Methods and devices for securing and transporting singulated die in high volume manufacturing

• US 9,305,816 B2
• Filed: 12/28/2013
• Issued: 04/05/2016
• Est. Priority Date: 12/28/2013
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Johnson, John C., Davison, Peter A., Moret, Eric J., Palanuk, Lawrence M., Stone, Gregory A.
• Primary Examiner(s): DIALLO, MAMADOU L
• Application Number:
  US14/142,761
• Publication Number:
  US 20150187622A1
• Time in Patent Office: 829 Days
• Field of Search: 414/222.01, 203/725
• US Class Current: 1/1
• CPC Class Codes: H01L 21/67265 of substrates stored in a container, a magazine, a carrier, a boat or the like
• CPC Class Codes: H01L 21/67309 characterized by the substrate support
• CPC Class Codes: H01L 21/67333 Trays for chips magazine for components H05K13/0084
• CPC Class Codes: H01L 21/67356 specially adapted for containing chips, dies or ICs
• CPC Class Codes: H01L 21/67363 specially adapted for containing substrates other than wafers H01L21/67356, H01L21/67359 take precedence
• CPC Class Codes: H01L 21/67383 characterised by substrate supports
• CPC Class Codes: H01L 21/67769 Storage means
• CPC Class Codes: H01L 21/67772 involving removal of lid, door, cover
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 21/68764 characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
• CPC Class Codes: H01L 21/68771 characterised by supporting more than one semiconductor substrate
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H05K 13/0084 Containers and magazines for components, e.g. tube-like magazines

Abstract

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Claims

1. A carrier configured to hold a plurality of trays, the trays configured to hold a plurality of singulated die, the carrier comprising:

a plurality of rails configured to hold the trays thereon;

wherein the trays are individually accessible in any order from the carrier; and

a protrusion extending upward on an upper surface of the carrier, the protrusion configured to be coupled to an automated carrier handling system.

2. The carrier of claim 1, further comprising a patterned lower surface configured to engage a load port on a tool.

3. The carrier of claim 1, wherein the protrusion includes a substantially T-shaped cross section.

4. The carrier of claim 1, wherein the rails are configured so that the carrier can accept two columns of multiple trays therein.

5. The carrier of claim 1, wherein a plurality of the rails include a protrusion extending downward therefrom.

6. The carrier of claim 5, wherein the protrusion comprises a spring.

7. The carrier of claim 5, wherein the protrusion comprises a leaf spring.

8. The carrier of claim 5, wherein the protrusion comprises a dome structure.

9. The carrier of claim 1, further comprising an identification structure on the carrier.

10. The carrier of claim 9, wherein the identification structure comprises an RFID tag.

11. A carrier configured to hold a plurality of trays, the trays configured to hold a plurality of singulated die, the carrier comprising:

a plurality of rails configured to hold the trays thereon; and

a plurality of protrusions extending downward from at least some of the rails, the protrusions adapted to engage a lid on a tray and apply a force thereto.

12. The carrier of claim 11, further comprising a protrusion on an upper surface of the carrier, the protrusion configured to be coupled to an automated carrier handling system.

13. The carrier of claim 11, further comprising a lower surface configured to engage a load port on a tool.

14. The carrier of claim 13, wherein the lower surface includes at least one groove therein.

15. The carrier of claim 11, wherein the rails are configured so that the carrier can accept two columns of multiple trays therein.

16. The carrier of claim 11, wherein the protrusions extending downward comprise springs.

17. The carrier of claim 11, wherein the protrusions extending downward comprise dome structures.

18. A carrier configured to hold a plurality of trays, the trays configured to hold a plurality of singulated die, the carrier comprising:

first and second sidewalls each including a plurality or rails extending therefrom;

a central wall positioned between the first and second sidewalls, the central wall including rails extending therefrom;

the rails positioned so that the carrier can accept two columns of multiple trays therein; and

wherein the carrier is configured so that the trays are individually accessible in any order from the carrier.

19. The carrier of claim 18, further comprising a structure extending outward from the carrier, the structure configured to be coupled to an automated carrier handling system.

20. The carrier of claim 18, further comprising a plurality of protrusions extending downward from at least some of the rails.

21. The carrier of claim 20, wherein the protrusions are configured to engage a lid on a tray and apply a downward force thereto.