Method for deposition of high-performance coatings and encapsulated electronic devices

• US 9,299,956 B2
• Filed: 06/13/2013
• Issued: 03/29/2016
• Est. Priority Date: 06/13/2012
• Status: Active Grant

• Current Assignee: Aixtron AG
• Original Assignee: Aixtron Inc. (Aixtron AG)
• Inventors: Savas, Stephen E., Wiesnoski, Allan, Chatham, Hood, Galewski, Carl
• Primary Examiner(s): Menz, Laura
• Assistant Examiner(s): Malek, Maliheh
• Application Number:
  US13/917,313
• Publication Number:
  US 20130334511A1
• Time in Patent Office: 1,020 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 31/02167 for solar cells
• CPC Class Codes: H01L 31/048 Encapsulation of modules
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/8731 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

A method is disclosed for forming leak-free coatings on polymeric or other surfaces that provide optical functions or protect underlying layers from exposure to oxygen and water vapor and do not crack or peel in outdoor environments. This method may include both cleaning and surface modification steps preceding coating. The combined method greatly reduces defects in any barrier layer and provides weatherability of coatings. Specific commercial applications that benefit from this include manufacturing of photovoltaic devices or organic light emitting diode (OLED) devices including lighting and displays.

Claims

1. A method for forming a moisture and oxygen permeation barrier on an electronic device on a rectangular or continuous web substrate, the method comprising:

while maintaining the substrate in a temperature range below 100°

C., subjecting the substrate to a substrate surface modification step so as to form a first layer upon said electronic device, the subjecting including both plasma enhanced chemical vapor deposition of a transparent dielectric material and sputter etching of said transparent dielectric material on the substrate surface by a plasma adjacent to the substrate, wherein a rate of the sputter etching is reduced from a first sputter etching rate to a second sputter etching rate less than the first sputter etching rate during the deposition of the transparent dielectric material, after deposition of an initial portion of the transparent dielectric material measuring 5 nm to 30 nm in thickness; and

while maintaining the substrate at a temperature below about 100°

C., subjecting the substrate supporting the electronic device to a plasma enhanced chemical vapor deposition process so as to form a second layer comprising a hermetic barrier layer.

2. The method of claim 1, wherein the hermetic barrier layer contains silicon nitride.

3. The method of claim 1, wherein the electronic device is an organic light emitting diode (OLED) device that is subjected to the plasma enhanced chemical vapor deposition of both the first layer and the second layer.

4. The method of claim 1, further comprising depositing a third and fourth layer so as to form a four layer coating, wherein a third layer of the four layer coating is substantially composed of the same material as the first layer and is deposited by a process substantially as used for depositing the first layer, and a fourth layer of the four layer coating is substantially composed of the same material as the second layer and is deposited by a process substantially as used for depositing the second layer.

13. The method of claim 1, wherein subsequent to decreasing the sputter etching rate from the first sputter etching rate to the second sputter etching rate, increasing the sputter etching rate from the second sputter etching rate to a third sputter etching rate during the deposition of the transparent dielectric material.

14. The method of claim 1, wherein the first layer contains silicon nitride.

15. The method of claim 1, wherein the first layer contains silicon oxynitride.

5. A method for forming a moisture and oxygen barrier on an electronic device on a rectangular or continuous web substrate, wherein the substrate is processed as the substrate continuously moves through a processing system, the method comprising:

cleaning a surface of the substrate by a cryogenic spray cleaning process using at least one of argon, nitrogen and carbon dioxide so as to form a cleaned surface;

subjecting the cleaned surface to a surface modification step so as to form a first layer upon the electronic device, the surface modification step having both plasma enhanced chemical vapor deposition of transparent material onto the cleaned surface and sputter etching of the transparent material on the cleaned surface, wherein a rate of the sputter etching is reduced from a first sputter etching rate to a second sputter etching rate less than the first sputter etching rate during the deposition of the transparent material, after deposition of an initial portion of the transparent material measuring 5 nm to 30 nm in thickness; and

subjecting the substrate to a plasma enhanced chemical vapor deposition process so as to form a second layer comprising a transparent hermetic barrier layer, wherein a temperature of the substrate is maintained below about 150°

C. during the plasma enhanced chemical vapor deposition of the transparent hermetic barrier layer.

6. The method of claim 5, wherein the hermetic barrier layer contains silicon nitride.

7. The method of claim 5, wherein the electronic device comprises an organic light emitting diode (OLED) device, and the OLED device is coated with the moisture and oxygen barrier.

8. The method of claim 5, further comprising depositing a third and fourth layer so as to form a four layer coating, wherein the third layer of the four layer coating is deposited using substantially the same material and process as used for depositing the first layer, and the fourth layer of the four layer coating is deposited using substantially the same material and process as used for depositing the second layer.

16. The method of claim 5, wherein subsequent to decreasing the sputter etching rate from the first sputter etching rate to the second sputter etching rate, increasing the sputter etching rate from the second sputter etching rate to a third sputter etching rate during the deposition of the transparent material.

17. The method of claim 5, wherein the first layer contains silicon nitride.

18. The method of claim 5, wherein the first layer contains silicon oxynitride.

9. A method for forming a moisture and oxygen barrier on a rectangular or continuous web substrate, the method comprising:

while maintaining the substrate in a temperature range below about 100°

C., subjecting the substrate to a surface modification step so as to form a first layer on the substrate, the surface modification step including both plasma enhanced chemical vapor deposition of transparent material and sputter etching of the transparent material on a surface of the substrate by a radio-frequency (rf) biased plasma adjacent to the substrate, the transparent material having a thickness after the surface modification step and a surface topography that is smoothed, wherein a rate of the sputter etching is reduced from a first sputter etching rate to a second sputter etching rate less than the first sputter etching rate during the deposition of the transparent material, after deposition of an initial portion of the transparent material measuring 5 nm to 30 nm in thickness; and

while maintaining the substrate at a temperature below about 100°

C., subjecting the substrate to a plasma enhanced chemical vapor deposition process so as to form a second layer comprising a hermetic barrier layer, the hermetic barrier layer comprising a transparent dielectric material having less than 3% carbon content.

10. The method of claim 9, wherein the hermetic barrier layer contains silicon nitride.

11. The method of claim 9, wherein an organic light emitting diode (OLED) device is located on the substrate and is covered by the moisture and oxygen barrier.

12. The method of claim 9, further comprising depositing a third and fourth layer so as to form a four layer coating, wherein the third layer of the four layer coating is deposited using substantially the same material and process as used for depositing the first layer, and the fourth layer of the four layer coating is deposited using substantially the same material and process as used for depositing the second layer.

19. The method of claim 9, wherein subsequent to decreasing the sputter etching rate from the first sputter etching rate to the second sputter etching rate, increasing the sputter etching rate from the second sputter etching rate to a third sputter etching rate during the deposition of the transparent material.

20. The method of claim 9, wherein the first layer contains silicon nitride.

21. The method of claim 9, wherein the first layer contains silicon oxynitride.