely biasing said plurality of top electrical traces on said first side and said second side to conduct said respective currents flowing in opposite directions,

wherein a first magnetic field emanating from said first side and a second magnetic field emanating from said second side for both said plurality of bottom electrical traces and said plurality of top electrical traces cancel one another at one or more die locations on said optics die to provide a reduction in magnetic flux density by more than 50% at said die location.

10. The method of claim 9, wherein said plurality of bottom electrical traces provide mirror images about said bottom mirror plane and said plurality of top electrical traces provide mirror images about said top mirror plane.

11. The method of claim 9, wherein said optics die comprises a polarizer.

12. The method of claim 9, wherein said plurality of bottom electrical traces provide a first heater trace and a separate first driver trace on said first side and a second driver trace and a separate second heater trace on said second side, and wherein said first heater trace is shorted to a first one of said plurality of top electrical traces on said first side and said second heater trace is shorted to a second one of said plurality of top electrical traces on said second side.

13. The method of claim 12, wherein said oppositely biasing comprises applying a DC signal and an RF signal on top of said DC signal applied to said first heater trace and said first one of said plurality of top electrical traces with respect to said second heater trace and said second one of said plurality of top electrical traces, and a separate bias signal applied between said first driver trace and said second driver trace.

14. The method of claim 9, wherein said PD die is mounted on a base portion of an inner package that is inside said packaged device, said inner package having an open top opposite said base portion that faces said bottom wall of said package.