Microfabrication

• US 9,304,235 B2
• Filed: 07/30/2014
• Issued: 04/05/2016
• Est. Priority Date: 07/30/2014
• Status: Active Grant

• Current Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Original Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Inventors: Sainiemi, Lauri, Levola, Tapani, Saarikko, Pasi
• Primary Examiner(s): ALANKO, ANITA KAREN
• Application Number:
  US14/447,464
• Publication Number:
  US 20160033697A1
• Time in Patent Office: 615 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: B05C 13/02 for particular articles
• CPC Class Codes: B05C 3/02 the work being immersed in the liquid or other fluent material
• CPC Class Codes: B05D 1/18 performed by dipping
• CPC Class Codes: B05D 5/06 to obtain multicolour or other optical effects B05D5/02 takes precedence
• CPC Class Codes: C03C 15/00 Surface treatment of glass, not in the form of fibres or filaments, by etching etching or surface-brightening compositions, in general C09K13/00
• CPC Class Codes: C03C 17/00 Surface treatment of glass, not in the form of fibres or filaments, by coating optical coatings of optical elements G02B1/10
• CPC Class Codes: C03C 2218/111 by dipping, immersion
• CPC Class Codes: C03C 2218/33 by etching
• CPC Class Codes: C23C 16/45525 Atomic layer deposition [ALD]
• CPC Class Codes: C23F 1/02 Local etching
• CPC Class Codes: G02B 27/0103 comprising holographic elements
• CPC Class Codes: G02B 5/1828 having means for producing variable diffraction controlling the direction of light by means of one or more diffracting elements G02B26/0808; acousto-optical elements G02F1/11, G02F1/33; electro- or magneto-optical diffraction G02F1/292, G02F1/2955
• CPC Class Codes: G02B 5/1857 using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
• CPC Class Codes: G02B 6/0058 varying in density, size, shape or depth along the light guide
• CPC Class Codes: G02B 6/34 utilising prism or grating G02B6/293 takes precedence

Abstract

Microfabrication processes and apparatuses for fabricating microstructures on a substrate are disclosed. The substrate has a current diffraction grating pattern formed by current surface modulations over at least a portion of the substrate'"'"'s surface that exhibit a substantially uniform grating linewidth over the surface portion. An immersion depth of the substrate in a fluid for patterning the substrate is gradually changed so that different points on the surface portion are immersed for different immersion times. The fluid changes the linewidth of the surface modulations at each immersed point on the surface portion by an amount determined by the immersion time of that point, thereby changing the current diffraction grating pattern to a new diffraction grating pattern formed by new surface modulations over the surface portion that exhibit a spatially varying grating linewidth that varies over the surface portion.

Claims

1. A microfabrication process for fabricating microstructures on a substrate, the substrate having a current diffraction grating pattern formed by current surface modulations over at least a portion of the substrate'"'"'s surface that exhibit a substantially uniform grating linewidth over the surface portion, the process comprising:

gradually changing an immersion depth of the substrate in a fluid, the fluid for patterning the substrate, so that different points on the surface portion are immersed in the fluid for different immersion times;

wherein the fluid changes the linewidth of the surface modulations at each immersed point on the surface portion by an amount determined by the immersion time of that point, thereby changing the current diffraction grating pattern to a new diffraction grating pattern formed by new surface modulations over the surface portion that exhibit a spatially varying grating linewidth that varies over the surface portion.

2. A microfabrication process according to claim 1 wherein the current surface modulations are formed by modulations of the surface portion itself.

3. A microfabrication process according to claim 2 wherein the current modulations of the surface portion constitute a binary, trapezoidal or sinusoidal grating pattern.

4. A microfabrication process according to claim 1 wherein the current surface modulations are formed by extraneous deposits on the surface portion.

5. A microfabrication process according to claim 4 wherein the extraneous deposits form a partial film on the surface portion that leaves regions of the surface portion exposed.

6. A microfabrication process according to claim 1 wherein the current surface modulations are formed by a combination of modulations of the surface portion itself and extraneous deposits on the modulated surface portion.

7. A microfabrication process according to claim 6 wherein the extraneous deposits cover the entirety of the modulated surface portion.

8. A microfabrication process according to claim 7 wherein the extraneous deposits are applied using atomic layer deposition.

9. A microfabrication process according to claim 1 wherein the fluid is an etchant that changes the modulation width by removing material from the surface portion.

10. A microfabrication process according to claim 9 wherein the removed material is substrate material of the substrate itself.

11. A microfabrication process according to claim 9 wherein the removed material is of extraneous deposits on the surface portion, and wherein the new diffraction pattern results from the extraneous deposits remaining on the substrate after the step of changing the immersion depth has been completed.

12. A microfabrication process according to claim 11 wherein the remaining deposits leave regions of the surface portion exposed and the process further comprises performing further etching of the substrate after the step of changing the immersion depth has been completed, wherein the remaining extraneous deposits on the surface portion serve as an etching mask in the further etching of the substrate so that the new diffraction pattern is transferred to the substrate.

13. A microfabrication process according to claim 12 wherein the further etching comprises dip etching and/or ion beam etching of the substrate.

14. A microfabrication process according to claim 1 wherein the fluid is a depositant that changes the modulation width by depositing material on the surface portion.

15. A microfabrication process according to claim 1 wherein the substrate with the new diffraction pattern is for use as an optical component in an optical system.

16. A microfabrication process according to claim 8 wherein the substrate with the new diffraction pattern is for use as a waveguide in a display system.

17. A microfabrication process according to claim 1 wherein the substrate with the new diffraction pattern is for use as a production master for manufacturing optical components and wherein the process further comprises using the production master to manufacture optical components.

18. A microfabrication apparatus for fabricating microstructures on a substrate, the substrate having current a diffraction grating pattern formed by current surface modulations over at least a portion of the substrate'"'"'s surface that exhibit a substantially uniform grating linewidth over the surface portion, the apparatus comprising:

a substrate holder configured to support the substrate;

a fluid container configured to hold a fluid, the fluid for patterning the substrate;

a drive mechanism coupled to the substrate holder; and

a controller configured to control the drive mechanism to gradually change an immersion depth of the substrate in the fluid so that different points on the surface portion are immersed in the fluid for different immersion times;

wherein the fluid changes the linewidth width of the surface modulations at each immersed point on the surface portion by an amount determined by the immersion time of that point, thereby changing the current diffraction grating pattern to a new diffraction grating pattern formed by new surface modulations that exhibit a spatially varying grating linewidth that varies over the surface portion.

20. The microfabrication apparatus according to claim 18 wherein the current surface modulations are formed by modulations of the surface portion itself.

19. A microfabrication process for fabricating microstructures on a substrate, the substrate having a current diffraction grating pattern formed by current surface modulations over at least a portion of the substrate'"'"'s surface that exhibit a substantially uniform grating linewidth over the surface portion, the process comprising:

gradually changing an immersion depth of the substrate in an etchant so that different points on the surface portion are immersed in the etchant for different immersion times;

wherein the etchant changes, by removing material from the surface portion, the linewidth of the surface modulations at each immersed point on the surface portion by an amount determined by the immersion time of that point, thereby changing the current diffraction grating pattern to a new diffraction grating pattern formed by new surface modulations over the surface portion that exhibit a spatially varying grating linewidth that varies over the surface portion.