Please download the dossier by clicking on the dossier button x
×

Support mounted electrically interconnected die assembly

  • US 9,305,862 B2
  • Filed: 04/25/2012
  • Issued: 04/05/2016
  • Est. Priority Date: 03/12/2008
  • Status: Expired due to Fees
First Claim
Patent Images

1. A device comprisinga support having electrical connection sites at a surface thereof, anda stacked die assembly mounted onto the surface and electrically connected to one or more of the connection sites,wherein each die in the stacked die assembly has peripheral interconnect terminalseach interconnect terminal electrically coupled with a die pad of a die of the stacked die assembly at an active side of the die andeach interconnect terminal is disposed at or overlying the active side of the die to which the interconnect terminal is coupled,wherein a plurality of die in the stack are electrically interconnected by a same line or a same trace of an electrically conductive polymer or an electrically conductive ink, andwherein the line or the trace of the electrically conductive polymer or the electrically conductive ink contacts the peripheral interconnect terminals on each of the respective electrically interconnected plurality of die,wherein the active side of at least a first die in the stack faces in a first direction, and the active side of at least a second die faces in a second direction, opposite the first direction.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×