Microwave module

• US 9,301,426 B2
• Filed: 04/11/2013
• Issued: 03/29/2016
• Est. Priority Date: 05/17/2011
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Wennberg, Goran, Hammar, Peter, Madeberg, Bengt, Bergstedt, Leif
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US13/860,764
• Publication Number:
  US 20130215576A1
• Time in Patent Office: 1,083 Days
• Field of Search: 361/816, 361/818, 361752-753, 343/700.MS, 343/702, 343/743
• US Class Current: 1/1
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 9/0056 specially adapted for microwave applications

Abstract

The present application relates to a microwave module comprising a printed circuit board, a first housing part, a second housing part, and a diplexer. It is specifically proposed that the first and second housing parts are adapted to act as a shielding cover, and that the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the printed circuit board.

Claims

1. A microwave module comprising:

a first housing part;

a second housing part coupled to the first housing part and comprising a filter geometry; and

a printed circuit board (PCB), positioned between the first housing part and the second housing part and comprising an integrated loopback function,

wherein the first housing part and the second housing part comprise a shielding cover configured to shield the PCB,

wherein the filter geometry and the PCB comprise a diplexer,

wherein the PCB comprises a microwave side with a large plated area facing the second housing part,

wherein the filter geometry faces the PCB,

wherein the filter geometry and the plated area comprise the diplexer, and

wherein the plated area is configured to function as a metal cover towards the filter geometry of the second housing part.

2. The microwave module according to claim 1, wherein the first housing part functions as a mechanical fix point configured to be fastened to an antenna.

3. The microwave module according to claim 1, wherein a side facing away from the PCB of the second housing part has threaded holes for tuning screws into the filter geometry.

4. The microwave module according to claim 1, wherein the diplexer function is designed according to H-plane technologies.

5. The microwave module according to claim 1, wherein the diplexer function is designed according to E-plane technologies.

6. The microwave module according to claim 1, wherein isolators are integrated on the PCB such that the isolators are housed by the first housing part.

7. The microwave module according to claim 1, wherein the module is weather protected.

8. The microwave module according to claim 1, wherein a sealed protection plate is configured to cover the part of the side facing away from the PCB of the second housing part, and wherein the sealed protection plate comprises threaded holes for tuning screws into the filter geometry and holes for mounting screws for fixating the first housing part and the second housing part to each other.

9. The microwave module according to claim 2, wherein the first housing part comprises a wave guide configured to lead a microwave signal in and out of the module.

10. The microwave module according to claim 2, wherein the first housing part comprises two backshort cavities.

11. The microwave module according to claim 2, wherein an outside of the first housing part comprises cooling flanges in a 45°

direction, and wherein the module is configured to be fastened to the antenna such that the cooling flanges are protected from the sun by the antenna when the module is fastened to the antenna.

12. The microwave module according to claim 3, wherein the side facing away from the PCB of the second housing part comprises an area for connectors, wherein the connectors are mounted on the area for the connectors, wherein pins from the connectors are guided through the second housing part to the PCB, and wherein the PCB has receptors adapted to a mechanical contact and an electrical contact with the pins.

13. The microwave module according to claim 7, wherein at least one O-ring is positioned between the first housing part and the second housing part.

14. The microwave module according to claim 8, wherein the sealed protection plate is sealed to the second housing part by an O-ring or another sealing gasket solution.

15. The microwave module according to claim 9, wherein the PCB has a plated wave guide hole configured to feed the signal in and out from the antenna.

16. The microwave module according to claim 12, wherein the area for the connectors is mechanically protected.

17. The microwave module according to claim 13, wherein the second housing part comprises a slot around an edge of the side facing the PCB, and wherein a first O-ring is positioned in the slot and configured to function as a sheared gasket solution.

18. The microwave module according to claim 15, wherein the plated area comprises at least two wave guide holes.

19. The microwave module according to claim 15, wherein via-holes are positioned around the wave guide holes.

20. The microwave module according to claim 18, wherein the PCB comprises a Teflon layer, FR4 layers, and the plated area, and wherein the wave guide hole is made in the FR4 layers and not in the Teflon layer.

21. The microwave module according to claim 20, wherein the Teflon layer comprises an antenna probe in a middle of the wave guide hole.