Light emitting diode for surface mount technology, method of manufacturing the same, and method of manufacturing light emitting diode module
First Claim
1. A light emitting diode (LED) comprising:
- a substrate;
a first semiconductor layer formed over the substrate and having a first conductivity type;
an active layer formed over the first semiconductor layer and configured to generate light;
a second semiconductor layer formed over the active layer and having a second conductivity type;
a protective insulating layer formed as multiple portions over at least the second semiconductor layer with the multiple portions spaced apart from each other; and
a reflection pattern formed between the multiple portions of the protective insulating layer, the reflection pattern configured to reflect light generated in the active layer, the reflection pattern including a conductive barrier layer contacting the protective insulating layer and extending over the second semiconductor layer, wherein the reflection pattern configured to reflect light generated in the active layer comprises a reflective metal layer formed between the second semiconductor layer and the conductive layer, wherein the conductive barrier layer contacts at least side surfaces of the reflective metal layer.
1 Assignment
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Accused Products
Abstract
Provided are a light emitting diode (LED) in which a conductive barrier layer surrounding a reflective metal layer is defined by a protective insulating layer, and a method of manufacturing the same. A reflection pattern including a reflective metal layer and a conductive barrier layer is formed on an emission structure in which a first semiconductor layer, an active layer, and a second semiconductor layer are formed. The conductive barrier layer prevents diffusion of a reflective metal layer and extends to a protective insulating layer recessed under a photoresist pattern having an overhang structure during a forming process. Accordingly, a phenomenon where the conductive barrier layer is in contact with sidewalls of the photoresist pattern having an over-hang structure and the reflective metal layer forms points is prevented. Thus, LED modules having various shapes may be manufactured.
18 Citations
19 Claims
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1. A light emitting diode (LED) comprising:
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a substrate; a first semiconductor layer formed over the substrate and having a first conductivity type; an active layer formed over the first semiconductor layer and configured to generate light; a second semiconductor layer formed over the active layer and having a second conductivity type; a protective insulating layer formed as multiple portions over at least the second semiconductor layer with the multiple portions spaced apart from each other; and a reflection pattern formed between the multiple portions of the protective insulating layer, the reflection pattern configured to reflect light generated in the active layer, the reflection pattern including a conductive barrier layer contacting the protective insulating layer and extending over the second semiconductor layer, wherein the reflection pattern configured to reflect light generated in the active layer comprises a reflective metal layer formed between the second semiconductor layer and the conductive layer, wherein the conductive barrier layer contacts at least side surfaces of the reflective metal layer. - View Dependent Claims (2, 3)
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4. A light emitting diode (LED) comprising:
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a substrate; a first semiconductor layer formed over the substrate and having a first conductivity type; an active layer formed over the first semiconductor layer and configured to generate light; a second semiconductor layer formed over the active layer and having a second conductivity type; a protective insulating layer formed as multiple portions over at least the second semiconductor layer with the multiple portions spaced apart from each other; and a reflection pattern formed between the multiple portions of the protective insulating layer, the reflection pattern configured to reflect light generated in the active layer, the reflection pattern including a conductive barrier layer contacting the protective insulating layer and extending over the second semiconductor layer, wherein at least a portion of the reflection pattern is inclined at an angle of about 5°
to about 45°
with respect to a surface of the second semiconductor layer.
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5. A light emitting diode (LED) comprising:
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a substrate; a first semiconductor layer formed over the substrate and having a first conductivity type; an active layer formed over the first semiconductor layer and configured to generate light; a second semiconductor layer formed over the active layer and having a second conductivity type; a protective insulating layer formed as multiple portions over at least the second semiconductor layer with the multiple portions spaced apart from each other; and a reflection pattern formed between the multiple portions of the protective insulating layer, the reflection pattern configured to reflect light generated in the active layer, the reflection pattern including a conductive barrier layer contacting the protective insulating layer and extending over the second semiconductor layer, wherein a thickness of the conductive barrier layer formed over the reflection pattern is greater than a thickness of the conductive barrier layer formed on the second semiconductor layer, and the thickness of the conductive barrier layer formed on the second semiconductor layer is greater than a thickness of the conductive barrier layer formed on a side of the reflection pattern.
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6. A light emitting diode (LED) comprising:
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a substrate; a first semiconductor layer formed over the substrate and having a first conductivity type; an active layer formed over the first semiconductor layer and configured to generate light; a second semiconductor layer formed over the active layer and having a second conductivity type; a protective insulating layer formed as multiple portions over at least the second semiconductor layer with the multiple portions spaced apart from each other; and a reflection pattern formed between the multiple portions of the protective insulating layer, the reflection pattern configured to reflect light generated in the active layer, the reflection pattern including a conductive barrier layer contacting the protective insulating layer and extending over the second semiconductor layer, wherein the protective insulating layer extends to a surface of the first semiconductor layer.
