Apparatus and method for reduced strain on MEMS devices

• US 9,296,607 B2
• Filed: 04/03/2014
• Issued: 03/29/2016
• Est. Priority Date: 07/22/2013
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Minervini, Anthony D.
• Primary Examiner(s): HA, NATHAN W
• Application Number:
  US14/244,255
• Publication Number:
  US 20150021718A1
• Time in Patent Office: 726 Days
• Field of Search: 257/415
• US Class Current: 1/1
• CPC Class Codes: B81B 3/0078 Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
• CPC Class Codes: B81B 7/0016 Protection against shocks or vibrations, e.g. vibration damping
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: B81C 1/00626 Processes for achieving a desired geometry not provided for in groups B81C1/00563 - B81C1/00619
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A method and apparatus for coupling a MEMS device to a substrate is disclosed. The method includes providing a substrate with a conductor disposed over the substrate, adhering the MEMS device to the substrate, wherein a first elastomer adheres the MEMS device to the substrate. The MEMS device is electrically connected to the conductor using a wire bond.

Claims

1. A device, comprising:

a substrate with a conductor disposed over the substrate; and

a MEMS device adhered to the substrate, through a second elastomer,

wherein the second elastomer has an uncured phase and a cured phase and the MEMS device is disposed over the first elastomer after the second elastomer has switched from the uncured phase to the cured phase; and

a first elastomer adheres the MEMS device to the substrate, wherein a wire bond electrically connects the MEMS device to the conductor.

2. The device of claim 1, wherein the second elastomer is adhered to the substrate and the MEMS device is configured to rest on the second elastomer.

3. The device of claim 1, wherein the first elastomer has an uncured phase and a cured phase and the MEMS device is disposed over the first elastomer when the first elastomer is in the uncured phase.

4. The device of claim 2, wherein a thickness of the conductor defines a bond line thickness and a thickness of the second elastomer is substantially equal to the bond line thickness.

5. The device of claim 1, wherein the first elastomer is configured to selectively yield so as to permit the MEMS device to selectively rest over a surface of the conductor.

6. The device of claim 1, wherein the first elastomer has an uncured phase and a cured phase and the MEMS device is disposed over the first elastomer before the first elastomer has switched to the cured phase, so as to adhere the MEMS device to the first elastomer when the first elastomer has switched to the cured phase.

7. The device of claim 1, wherein the substrate is provided with an aperture, the MEMS device is disposed in the aperture, the first elastomer disposed between the MEMS device and the substrate to adhere the MEMS device to the substrate.

8. The device of claim 7, wherein the first elastomer is disposed after the wire bond electrically connects the MEMS device to the conductor.

9. The device of claim 7, wherein the first elastomer substantially encapsulates the MEMS device.

10. The device of claim 1, wherein the second elastomer has a Young'"'"'s Modulus of about 0.5 megapascal to about 5 megapascal in the cured phase.

11. The device of claim 3, wherein the first elastomer has a Young'"'"'s Modulus of about 0.5 megapascal to about 5 megapascal in a cured phase.

12. The device of claim 6, wherein the first elastomer has a Young'"'"'s Modulus of about 0.5 megapascal to about 5 megapascal in the cured phase.

13. A device, comprising:

a substrate with a conductor disposed over the substrate;

a MEMS device adhered to the substrate, wherein a first elastomer adheres the MEMS device to the substrate through a second elastomer,

wherein the second elastomer is disposed over the substrate, the second elastomer configured to adhere to the substrate,

wherein the first elastomer is disposed over the second elastomer, the first elastomer configured to adhere to the second elastomer; and

wherein the second elastomer has an uncured phase and a cured phase, and the first elastomer is disposed over the second elastomer, after the second elastomer has switched to the cured phase.

14. The device of claim 13, wherein the first elastomer has an uncured phase and a cured phase and the MEMS device is disposed over the first elastomer before the first elastomer has switched to the cured phase, so as to adhere the MEMS device to the first elastomer when the first elastomer has switched to the cured phase.

15. The device of claim 13, wherein a thickness of the conductor defines a bond line thickness and a thickness of the second elastomer is substantially equal to the bond line thickness.

16. The device of claim 13, wherein the substrate is provided with an aperture and the second elastomer is disposed in the aperture.

17. The device of claim 16, wherein the first elastomer has an uncured phase and a cured phase and the MEMS device is disposed over the first elastomer before the first elastomer has switched to the cured phase, so as to adhere the MEMS device to the first elastomer when the first elastomer has switched to the cured phase.

18. The device of claim 16, wherein a thickness of the substrate defines a substrate thickness and a thickness of the second elastomer is substantially equal to the substrate thickness.

19. The device of claim 13, wherein the second elastomer has a Young'"'"'s Modulus of about 0.5 megapascal to about 5 megapascal in the cured phase.

20. The device of claim 14, wherein the first elastomer has a Young'"'"'s Modulus of about 0.5 megapascal to about 5 megapascal in the cured phase.

21. The device of claim 17, wherein the first elastomer has a Young'"'"'s Modulus of about 0.5 megapascal to about 5 megapascal in the cured phase.