Semiconductor device and method for manufacturing semiconductor device

• US 9,293,589 B2
• Filed: 01/22/2013
• Issued: 03/22/2016
• Est. Priority Date: 01/25/2012
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Koezuka, Junichi, Okazaki, Kenichi, Ikeyama, Terumasa, Tochibayashi, Katsuaki
• Primary Examiner(s): Moore, Whitney T
• Assistant Examiner(s): GALVIN III, JOSEPH M
• Application Number:
  US13/746,751
• Publication Number:
  US 20130187153A1
• Time in Patent Office: 1,155 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/385 using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
• CPC Class Codes: H01L 29/045 by their particular orientation of crystalline planes
• CPC Class Codes: H01L 29/4908 for thin film semiconductor, e.g. gate of TFT
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/78606 with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device H01L29/78642, H01L29/78645 take precedence
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

A highly reliable semiconductor device including a transistor using an oxide semiconductor is provided. In a semiconductor device including a bottom-gate transistor including an oxide semiconductor layer, a first insulating layer is formed in contact with the oxide semiconductor layer, and an oxygen doping treatment is performed thereon, whereby the first insulating layer is made to contain oxygen in excess of the stoichiometric composition. The formation of the second insulating layer over the first insulating layer enables excess oxygen included in the first insulating layer to be supplied efficiently to the oxide semiconductor layer. Accordingly, the highly reliable semiconductor device with stable electric characteristics can be provided.

Claims

1. A method for manufacturing a semiconductor device, comprising the steps of:

forming a gate electrode;

forming a gate insulating layer over the gate electrode;

forming an oxide semiconductor layer over the gate insulating layer, the oxide semiconductor layer overlapping with the gate electrode;

forming a source electrode and a drain electrode over the oxide semiconductor layer;

forming a first insulating layer over the source electrode and the drain electrode under a condition with a first gas flow rate, a first pressure, a first RF power, and first substrate temperature, the first insulating layer being in contact with part of the oxide semiconductor layer;

introducing oxygen into the first insulating layer by a plasma treatment under oxygen atmosphere; and

forming a second insulating layer over the first insulating layer under a condition with a second gas flow rate, a second pressure, a second RF power, and second substrate temperature,

wherein a thickness of the first insulating layer is more than 10 nm and less than 100 nm,

wherein the second insulating layer is thicker than the first insulating layer,

wherein the first gas flow rate is smaller than the second gas flow rate,

wherein the first pressure is smaller than the second pressure,

wherein the first RF power is smaller than the second RF power, and

wherein the first substrate temperature is higher than the second substrate temperature.

2. The method for manufacturing a semiconductor device according to claim 1, further comprising the step of removing impurities of the part of the oxide semiconductor layer after forming the source electrode and the drain electrode.

3. The method for manufacturing a semiconductor device according to claim 1,

further comprising the step of forming a third insulating layer over the second insulating layer by forming a metal layer over the second insulating layer and performing an oxygen doping treatment thereon.

4. The method for manufacturing a semiconductor device according to claim 3, wherein the third insulating layer comprises aluminum oxide.

5. The method for manufacturing a semiconductor device according to claim 3, wherein the third insulating layer has a resistivity less than or equal to 1×

10¹⁹ Ω

·

m.

10. The method for manufacturing a semiconductor device according to claim 1, further comprising the step of forming a planarization insulating layer over the second insulating layer.

11. The method for manufacturing a semiconductor device according to claim 10, further comprising the step of forming a conductive layer over the planarization insulating layer.

12. The method for manufacturing a semiconductor device according to claim 11, wherein the conductive layer is electrically connected to a photodiode.

16. The method for manufacturing a semiconductor device according to claim 1, further comprising the step of performing heat treatment to the oxide semiconductor layer before forming the source electrode and the drain electrode.

6. A method for manufacturing a semiconductor device, comprising the steps of:

forming a gate electrode;

forming a gate insulating layer over the gate electrode;

forming an oxide semiconductor layer over the gate insulating layer, the oxide semiconductor layer overlapping with the gate electrode;

forming a source electrode and a drain electrode over the oxide semiconductor layer;

forming a first insulating layer over the source electrode and the drain electrode, the first insulating layer being in contact with part of the oxide semiconductor layer;

introducing oxygen into the first insulating layer by a plasma treatment under oxygen atmosphere; and

forming a second insulating layer over the first insulating layer,

wherein a thickness of the first insulating layer is more than 10 nm and less than 100 nm,

wherein a thickness of the second insulating layer is more than 3 nm and less than 10 nm, and

wherein the second insulating layer is a metal oxide layer formed by forming a metal layer over the first insulating layer and performing an oxygen doping treatment thereon.

7. The method for manufacturing a semiconductor device according to claim 6, further comprising the step of removing impurities of the part of the oxide semiconductor layer after forming the source electrode and the drain electrode.

8. The method for manufacturing a semiconductor device according to claim 6, wherein the second insulating layer comprises aluminum oxide.

9. The method for manufacturing a semiconductor device according to claim 6, wherein the second insulating layer has a resistivity less than or equal to 1×

10¹⁹ Ω

·

m.

13. The method for manufacturing a semiconductor device according to claim 6, further comprising the step of forming a planarization insulating layer over the second insulating layer.

14. The method for manufacturing a semiconductor device according to claim 13, further comprising the step of forming a conductive layer over the planarization insulating layer.

15. The method for manufacturing a semiconductor device according to claim 14, wherein the conductive layer is electrically connected to a photodiode.

17. The method for manufacturing a semiconductor device according to claim 6, further comprising the step of performing heat treatment to the oxide semiconductor layer before forming the source electrode and the drain electrode.

18. A method for manufacturing a semiconductor device, comprising the steps of:

forming a gate electrode;

forming a gate insulating layer over the gate electrode;

forming an oxide semiconductor layer over the gate insulating layer, the oxide semiconductor layer overlapping with the gate electrode;

forming a source electrode and a drain electrode over the oxide semiconductor layer;

performing dinitrogen monoxide plasma treatment to the oxide semiconductor layer after forming the source electrode and the drain electrode;

forming a first insulating layer over the source electrode and the drain electrode under a condition with a first gas flow rate, a first RF power, and first substrate temperature, the first insulating layer being in contact with part of the oxide semiconductor layer; and

forming a second insulating layer over the first insulating layer under a condition with a second gas flow rate, a second RF power, and second substrate temperature,

wherein a thickness of the first insulating layer is more than 10 nm and less than 100 nm,

wherein the second insulating layer is thicker than the first insulating layer,

wherein the first gas flow rate is smaller than the second gas flow rate,

wherein the first RF power is smaller than the second RF power, and

wherein the first substrate temperature is higher than the second substrate temperature.

19. The method for manufacturing a semiconductor device according to claim 18,

further comprising the step of forming a third insulating layer over the second insulating layer by forming a metal layer over the second insulating layer and performing an oxygen doping treatment thereon.

20. The method for manufacturing a semiconductor device according to claim 19, wherein the third insulating layer comprises aluminum oxide.

21. The method for manufacturing a semiconductor device according to claim 19, wherein the third insulating layer has a resistivity less than or equal to 1×

10¹⁹ Ω

•

m.

22. The method for manufacturing a semiconductor device according to claim 18, further comprising the step of forming a planarization insulating layer over the second insulating layer.

23. The method for manufacturing a semiconductor device according to claim 22, further comprising the step of forming a conductive layer over the planarization insulating layer.

24. The method for manufacturing a semiconductor device according to claim 23, wherein the conductive layer is electrically connected to a photodiode.

25. The method for manufacturing a semiconductor device according to claim 18, further comprising the step of performing heat treatment to the oxide semiconductor layer before forming the source electrode and the drain electrode.