Manufacturing method of the semiconductor device
First Claim
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1. A method for manufacturing a semiconductor device, comprising the steps of:
- forming a first insulating film over a substrate;
forming an oxide semiconductor film over and in contact with the first insulating film;
performing a first heat treatment to the oxide semiconductor film;
patterning the oxide semiconductor film after performing the first heat treatment to form an oxide semiconductor layer that includes a region comprising c-axis-aligned crystalline oxide semiconductor that is a non-single-crystal oxide material;
forming a second insulating film covering the oxide semiconductor layer; and
performing a second heat treatment to the oxide semiconductor layer after forming the second insulating film,wherein a part of oxygen in the first insulating film is desorbed during the first heat treatment, andwherein a part of the desorbed oxygen is supplied to the oxide semiconductor film.
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Abstract
The semiconductor device is manufactured through the following steps: after first heat treatment is performed on an oxide semiconductor film, the oxide semiconductor film is processed to form an oxide semiconductor layer; immediately after that, side walls of the oxide semiconductor layer are covered with an insulating oxide; and in second heat treatment, the side surfaces of the oxide semiconductor layer are prevented from being exposed to a vacuum and defects (oxygen deficiency) in the oxide semiconductor layer are reduced.
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Citations
19 Claims
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1. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a first insulating film over a substrate; forming an oxide semiconductor film over and in contact with the first insulating film; performing a first heat treatment to the oxide semiconductor film; patterning the oxide semiconductor film after performing the first heat treatment to form an oxide semiconductor layer that includes a region comprising c-axis-aligned crystalline oxide semiconductor that is a non-single-crystal oxide material; forming a second insulating film covering the oxide semiconductor layer; and performing a second heat treatment to the oxide semiconductor layer after forming the second insulating film, wherein a part of oxygen in the first insulating film is desorbed during the first heat treatment, and wherein a part of the desorbed oxygen is supplied to the oxide semiconductor film. - View Dependent Claims (2, 3, 4, 5)
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6. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a first insulating film over a substrate; forming an oxide semiconductor film over and in contact with the first insulating film; patterning the oxide semiconductor film to form an oxide semiconductor layer that includes a region comprising c-axis-aligned crystalline oxide semiconductor that is a non-single-crystal oxide material; forming a second insulating film covering the oxide semiconductor layer; and performing a second heat treatment to the oxide semiconductor layer after forming the second insulating film, wherein a part of oxygen in the second insulating film is desorbed during the second heat treatment, and wherein a part of the desorbed oxygen is supplied to the oxide semiconductor layer. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a first insulating film over a substrate; forming an oxide semiconductor film over and in contact with the first insulating film; patterning the oxide semiconductor film to form an oxide semiconductor layer that includes a region comprising c-axis-aligned crystalline oxide semiconductor that is a non-single-crystal oxide material; forming a second insulating film covering the oxide semiconductor layer; forming a third insulating film covering the second insulating film; performing a second heat treatment to the oxide semiconductor layer after forming the third insulating film, wherein a part of oxygen in the third insulating film is desorbed during the second heat treatment, and wherein a part of the desorbed oxygen is supplied to the oxide semiconductor layer. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification