Illumination devices and methods for making the same

• US 9,303,827 B2
• Filed: 06/17/2014
• Issued: 04/05/2016
• Est. Priority Date: 09/11/2006
• Status: Expired due to Fees

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Aeling, Ellen O., David, John R., Meis, Michael A., Steelman, Ronald S.
• Primary Examiner(s): Santiago, Mariceli
• Application Number:
  US14/306,337
• Publication Number:
  US 20140293602A1
• Time in Patent Office: 658 Days
• US Class Current: 1/1
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21K 9/68 Details of reflectors forming part of the light source
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 19/0015 Fastening arrangements intended to retain light sources
• CPC Class Codes: F21V 19/0025 the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H05K 1/0287 having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09681 Mesh conductors, e.g. as a ground plane
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10363 Jumpers, i.e. non-printed cross-over connections
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/222 Completing of printed circuits by adding non-printed jumper connections printed jumper connections H05K3/4685
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Claims

1. An illumination device comprising:

a first conductor layer;

a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer;

a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture;

a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures,

at least one light source disposed on the first conductor layer in electrical communication with the second conductor layer pattern through the first aperture,

wherein the total thickness of the first conductor layer, the first insulator layer, the second conductor layer, and the light manipulation layer is 100 micrometers to 1000 micrometers.

2. An illumination device according to claim 1, wherein at least one of the first and second conductors comprises a metal conductor comprised of least one of copper, silver, gold, aluminum, palladium, and titanium.

3. An illumination device according to claim 1, wherein the device is substantially planar in shape.

4. An illumination device according to claim 1, wherein the device is curved.

5. An illumination device according to claim 1 in combination with art illuminated sign, building, vehicle, or display.

6. An illumination device according to claim 1, wherein the light manipulation layer is a light reflective layer.

7. An illumination device according to claim 1, wherein the light manipulation layer is a polymeric mirror film.

8. An illumination device according to claim 1, wherein the first insulator layer comprises a plurality of first apertures defined therein through the first insulator layer and a plurality of second apertures defined through the second conductor layer and positioned in registration with the plurality of first apertures and a plurality of third apertures and a plurality of fourth apertures defined in the light manipulation layer where the plurality of third apertures are in registration with the plurality of second apertures.

9. A method of making an illumination device comprising:

disposing a first insulator layer on a first conductor layer, the first insulator layer defining at least one first aperture through the first insulator layer;

disposing a second conductor layer on the first insulator layer, the first insulator layer defining at least one second aperture through the second conductor layer and positioned to align with the at least one first aperture; and

disposing a light manipulation layer defining at least one third and fourth apertures through the light manipulation layer such that the at least one third aperture is positioned to align with the at least one first and second apertures,

wherein the total thickness of the first conductor layer, the first insulator layer, the second conductor layer, and the light manipulation layer is 100 micrometers to 1000 micrometers.

10. A method according to claim 9, wherein the light manipulation layer is a light reflective layer.

11. A method according to claim 9, wherein the light manipulation layer is a polymeric mirror film.

12. A method according to claim 9, wherein the first insulator layer comprises a plurality of first apertures defined therein through the first insulator layer and a plurality of second apertures defined through the second conductor layer and positioned in registration with the plurality of first apertures and a plurality of third apertures and a plurality of fourth apertures defined in the light manipulation layer where the plurality of third apertures are in registration with the plurality of second apertures.

13. An illumination device comprising:

a first conductor layer;

a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, wherein the first insulator layer is a light reflective layer;

a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture;

a transparent layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the transparent layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures, and

at least one light source disposed on the first conductor layer in electrical communication with the second conductor layer pattern through the first aperture.