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Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

  • US 9,299,684 B2
  • Filed: 08/27/2013
  • Issued: 03/29/2016
  • Est. Priority Date: 08/26/2005
  • Status: Active Grant
First Claim
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1. A microelectronic package, comprising:

  • a first substrate having a first external contact at a first surface and a first wire bond contact at a second surface opposite the first surface;

    a first microelectronic die proximate to the first substrate;

    a second substrate having a second external contact and a second wire bond contact at a third surface facing away from the first substrate;

    a second microelectronic die proximate to the second substrate;

    wherein the first and second microelectronic dies each have an active side including a plurality of active terminals, and a back side, and wherein the back side of the first microelectronic die is attached to the back side of the second microelectronic die;

    a first wire connecting the first surface of the first substrate to the first microelectronic die; and

    a molding compound at least partially encapsulating the first and second substrates and the first and second dies without covering the first external contact or the second external contact.

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