Attachment devices and methods for light emitting devices

• US 9,300,062 B2
• Filed: 10/26/2011
• Issued: 03/29/2016
• Est. Priority Date: 11/22/2010
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P., Wilcox, Kurt S., Andrews, Peter Scott, Reiherzer, Jesse Colin
• Primary Examiner(s): HARVEY, JAMES R
• Application Number:
  US13/282,172
• Publication Number:
  US 20120250310A1
• Time in Patent Office: 1,616 Days
• Field of Search: 439/56, 439/62, 439/78, 439/81, 439/83, 439/84
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01R 12/515 Terminal blocks providing connections to wires or cables
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

Attachment devices and methods for use with light emitting devices are provided. In one aspect, the light emitting device can include a submount and a light emission area disposed over the submount. The device can further include at least one attachment member provided on the submount. The attachment member can engage an electrical component thereby providing a gas-tight, solder free connection between the attachment member and electrical component.

Claims

1. A light emitting device comprising:

a submount;

a light emission area comprising a plurality of light emitting diode (LED) chips, disposed over the submount; and

at least one attachment member provided on the submount for engaging an electrical component and providing a solder free connection between the electrical component and the attachment member, wherein the attachment member is configured to displace a portion of the electrical component, and wherein each LED chip and the attachment member are disposed on a same surface of the submount.

2. The light emitting device of claim 1, wherein the attachment member comprises an insulated housing and one or more openings within the housing for receiving the electrical component.

3. The light emitting device of claim 2, wherein the openings comprise a grip member for physically securing the electrical component within the attachment member.

4. The light emitting device of claim 3, wherein electrical component comprises an electrical wire with a diameter ranging from 0.13 to 2.08 square millimeters (mm²).

5. The light emitting device of claim 1, wherein electrical component comprises an electrical wire with a diameter ranging from 0.13 to 2.08 square millimeters (mm²).

6. The light emitting device of claim 1, wherein the plurality of LED chips is disposed under a filling material.

7. The light emitting device of claim 1, wherein a retention material is provided about the light emission area.

8. The light emitting device of claim 7, wherein the retention material is dispensed about the light emission area.

9. The light emitting device of claim 1, wherein the attachment member is adapted to physically and electrically connect the electrical component to the submount.

10. The device of claim 1, wherein the attachment member comprises an insulation displacement connector (IDC) having at least one set of blade portions for electrically communicating with electrical component.

11. The device of claim 10, wherein the IDC comprises a double contact connector having more than one set of blade portions.

12. The device of claim 1, wherein the attachment member comprises an insulated housing with one or more pins extending from housing.

13. The device of claim 12, wherein the pins are configured to physically and electrically connect to a female terminal of electrical component thereby providing the solder free connection.

14. The device of claim 1, wherein the attachment member physically and electrically connects to submount via solder, adhesive, or electrically conductive tape.

15. The device of claim 1, wherein the attachment member comprises a first channel for crimping about a bare portion of electrical component.

16. The device of claim 15, wherein the attachment member comprises a second channel for crimping about an insulated portion of electrical component.

17. A method of providing external electrical current to a light emitting device, the method comprising:

providing the light emitting device, the device comprising;

a submount;

a light emission area comprising a plurality of light emitting diode (LED) chips disposed over the submount; and

at least one attachment member on the submount, wherein the attachment member releasably engages an electrical component thereby providing a solder free connection between the attachment member and the electrical component, wherein each LED chip and the attachment member are disposed on a same surface of the submount;

positioning the electrical component into the attachment member of the device; and

displacing a portion of the electrical component to physically and electrically connect the electrical component to the device.

18. The method of claim 17, wherein attaching the electrical component comprises inserting the electrical component into an opening of a housing of the attachment member to physically and electrically connect the electrical component to the device.

19. The method of claim 17, further comprising releasing the electrical component from the attachment member to physically and electrically disconnect the electrical component from the device.