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7. A light emitting diode (LED) comprising:
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a substrate; a first semiconductor layer formed over the substrate and having a first conductivity type; an active layer formed over the first semiconductor layer and configured to generate light; a second semiconductor layer formed over the active layer and having a second conductivity type; a protective insulating layer formed as multiple portions over at least the second semiconductor layer with the multiple portions spaced apart from each other; and a reflection pattern formed between the multiple portions of the protective insulating layer, the reflection pattern configured to reflect light generated in the active layer, the reflection pattern including a conductive barrier layer contacting the protective insulating layer and extending over the second semiconductor layer, wherein the conductive barrier layer covers at least a part of the reflection pattern.
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8. A light emitting diode (LED) comprising:
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a substrate; a first semiconductor layer formed over the substrate and having a first conductivity type; an active layer formed over the first semiconductor layer and configured to generate light; a second semiconductor layer formed over the active layer and having a second conductivity type; a protective insulating layer formed as multiple portions over at least the second semiconductor layer with the multiple portions spaced apart from each other; and a reflection pattern formed between the multiple portions of the protective insulating layer, the reflection pattern configured to reflect light generated in the active layer, the reflection pattern including a conductive barrier layer contacting the protective insulating layer and extending over the second semiconductor layer, wherein the conductive barrier layer further extends to each protective insulating layer portion such that the conductive barrier layer contacts with a sidewall of each protective insulating layer portion.
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9. A light emitting diode (LED) comprising:
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a substrate; a first semiconductor layer formed over the substrate and having a first conductivity type; an active layer formed over the first semiconductor layer and configured to generate light; a second semiconductor layer formed over the active layer and having a second conductivity type; a protective insulating layer formed as multiple portions over at least the second semiconductor layer with the multiple portions spaced apart from each other; and a reflection pattern formed between the multiple portions of the protective insulating layer, the reflection pattern configured to reflect light generated in the active layer, the reflection pattern including a conductive barrier layer contacting the protective insulating layer and extending over the second semiconductor layer; and an insulating material formed over and in contact with at least a portion of the first semiconductor layer, the second semiconductor layer, the protective insulating layer, and the reflective pattern, wherein the insulating material and the protective insulating layer function together as a combined insulating layer. - View Dependent Claims (10)
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11. A method of manufacturing a light emitting diode (LED), comprising:
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forming a stacked structure including a first semiconductor layer, an active layer, a second semiconductor layer, and a protective insulating layer over a substrate; etching a part of the stacked structure and forming mesa regions to be spaced apart from each other, each mesa region exposing at least a portion of a surface of the first semiconductor layer; forming photoresist patterns on the mesa regions, each photoresist pattern having an overhang structure; etching the protective insulating layer exposed by the photoresist patterns to expose a part of the second semiconductor layer, the protective insulating layer remaining in a recessed region under the photoresist patterns; forming a reflective metal layer over the exposed part of the second semi-conductor layer; and forming a conductive barrier layer over the reflective metal layer, the conductive barrier layer extending to the protective insulating layer. - View Dependent Claims (12, 13, 14)
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15. A method of manufacturing a light emitting diode (LED), comprising:
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forming a first semiconductor layer, an active layer, and a second semiconductor layer over a substrate; etching the second semiconductor layer and the active layer and forming mesa regions to be spaced apart from each other, each mesa region exposing a surface of the first semiconductor layer; forming a protective insulating layer over the mesa regions and the second semiconductor layer; forming photoresist patterns on the mesa regions, each photoresist pattern having an overhang structure; etching the protective insulating layer exposed through the photoresist patterns to expose a part of the second semiconductor layer and remain in a recessed region under the photoresist patterns; forming a reflective metal layer over the exposed part of the second semi-conductor layer; and forming a conductive barrier layer over the reflective metal layer, the conductive barrier layer configured to contact with the protective insulating layer without being attached to a sidewall of each photoresist pattern.
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16. A method of manufacturing a light emitting diode (LED) module, comprising:
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fabricating a stacked structure including a first semiconductor layer, an active layer, a second semiconductor layer, and a reflective pattern, wherein the reflective pattern includes a reflective metal layer and a conductive barrier layer, the conductive barrier layer surrounding at least a part of the reflective metal layer and shaped to continuously extend over the second semiconductor layer; forming a first insulating layer over the stacked structure to expose the reflection pattern and the first semiconductor layer; forming a conductive reflection layer and a reflective barrier layer over the first insulating layer to expose the reflection pattern, the reflective barrier layer electrically connected to the first semiconductor layer through the conductive reflection layer; forming a second insulating layer over the reflective barrier layer to expose the reflection pattern and the reflective barrier layer electrically connected to the first semiconductor layer; and forming a first pad over the reflective barrier layer and a second pad over the reflection pattern. - View Dependent Claims (17, 18, 19)
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Specification