Biometric sensor chip having distributed sensor and control circuitry

• US 9,305,959 B2
• Filed: 06/03/2014
• Issued: 04/05/2016
• Est. Priority Date: 06/05/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Bhagavat, Milind S., Zhai, Jun
• Primary Examiner(s): Johns, Andrew W
• Application Number:
  US14/294,903
• Publication Number:
  US 20140361395A1
• Time in Patent Office: 672 Days
• US Class Current: 1/1
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures

Abstract

A sensor includes a sensor array formed on a first side of a substrate and at least one circuit operative to communicate with the sensor array formed on a second side of the substrate. At least one via extends through the substrate to electrically connect the sensor array to the at least one circuit. Placing the at least one circuit on the second side of the substrate allows the sensor array to occupy substantially all of the first side of the substrate.

Claims

1. A sensor, comprising:

a sensor array formed on a first side of a substrate, the sensor array comprising;

a first plurality of electrical traces defining a plurality of rows; and

a second plurality of electrical traces defining a plurality of columns, the plurality of columns intersecting the plurality of rows, thereby defining a plurality of intersections; and

a sensing element formed at each of the plurality of intersections;

at least one circuit operative to communicate with the sensor array formed on a second opposing side of the substrate; and

a plurality of vias extending through the substrate to electrically connect the sensor array to the at least one circuit, wherein each of the plurality of vias is formed at a unique end of one of the plurality of rows and the plurality of columns.

2. The sensor of claim 1, wherein the substrate electrically shields the circuitry from the sensor array.

3. A sensor, comprising:

a sensor array formed on a first side of a substrate, the sensor array comprising;

a first plurality of electrical traces defining a plurality of rows; and

a second plurality of electrical traces defining a plurality of columns, the plurality of columns intersecting the plurality of rows, thereby defining a plurality of intersections; and

a sensing element formed at each of the plurality of intersections;

at least one circuit operative to communicate with the sensor array formed on a second opposing side of the substrate; and

at least one via extending through the substrate to electrically connect the sensor array to the at least one circuit, wherein the at least one via underlies one trace chosen from the first and second plurality of traces.

4. A sensor, comprising:

a sensor array formed on a first side of a substrate, the sensor array comprising;

a first plurality of electrical traces defining a plurality of rows; and

a second plurality of electrical traces defining a plurality of columns, the plurality of columns intersecting the plurality of rows, thereby defining a plurality of intersections; and

a sensing element formed at each of the plurality of intersections;

at least one circuit operative to communicate with the sensor array formed on a second opposing side of the substrate; and

a plurality of vias extending through the substrate to electrically connect the sensor array to the at least one circuit, wherein

each of the plurality of vias underlies a trace chosen from the first or second plurality of traces.

5. The sensor of claim 4, wherein the plurality of vias separates the sensor array into a plurality of sensor sub-arrays.

6. The sensor of claim 5, wherein the plurality of sensor sub-arrays is separately addressable by the at least one circuit.

7. The sensor of claim 5, wherein at least one of the plurality of sensor sub-arrays comprises:

a subgroup of the plurality of rows; and

a subgroup of the plurality of columns, the subgroup of the plurality of columns intersecting the subgroup of the plurality of rows;

wherein an RC constant of the at least one of the plurality of sensor sub-arrays is less than an RC constant of the sensor array.

8. The sensor of claim 5, wherein the plurality of sub-arrays images a biometric parameter more quickly than the sensor array.

9. An electronic device, comprising:

a cover glass; and

a sensor positioned below the cover glass, the sensor comprising;

a sensor array formed on a first side of a substrate, wherein the sensor array comprises;

a first plurality of electrical traces defining a plurality of rows; and

a second plurality of electrical traces defining a plurality of columns, the plurality of columns intersecting the plurality of rows, thereby defining a plurality of intersections; and

a sensing element formed at each of the plurality of intersections;

at least one circuit operative to communicate with the sensor array formed on a second opposing side of the substrate; and

a plurality of vias extending through the substrate to electrically connect the sensor array to the at least one circuit;

wherein

each of the plurality of vias underlies an electrical trace chosen from the first or the second plurality of electrical traces;

or

each of the plurality of vias is formed at a unique end of one of the plurality of rows and the plurality of columns.

10. The electronic device of claim 9, wherein the cover glass and sensor are included in a button of the electronic device.

11. The electronic device of claim 9, further comprising a ground ring positioned between an outer surface of the electronic device and the cover glass.

12. The electronic device of claim 9, further comprising a flexible circuit electrically connected to the sensor.

13. The electronic device of claim 12, further comprising one or more connection surfaces positioned on the second side of the sensor and electrically connected to the flexible circuit.