Device and method for stopping etching process

• US 9,305,798 B2
• Filed: 03/25/2013
• Issued: 04/05/2016
• Est. Priority Date: 11/09/2007
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Brencher, Lothar, Meinhold, Dirk, Hartenberger, Michael, Seidemann, Georg, Dickenscheid, Wolfgang
• Primary Examiner(s): Tran, Binh X
• Application Number:
  US13/850,206
• Publication Number:
  US 20130288481A1
• Time in Patent Office: 1,107 Days
• Field of Search: 438/717, 438/720, 438/724, 438/742, 216/49, 216/69
• US Class Current: 1/1
• CPC Class Codes: H01L 21/3083 characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/32136 using plasmas
• CPC Class Codes: H01L 21/76802 by forming openings in dielectrics
• CPC Class Codes: H01L 21/76804 by forming tapered via holes
• CPC Class Codes: H01L 21/76832 Multiple layers
• CPC Class Codes: H01L 21/76877 Filling of holes, grooves or trenches, e.g. vias, with conductive material

Abstract

A method for etching a layer assembly, the layer assembly including an intermediate layer sandwiched between an etch layer and a stop layer, the method including a step of etching the etch layer using a first etchant and a step of etching the intermediate layer using a second etchant. The first etchant includes a first etch selectivity of at least 5:1 with respect to the etch layer and the intermediate layer. The second etchant includes a second etch selectivity of at least 5:1 with respect to the intermediate layer and the stop layer. The first etchant being is different from the second etchant.

Claims

1. A method for etching a layer assembly comprising an intermediate layer sandwiched between an etch layer and a stop layer, the method comprising:

in a region for forming a via contact to a contact portion of the stop layer, etching the etch layer using a first etchant, the etch layer comprising a first material and the first etchant comprising a first etch selectivity with respect to the etch layer and the intermediate layer; and

etching the intermediate layer using a second etchant, the second etchant comprising a second etch selectivity with respect to the intermediate layer and the stop layer, wherein the second etchant is different from the first etchant, wherein the etch layer has a planar lower surface adjacent the intermediate layer and a non-planar upper surface over the contact portion of the stop layer, and wherein a thickness of the etch layer overlying the contact portion of the stop layer varies more than 10% around a mean value, wherein the etch layer has a variable thickness in the region to be etched for forming the via contact, and wherein the thickness is measured from the planar lower surface to the non-planar upper surface.

2. The method of claim 1, wherein the etch layer comprises an inclusion, and wherein the inclusion has an etching rate different than the etching rate of the first material.

3. The method of claim 1, wherein a thickness of the intermediate layer is such that a ratio of a thickness of the etch layer to the thickness of the intermediate layer is at most 3 times a first etch selectivity for a fluorocarbon etchant between the first material and a second material of the intermediate layer.

4. The method of claim 1, wherein the first etch selectivity comprises a ratio of at least 5:

1 and wherein the second etch selectivity comprises a ratio of at least 5;

1.

5. The method of claim 1, wherein the stop layer comprises a stop layer thickness and the step of etching the intermediate layer is performed such that the stop layer is opened to a depth, the depth comprising less than 50% of the stop layer thickness.

6. The method of claim 1, further comprising performing an oxygen flash to remove polymers within an etching area.

7. The method of claim 1, wherein etching the etch layer comprises etching the etch layer such that a part of the stop layer is exposed.

8. The method of claim 1, wherein etching the etch layer comprises etching with a fluorocarbon.

9. The method of claim 1, wherein etching the intermediate layer comprises etching with fluoro-methane.

10. The method of claim 1, wherein the etch layer comprises an inclusion, and wherein the inclusion has an etching rate less than the etching rate of the first material.

11. The method of claim 1, wherein etching the etch layer comprises etching with a fluorocarbon etchant, wherein etching the intermediate layer comprises etching with a fluoro-methane etchant.

12. The method of claim 11, wherein the first etch selectivity using the fluorocarbon etchant comprises a ratio of at least 5:

1 and wherein the second etch selectivity using the fluoro-methane comprises a ratio of at least 5;

1.

13. The method of claim 12, wherein a thickness of the intermediate layer is such that a ratio of a thickness of the etch layer to the thickness of the intermediate layer is at most 3 times a first etch selectivity for the fluorocarbon etchant between the first material and a second material of the intermediate layer.

