Support mounted electrically interconnected die assembly

• US 9,305,862 B2
• Filed: 04/25/2012
• Issued: 04/05/2016
• Est. Priority Date: 03/12/2008
• Status: Expired due to Fees

• Current Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Original Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Inventors: McElrea, Simon J. S., Robinson, Marc E., Andrews, Lawrence Douglas Jr.
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US13/456,126
• Publication Number:
  US 20130099392A1
• Time in Patent Office: 1,441 Days
• Field of Search: 257/777, 257/773, 257/E21.599, 257/E23.01, 257/735, 257/E23.014, 257/E23.001, 257/686, 257/E25.013, 257/E23.146, 257/676, 257/712, 257/713, 257/E21.499, 257/E23.031, 257/E23.08, 257/E25.029, 257/737, 257/738, 257/778, 257/691, 257/696, 257/698
• US Class Current: 1/1
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/24145 the bodies being stacked
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2225/06524 Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06555 Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06562 at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/80 Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01067 : Holmium [Ho]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.

Claims

1. A device comprising

a support having electrical connection sites at a surface thereof, and

a stacked die assembly mounted onto the surface and electrically connected to one or more of the connection sites,

wherein each die in the stacked die assembly has peripheral interconnect terminals

each interconnect terminal electrically coupled with a die pad of a die of the stacked die assembly at an active side of the die and

each interconnect terminal is disposed at or overlying the active side of the die to which the interconnect terminal is coupled,

wherein a plurality of die in the stack are electrically interconnected by a same line or a same trace of an electrically conductive polymer or an electrically conductive ink, and

wherein the line or the trace of the electrically conductive polymer or the electrically conductive ink contacts the peripheral interconnect terminals on each of the respective electrically interconnected plurality of die,

wherein the active side of at least a first die in the stack faces in a first direction, and the active side of at least a second die faces in a second direction, opposite the first direction.

2. The device of claim 1 wherein the stacked die assembly comprises a stack of at least two nonpackaged die mounted one over another.

3. The device of claim 1 wherein the peripheral interconnect terminals on at least a first die in the stack comprise off-die terminals.

4. A device comprising

a first support having electrical connection sites at a surface thereof,

a second support mounted on the first support, and a stacked die assembly mounted onto a surface of the second support and electrically connected to one or more of the connection sites on the first support,

wherein each die in the stacked die assembly has peripheral interconnect terminals, each interconnect terminal electrically coupled with a die pad of a die of the stacked die assembly at an active side of the die and

each interconnect terminal is disposed at or overlying the active side of the die to which the interconnect terminal is coupled,

wherein a plurality of die in the stack are electrically interconnected by a line or a trace of an electrically conductive polymer or an electrically conductive ink, and

wherein the line or the trace of the electrically conductive polymer or the electrically conductive ink contacts the peripheral interconnect terminals on each of the respective electrically interconnected plurality of die.

5. The device of claim 4 wherein the plurality of die in the stack are oriented such that the active sides of the respective plurality of die all face in a first direction.

6. The device of claim 4 wherein the active side of at least a first die in the stack faces in a first direction, and the active side of at least a second die faces in a second direction, opposite the first direction.

7. The device of claim 4 wherein the stacked die assembly is interconnected such that the active sides of the respective plurality of die face toward said surface of said first support.

8. The device of claim 4 wherein the stacked die assembly is interconnected such that the back sides of the respective plurality of die face toward said surface of said first support.

9. The device of claim 4 wherein one or more of the plurality of die in the stack are oriented such that the respective active sides face away from said surface of said first support and one or more additional die in the stack are oriented such that the respective active sides face toward said surface of said first support.

10. The device of claim 4, wherein front and back sides of each die in the stacked die assembly define a plane, and wherein the stack of the plurality of die is oriented so that the plane of each of the plurality of die is nonparallel with said surface of said first support.

11. A method for making a device, comprising:

providing a stacked die assembly wherein each die in the stacked die assembly has peripheral interconnect terminals, each interconnect terminal electrically coupled with a die pad of a die of the stacked die assembly at an active side of the die and each interconnect terminal is disposed at or overlying the active side of the die to which the interconnect terminal is coupled,

wherein a plurality of die in the stack are electrically interconnected by a same line or a same trace of an electrically conductive polymer or and electrically conductive ink, and

wherein the line of the trace of the electrically conductive polymer of the electrically conductive ink contacts the peripheral interconnect terminals on each of the respective interconnected plurality of die;

providing a first support having electrical connection sites at a surface thereof;

providing a second support having a mount surface; and

mounting the die assembly on the mount surface of the second support and electrically connecting one or more of the peripheral interconnect terminals in the die assembly to one or more of the connection sites on the first support.

12. The method of claim 11, wherein the plurality of die in the stack are oriented such that the active sides of the respective plurality of die all face in a first direction.

13. The method of claim 11, wherein the active side of at least a first die in the stack faces in a first direction, and the active side of at least a second die faces in a second direction opposite the first direction.

14. The method of claim 11, wherein the stacked die assembly is interconnected such that the active sides of the respective plurality of die face toward said surface of said first support.

15. The method of claim 11, wherein the stacked die assembly is interconnected such that the back sides of the respective plurality of die face toward said surface of said first support.

16. The method of claim 11, wherein one or more of the plurality of die in the stack are oriented such that the respective active sides face away from said surface of said first support and one or more additional die in the stack are oriented such that the respective active sides face toward said surface of said first support.

17. The method of claim 11, wherein front and back sides of each die in the stacked die assembly define a plane, and wherein the stack of the plurality of die is oriented so that the plane of each of the plurality of die is nonparallel with said surface of said first support.