20. The method of claim 19, wherein releasing the electrical component comprises depressing a tab of the attachment member to physically and electrically disengage the electrical component from the attachment member.

21. The method of claim 17, wherein attaching the electrical component comprises positioning the electrical component between at least one set of blade portions of an insulation displacement connector (IDC).

22. The method of claim 21, wherein attaching the electrical component comprises positioning the electrical component between at least two set of blade portions of the IDC.

23. The method of claim 17, wherein attaching the electrical component comprises inserting one or more pins extending from a housing of the attachment member into a female terminal of an external housing.

24. The method of claim 23, wherein the pins are configured to physically and electrically connect to the female terminal of electrical component.

25. The method of claim 17, further comprising electrically and physically connecting the attachment member to the submount via soldering.

26. The method of claim 17, wherein attaching the electrical component comprises crimping a bare portion of the electrical component in a first channel.

27. The device of claim 26, wherein attaching the electrical component further comprises crimping an insulated portion of the electrical component in a second channel.

28. A light emitting device comprising:

a submount;

a plurality of light emitting diode (LED) chips disposed on the submount; and

at least one attachment member attached to the submount, the attachment member comprising a housing for receiving and displacing a portion of an electrical connector and for maintaining the electrical connector a distance spaced apart from the submount, wherein each LED chip and the attachment member are disposed on a same surface of the submount.

29. The light emitting device of claim 28, wherein the plurality of LED chips is at least partially disposed under a filling material.

30. The light emitting device of claim 28, further comprising a retention material disposed about at least a portion of the plurality of LED chips.

31. The light emitting device of claim 30, wherein the retention material comprises a dispensed retention material on the submount.

32. The light emitting device of claim 29, wherein the filling material comprises an encapsulant having at least one phosphor.

33. The light emitting device of claim 28, wherein the attachment member comprises a central body portion disposed between one or more raised portions.

34. The light emitting device of claim 33, wherein the one or more raised portions comprise an attachment portion spaced apart the distance from the submount for electrically connecting to at least a portion of an electrical wire.

35. The light emitting device of claim 33, wherein the central body portion comprises an attachment portion spaced apart the distance from the submount for electrically connecting to at least a portion of an electrical wire.

36. The light emitting device of claim 28, wherein the distance the attachment member is spaced apart from the submount is greater than 0 millimeters (mm) from the submount.

37. The light emitting device of claim 28, wherein the distance the attachment member is spaced apart from the submount is less than a height of a retention material disposed about at least a portion of the light emission area.

38. The light emitting device of claim 28, further comprising insulating wire guides for preventing electrical component from shorting or electrically arcing.

39. The light emitting device of claim 28, wherein the electrical connector is crimped between upper body portions of the attachment member.

40. The light emitting device of claim 39, wherein a plastic housing is disposed about the area where the wire is crimped.

41. A light emitting device comprising:

a submount;

at least one electrical trace disposed over the submount;

an array of light emitting diode (LED) chips electrically connected to the at least one electrical trace; and

at least one attachment member soldered to the submount, the attachment member comprising a housing for receiving an electrical connector and maintaining the electrical connector at least a distance above an upper surface of the submount, wherein each LED chip and the attachment member are disposed on the upper surface of the submount.

42. The light emitting device of claim 41, further comprising a retention material at least partially disposed about the array of LED chips.

43. The light emitting device of claim 42, wherein the retention material is adapted for retaining a fill material for covering the LED chips.

44. The light emitting device of claim 43, wherein the fill material at least partially comprises a phosphor or other material for affecting light color from light emitted from the LED chips.

45. The light emitting device of claim 42, wherein the retention material is disposed over at least a portion of the at least one electrical trace.

46. The light emitting device of claim 42, wherein the retention material is disposed over at least a portion of the at least one electrical trace to which at least one of the LED chips is connected.

