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Run-to-run control utilizing virtual metrology in semiconductor manufacturing

  • US 9,299,623 B2
  • Filed: 11/08/2012
  • Issued: 03/29/2016
  • Est. Priority Date: 07/25/2012
  • Status: Expired due to Fees
First Claim
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1. An apparatus for performing run-to-run control and sampling optimization in a semiconductor manufacturing process, the apparatus comprising:

  • at least one control module operative;

    to determine a process output and corresponding metrology error associated with an actual metrology for a current processing run in the semiconductor manufacturing process;

    to determine a predicted process output and corresponding prediction error associated with a virtual metrology for the current processing run;

    to control at least one parameter corresponding to a subsequent processing run as a function of the metrology error and the prediction error;

    to obtain a prediction model associated with the semiconductor manufacturing process, the prediction model being adapted to predict the process output by estimating at least one processing parameter for the semiconductor manufacturing process; and

    to perform virtual metrology based on the prediction model, the prediction error being determined as a function of an output of the virtual metrology;

    wherein the prediction model comprises a wafer quality prediction model for metrology variable prediction which utilizes tensor input process variables by directly operating on the tensor input process variables.

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