Transfer-bonding method for light emitting devices
First Claim
1. A transfer-bonding method for light emitting devices comprising:
- (a) providing a first substrate having an elastic interlayer formed thereon and forming a plurality of light emitting devices arranged in array over the elastic interlayer;
(b) providing a second substrate having a mask layer formed thereon, wherein an area of the second substrate is exposed by the mask layer;
(c) bonding the first substrate and the second substrate, such that parts of the light emitting devices are bonded with the area of the second substrate exposed by the mask layer and the light emitting devices are pressed to embedded in the elastic interlayer by the second substrate, wherein a bonding strength between the parts of the light emitting devices and the second substrate is greater than an adhesion between the parts of the light emitting devices and the elastic interlayer; and
(d) separating the elastic interlayer from the parts of the light emitting devices bonded with the second substrate, such that the parts of the light emitting devices are transfer-bonded to the second substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and an interlayer sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The interlayers uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate.
21 Citations
17 Claims
-
1. A transfer-bonding method for light emitting devices comprising:
-
(a) providing a first substrate having an elastic interlayer formed thereon and forming a plurality of light emitting devices arranged in array over the elastic interlayer; (b) providing a second substrate having a mask layer formed thereon, wherein an area of the second substrate is exposed by the mask layer; (c) bonding the first substrate and the second substrate, such that parts of the light emitting devices are bonded with the area of the second substrate exposed by the mask layer and the light emitting devices are pressed to embedded in the elastic interlayer by the second substrate, wherein a bonding strength between the parts of the light emitting devices and the second substrate is greater than an adhesion between the parts of the light emitting devices and the elastic interlayer; and (d) separating the elastic interlayer from the parts of the light emitting devices bonded with the second substrate, such that the parts of the light emitting devices are transfer-bonded to the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
Specification