Through silicon via structure
First Claim
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1. A semiconductor device comprising:
- a through silicon via protruding from a substrate, the through silicon via having a sidewall;
a liner extending along the sidewall away from the substrate, the liner terminating prior to reaching a top surface of the through silicon via;
a passivation layer comprising a first upper surface a first distance away from the substrate and a second upper surface a second distance away from the substrate, the second distance being greater than the first distance, the second upper surface being adjacent to the liner, wherein the passivation layer is an insulating layer;
a conductive material over and in physical contact with the sidewall and the top surface of the through silicon via; and
a first external device in electrical connection with the through silicon via through the conductive material.
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Abstract
A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.
147 Citations
20 Claims
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1. A semiconductor device comprising:
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a through silicon via protruding from a substrate, the through silicon via having a sidewall; a liner extending along the sidewall away from the substrate, the liner terminating prior to reaching a top surface of the through silicon via; a passivation layer comprising a first upper surface a first distance away from the substrate and a second upper surface a second distance away from the substrate, the second distance being greater than the first distance, the second upper surface being adjacent to the liner, wherein the passivation layer is an insulating layer; a conductive material over and in physical contact with the sidewall and the top surface of the through silicon via; and a first external device in electrical connection with the through silicon via through the conductive material. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device comprising:
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a through silicon via protruding from a substrate, the through silicon via having a sidewall; a first external device electrically connected to the through silicon via; a metallization layer located on an opposite side of the substrate than the first external device; a liner extending along the sidewall away from the substrate, the liner terminating prior to reaching a top surface of the through silicon via; a passivation layer comprising a first upper surface a first distance away from the substrate and a second upper surface a second distance away from the substrate, the second distance being greater than the first distance, the second upper surface being adjacent to the liner, wherein the passivation layer is an insulating material; a conductive material over and in physical contact with the sidewall and the top surface of the through silicon via, wherein the first external device is electrically connected to the through silicon via through the conductive material; and a second external device located on an opposite side of the metallization layer than the first external device, the second external device being electrically connected to the metallization layer. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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15. A semiconductor device comprising:
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a through silicon via in a substrate, the through silicon via comprising sidewalls, wherein the through silicon via extends through a metallization layer; a dielectric liner adjacent to the sidewalls; a dielectric layer over the substrate and adjacent to the dielectric liner, the dielectric layer having two different thicknesses, wherein the sidewall extends further from the substrate than the dielectric layer; and a conductive material in contact with the sidewalls of the through silicon via. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification