Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit
First Claim
1. A semiconductor device comprising:
- an active semiconductor device formed on a surface of a semiconductor substrate;
an isolation through silicon via (TSV) extending through said semiconductor substrate and laterally spaced from said active semiconductor device and next to a surface dopant impurity region of a first dopant impurity type disposed in said surface between said isolation TSV and said active semiconductor device, said surface dopant impurity region having a dopant concentration different from said substrate; and
said isolation TSV surrounded laterally by a surrounding dopant impurity region along part of a length of said isolation TSV, wherein said surrounding dopant impurity region extends from said surface to a termination location above a bottom surface of said semiconductor substrate.
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Abstract
Through silicon via (TSV) isolation structures are provided and suppress electrical noise such as may be propagated through a semiconductor substrate when caused by a signal carrying active TSV such as used in 3D integrated circuit packaging. The isolation TSV structures are surrounded by an oxide liner and surrounding dopant impurity regions. The surrounding dopant impurity regions may be P-type dopant impurity regions that are coupled to ground or N-type dopant impurity regions that may advantageously be coupled to VDD. The TSV isolation structure is advantageously disposed between an active, signal carrying TSV and active semiconductor devices and the TSV isolation structures may be formed in an array that isolates an active, signal carrying TSV structure from active semiconductor devices.
50 Citations
20 Claims
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1. A semiconductor device comprising:
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an active semiconductor device formed on a surface of a semiconductor substrate; an isolation through silicon via (TSV) extending through said semiconductor substrate and laterally spaced from said active semiconductor device and next to a surface dopant impurity region of a first dopant impurity type disposed in said surface between said isolation TSV and said active semiconductor device, said surface dopant impurity region having a dopant concentration different from said substrate; and said isolation TSV surrounded laterally by a surrounding dopant impurity region along part of a length of said isolation TSV, wherein said surrounding dopant impurity region extends from said surface to a termination location above a bottom surface of said semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device comprising:
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an active semiconductor device formed on a surface of a semiconductor substrate; an isolation through silicon via (TSV) extending through said semiconductor substrate, said isolation TSV laterally spaced front said active semiconductor device; a surface dopant impurity region of a first dopant impurity type disposed in said surface between said isolation TSV and said active semiconductor device, said surface dopant impurity region haying a dopant concentration different from said substrate; an oxide liner laterally surrounding said isolation TSV; and a surrounding dopant impurity region laterally surrounding the oxide liner along a part of a length of the oxide liner, wherein said surrounding dopant impurity region extends from said surface to a termination location above a bottom surface of said semiconductor substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A semiconductor device comprising:
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an active semiconductor device formed on a surface of a semiconductor substrate; an isolation through silicon via (TSV) extending through said semiconductor substrate, said isolation TSV laterally spaced from said active semiconductor device; a surface dopant impurity region of a first dopant impurity type disposed in said surface between said isolation TSV and said active semiconductor device, said surface dopant impurity region having a dopant concentration different from said substrate; an oxide liner laterally surrounding said isolation TSV, and extending from the surface to a bottom surface of the semiconductor substrate; and a surrounding dopant impurity region laterally surrounding the oxide liner along a part of a length of the oxide liner, wherein said surrounding dopant impurity region extends from said surface to a termination location above the bottom surface of said semiconductor substrate. - View Dependent Claims (19, 20)
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Specification