47. The light emitting device of claim 41, wherein the attachment member comprises at least one attachment portion spaced apart the distance from the submount.

48. The light emitting device of claim 47, wherein the attachment portion is disposed at least partially along a central body portion.

49. The light emitting device of claim 48, wherein the attachment portion is disposed at least partially along at least one raised portion of the attachment member.

50. The light emitting device of claim 47, wherein an electrically conductive wire is positioned and attached at least partially over the at least one attachment portion.

51. The light emitting device of claim 41, wherein the distance the attachment member is spaced apart from the submount is greater than 0 millimeters (mm) from the submount.

52. The light emitting device of claim 41, wherein the electrical connector is crimped between upper body portions of the attachment member.

53. The light emitting device of claim 52, wherein a plastic housing is disposed about the area where the wire is crimped.

54. A method for fabricating a light emitting device, the method comprising:

providing a submount comprising one or more light emitting diode (LED) chips disposed over the submount, the submount comprising an attachment member soldered thereto and in electrical communication with the one or more LEDs; and

positioning an external electrical component in the attachment member for displacing a portion of the electrical component thereby electrically connecting the one or more LED chips and the electrical component, such that the electrical component is maintained at least a distance above an upper surface of the submount, wherein each LED chip and the attachment member are disposed on the upper surface of the submount.

55. The method of claim 54, wherein electrically connecting the attachment member to the external electrical component comprises soldering the electrical component to the attachment member.

56. The method of claim 55, wherein soldering the electrical component to the attachment member comprises soldering the electrical component at the distance greater than 0 mm spaced apart from the submount.

57. The method of claim 54, wherein electrically connecting the attachment member to the external electrical component comprises receiving the external electrical component into an opening of the attachment member.

58. The method of claim 54, wherein electrically connecting the attachment member to the external electrical component comprises positioning the external electrical component within a set of blades disposed on the attachment member.

59. The method of claim 54, wherein electrically connecting the attachment member to the external electrical component comprises inserting pins of the attachment member into a female terminal disposed on the electrical component.

60. The method of claim 54, wherein providing a submount comprises providing a submount with a retention material dispensed on the submount, the retention material at least partially dispensed about the one or more LEDs.

61. The method of claim 60, further comprising providing a fill material at least partially over the one or more LEDs, wherein the fill material is retained in place at least partially by the retention material.

62. The method of claim 54, wherein electrically connecting the attachment member comprises crimping the external electrical component between upper body portions of the attachment member.

63. A light emitting device comprising:

a device surface;

at least one light emitter chip disposed on the device surface; and

a wire attachment surface disposed on the same device surface as the at least one light emitter chip and in electrical communication with the at least one light emitter chip, wherein the wire attachment surface is spaced apart from the device surface and receives a wire, and wherein the wire is retained by a portion of the wire attachment surface thereby electrically coupling the wire to the device.

64. The device of claim 63, wherein the attachment member comprises a reduced area portion relative to a pad portion of the wire attachment surface directly on the device surface.

65. The device of claim 63, wherein the reduced area portion is adapted to reduce the thermal conductivity of the attachment member relative to the pad portion.

66. The device of claim 63, wherein the attachment member comprises a reduced thermal conductivity portion relative to the pad portion.

67. The device of claim 63, where the wire attachment surface comprises one or more blades configured to displace a cover portion of the wire.

68. The device of claim 63, wherein the attachment member is adapted to retain the wire prior to bonding.

69. A light emitting device comprising:

a device surface;

at least one light emitter chip disposed on the device surface; and

a wire attachment surface disposed on the same device surface as the at least one light emitter chip and in electrical communication to the at least one light emitter chip, wherein the wire attachment surface comprises a first surface adapted to receive and retain a wire for solder free bonding thereto, and a second surface opposing the first surface, wherein the second surface is electrically coupled to the device, and wherein the attachment surface provides an electrical connection between the wire and the device.