14. A method for manufacturing a semiconductor structure, the method comprising:

forming a stop layer having a third material;

forming an intermediate layer over the stop layer, the intermediate layer comprising a second material and having an intermediate layer thickness;

forming an etch layer over the intermediate layer, the etch layer comprising a first material and having an etch layer thickness; and

performing a first etching step with a first etch selectivity in a region for forming a via contact, the first etching step being performed using a fluorocarbon etchant;

wherein a ratio of the etch layer thickness to the intermediate layer thickness is at most 3 times the etch selectivity of the first etching step;

wherein the first and second materials are such that the first etch selectivity for the fluorocarbon etchant between the first and second materials is at least a ratio of 5;

1;

wherein the second and third materials are such that a second etch selectivity for a fluoro-methane etchant between the second and third materials is at least a ratio of 5;

1;

wherein the etch layer comprises an inclusion in a region to be etched for forming a via contact; and

wherein the inclusion has an etching rate different than the etching rate of the first material when exposed to the fluorocarbon etchant.

15. The method of claim 14, wherein forming the intermediate layer comprises forming the intermediate layer such that the intermediate layer thickness exceeds the ratio of the etch layer thickness to the etch selectivity.

16. The method of claim 14, wherein the etching rate of the inclusion is greater than the etching rate of the first material when exposed to the fluorocarbon etchant.

17. The method of claim 14, wherein the etching rate of the inclusion is less than the etching rate of the first material when exposed to the fluorocarbon etchant.

18. A method of forming a semiconductor structure, the method comprising:

forming a stop layer of a first material over a semiconductor substrate, the stop layer comprising a contact layer and having a stop layer thickness;

forming an intermediate layer of a second material over the stop layer, the intermediate layer having an intermediate layer thickness; and

forming an etch layer of a third material over the intermediate layer, the etch layer having an etch layer thickness,

forming a via contact in a region by etching the etch layer, the intermediate layer, and the stop layer, wherein, due to non-uniformities in the etch layer, an etching rate through the third material of the etch layer varies across the region to be etched for forming the via contact and wherein the non-uniformities comprise one or more of inclusions, impurities, air bubbles or contamination.

19. The method of claim 18, wherein the etching rate of the non-uniformities is greater than the etching rate of the third material when exposed to a fluorocarbon etchant.

20. The method of claim 18, the etching rate of the non-uniformities is less than the etching rate of the third material when exposed to a fluorocarbon etchant.

21. The method of claim 18, wherein the non-uniformities comprise air.

22. The method of claim 18, wherein the first material comprises titanium nitride, wherein the second material comprises silicon oxynitride, and wherein the third material comprises an oxide material.

23. The method of claim 18, wherein the etch layer comprises a first non-uniformity in a region to be etched for forming the via contact, and wherein the first non-uniformity extends substantially through the etch layer thickness.

24. The method of claim 23, further comprising a second non-uniformity in the region to be etched for forming the via contact, and wherein the second non-uniformity extends only partially through the etch layer thickness.

25. The method of claim 18, wherein the intermediate layer thickness is such that a ratio of the etch layer thickness to the intermediate layer thickness is at most 3 times a first etch selectivity, and wherein the first etch selectivity is the etching rate of the first material divided by an etching rate of the second material when exposed to a fluorocarbon etchant.

26. The method of claim 25, wherein the first and second materials are such that the first etch selectivity for the fluorocarbon etchant between the first and second materials is at least a ratio of 5:

1, and wherein the second and third materials are such that a second etch selectivity for a fluoro-methane etchant between the second and third materials is at least a ratio of 5;

1.

27. The method of claim 26, wherein a thickness of the intermediate layer is less than a product of the second etch selectivity and the etch layer thickness.

28. A method of forming a semiconductor structure, the method comprising:

forming a stop layer of a first material over a semiconductor substrate, the stop layer comprising a conductive layer and having a stop layer thickness;

forming an intermediate layer of a second material over the stop layer, the intermediate layer having an intermediate layer thickness; and

forming an etch layer of a third material over the intermediate layer, the etch layer having an etch layer thickness,

forming a via contact in a region by etching the etch layer, the intermediate layer, and the stop layer;

wherein the etch layer comprises an inclusion, wherein the inclusion has an etching rate different than the etching rate of the third material during the etching, and wherein a thickness of the etch layer varies more than 10% around a mean value, wherein the etch layer has a variable thickness in the region to be etched for forming the via contact, and wherein the thickness is measured from a planar lower surface of the etch layer to a non-planar upper surface of the etch layer; and

wherein the etch layer comprises a first non-uniformity in a region to be etched for forming the via contact, wherein the first non-uniformity extends substantially through the etch layer thickness, wherein the etch layer further comprises a second non-uniformity in the region to be etched for forming the via contact, wherein the second non-uniformity extends only partially through the etch layer thickness, and wherein sidewalls of the first non-uniformity are non-uniform, and wherein a bottom surface of the first non-uniformity is non-uniform.

29. The method of claim 28, wherein a sidewall of the first non-uniformity intersects with a sidewall of the second non-uniformity.

30. The method of claim 28, wherein the inclusion is disposed under the intersecting sidewalls of the first and second non-uniformities.

31. The method of claim 28, wherein the etch layer has a minimum thickness at a bottom surface of the first non-uniformity.