Casing covered by silicone rubber and electronic device using same

• US 9,298,215 B2
• Filed: 12/19/2013
• Issued: 03/29/2016
• Est. Priority Date: 09/22/2013
• Status: Expired due to Fees

• Current Assignee: Fuyu Precision Components (Kunshan) Co., Ltd. (Foxconn Technology Co., Ltd.)
• Original Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Inventors: Lee, Han-Ming, Yan, Hai-Peng, Ma, Hung-Chun
• Primary Examiner(s): Wilson, Adrian S
• Application Number:
  US14/135,475
• Publication Number:
  US 20150085434A1
• Time in Patent Office: 831 Days
• Field of Search: 361/679.01, 295/921, 264/241
• US Class Current: 1/1
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 2307/304 Insulating
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 2307/51 Elastic
• CPC Class Codes: B32B 2307/536 Hardness
• CPC Class Codes: B32B 2307/54 Yield strength; Tensile strength
• CPC Class Codes: B32B 2307/56 Damping, energy absorption
• CPC Class Codes: B32B 2307/714 Inert, i.e. inert to chemical degradation, corrosion
• CPC Class Codes: B32B 25/08 of synthetic resin
• CPC Class Codes: B32B 25/20 comprising silicone rubber
• CPC Class Codes: B32B 2571/00 Protective equipment
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: G06F 1/1613 for portable computers cooling arrangements therefor G06F1/203; constructional details or arrangements for pocket calculators, electronic agendas or books G06F15/0216; constructional details of portable telephone sets: with several bodies H04M1/0202
• CPC Class Codes: Y10T 428/1359 Three or more layers [continuous layer]

Abstract

A casing includes a main body, a silicone rubber layer, and a bonding layer. The main body is made of magnesium alloy. The bonding layer is bonded between the main body and the silicone rubber layer. The bonding layer includes about 12 to about 30 by percentage weight of silane coupling agent.

Claims

1. A casing, comprising:

a main body made of magnesium alloy;

a silicone rubber layer; and

a bonding layer bonded between the main body and the silicone rubber layer, the bonding layer comprising about 12 to about 30 by percentage weight (wt %) of silane coupling agent;

wherein the bonding layer comprises about 26 to about 38 wt % of ethanol, about 4 to about 11 wt % of isopropanol, and about 18 to about 22 wt % of petroleum ether.

2. The casing of claim 1, wherein a magnesium oxide is formed on an outer surface of the main body, and the silane coupling agent of the bonding layer reacts with the magnesium oxide in a condensation reaction to bond the main body and the silicone rubber layer together.

3. The casing of claim 1, wherein a Shore hardness of the silicone rubber layer is about 10 to about 90, and a thickness of the silicone rubber layer is about 0.5 mm to about 2.0 mm.

4. The casing of claim 1, wherein the bonding layer is a transparent layer, and a thickness of the bonding layer is about 0.010 mm to about 0.015 mm.

5. An electronic device, comprising:

a casing, comprising;

a main body made of magnesium alloy;

a silicone rubber layer; and

a bonding layer bonded between the main body and the silicone rubber layer, the bonding layer comprising about 12 to about 30 by percentage weight (wt %) of silane coupling agent; and

at least one electronic element received in the casing;

wherein the bonding layer comprises about 26 to about 38 wt % of ethanol, about 4 to about 11 wt % of isopropanol, and about 18 to about 22 wt % of petroleum ether.

6. The electronic device of claim 5, wherein a magnesium oxide is formed on an outer surface of the main body, and the silane coupling agent of the bonding layer reacts with the magnesium oxide in a condensation reaction to bond the main body and the silicone rubber layer together.

7. The electronic device of claim 5, wherein a Shore hardness of the silicone rubber layer is about 10 to about 90, and a thickness of the silicone rubber layer is about 0.5 mm to about 2.0 mm.

8. The electronic device of claim 5, wherein the bonding layer is a transparent layer, and a thickness of the bonding layer is about 0.010 mm to about 0.015 mm.