Method for manufacturing an electro-optical device
First Claim
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1. A light emitting device comprising:
- a wiring layer and a transistor over a substrate;
a first insulating layer over the wiring line and the transistor, the first insulating layer comprising an organic material and having an opening overlapping the wiring layer;
a first electrode layer over the first insulating layer, the first electrode layer electrically connected to one of source and drain electrode layers of the transistor;
a second insulating layer covering an edge of the first electrode layer, the second insulating layer comprising an organic material;
a light emitting layer over and in contact with the first electrode layer;
a second electrode layer over the light emitting layer and a top surface of the second insulating layer; and
a third insulating layer over the second electrode layer, the third insulating layer comprising silicon, nitrogen and oxygen,wherein an edge of the light emitting layer is located inside an edge of the second insulating layer,wherein an edge of the second electrode is located inside an edge of the third insulating layer,wherein the wiring layer and the source and drain electrode layers are provided on the same surface, andwherein the wiring line extends towards an edge of the substrate to provide a portion to be electrically connected to a flexible printed circuit.
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Abstract
An object of the present invention is to provide an EL display device having high operation performance and reliability.
A third passivation film 45 is disposed under the EL element 203 comprising a pixel electrode (anode) 46, an EL layer 47 and a cathode 48, and diffusion of alkali metals from the EL element 203 formed by inkjet method into TFTs is prevented. Further, the third passivation film 45 prevents penetration of moisture and oxygen from the TFTs, and suppress degradation of the EL element 203 by dispersing the heat generated by the EL element 203.
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Citations
20 Claims
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1. A light emitting device comprising:
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a wiring layer and a transistor over a substrate; a first insulating layer over the wiring line and the transistor, the first insulating layer comprising an organic material and having an opening overlapping the wiring layer; a first electrode layer over the first insulating layer, the first electrode layer electrically connected to one of source and drain electrode layers of the transistor; a second insulating layer covering an edge of the first electrode layer, the second insulating layer comprising an organic material; a light emitting layer over and in contact with the first electrode layer; a second electrode layer over the light emitting layer and a top surface of the second insulating layer; and a third insulating layer over the second electrode layer, the third insulating layer comprising silicon, nitrogen and oxygen, wherein an edge of the light emitting layer is located inside an edge of the second insulating layer, wherein an edge of the second electrode is located inside an edge of the third insulating layer, wherein the wiring layer and the source and drain electrode layers are provided on the same surface, and wherein the wiring line extends towards an edge of the substrate to provide a portion to be electrically connected to a flexible printed circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A light emitting device comprising:
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a wiring layer and a transistor over a substrate, the transistor comprising a channel formation region in a polycrystalline silicon film and a gate electrode layer over the channel formation region with a gate insulating layer provided therebetween; a first insulating layer over the wiring line and the transistor, the first insulating layer comprising an organic material and having an opening overlapping the wiring layer; a first electrode layer over the first insulating layer, the first electrode layer electrically connected to one of source and drain electrode layers of the transistor; a second insulating layer covering an edge of the first electrode layer, the second insulating layer comprising an organic material; a light emitting layer over and in contact with the first electrode layer; a second electrode layer over the light emitting layer and a top surface of the second insulating layer; and a third insulating layer over the second electrode layer, the third insulating layer comprising silicon, nitrogen and oxygen, wherein an edge of the light emitting layer is located inside an edge of the second insulating layer, wherein an edge of the second electrode is located inside an edge of the third insulating layer, wherein the wiring layer and the source and drain electrode layers are provided on the same surface, and wherein the wiring line extends towards an edge of the substrate to provide a portion to be electrically connected to a flexible printed circuit. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification