Transducer arrangement

• US 9,307,325 B2
• Filed: 01/07/2013
• Issued: 04/05/2016
• Est. Priority Date: 01/09/2012
• Status: Active Grant

• Current Assignee: BAE Systems Plc
• Original Assignee: BAE Systems Plc
• Inventors: Kent, Lionel William John, Bagshaw, John Martin, Rowe, Duncan Peter
• Primary Examiner(s): Ratcliffe, Luke
• Assistant Examiner(s): Baghdasaryan, Hovhannes
• Application Number:
  US14/371,089
• Publication Number:
  US 20140355388A1
• Time in Patent Office: 1,184 Days
• US Class Current: 1/1
• CPC Class Codes: B06B 3/00 Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
• CPC Class Codes: H04B 11/00 Transmission systems employing sonic, ultrasonic or infrasonic waves
• CPC Class Codes: H04B 13/00 Transmission systems characterised by the medium used for transmission, not provided for in groups H04B3/00 - H04B11/00
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: H10N 30/40 with electrical input and electrical output, e.g. functioning as transformers
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

There is disclosed a transducer apparatus for acoustic communications through a substrate at a predetermined center frequency, the apparatus comprising:—an active piezoelectric element for generating an acoustic signal; an intermediate layer, having a surface for accommodating the piezoelectric element, and having a first array of protrusions on a surface opposite the surface for accommodating the piezoelectric element; and a second array of protrusions at the substrate, wherein the active piezoelectric element is mounted onto the intermediate layer, and the intermediate layer is secured in position relative to the substrate such that the first array of protrusions faces the second array of protrusions such that the acoustic signal may propagate through the first and second arrays. There are further disclosed a method of mounting such an apparatus and a plate suitable for use in the transducer apparatus.

Claims

1. A transducer apparatus for acoustic communications through a substrate at a predetermined centre frequency, the apparatus comprising:

a piezoelectric element for generating an acoustic signal;

a carrier plate, having a first surface for accommodating the piezoelectric element, and having a first array of protrusions on a second surface opposite the first surface; and

a second array of protrusions at a surface of the substrate,

wherein the piezoelectric element is mounted onto the carrier plate, and the carrier plate is secured in position relative to the substrate such that the first array of protrusions opposes and is separated from the second array of protrusions by an inter-arrays medium that is different than the substrate such that the acoustic signal may propagate from the piezoelectric element, through the carrier plate, through the first array of protrusions, through the inter-arrays medium, and through the second array of protrusions.

2. A transducer apparatus according to claim 1 wherein the first array of protrusions are dimensioned and arranged such that the distance between the median point on a first first-array protrusion and the median point on an adjacent first-array protrusion is less than the wavelength of an acoustic wave in the carrier plate the predetermined frequency;

and/or the second array of protrusions are dimensioned and arranged such that the distance between the median point on a first second-array protrusion and the median point on an adjacent second-array protrusion is less than the wavelength of an acoustic wave in the substrate at the predetermined frequency.

3. A transducer apparatus according to claim 1 wherein at least one of the first array of protrusions and the second array of protrusions comprises binary protrusions, each binary protrusion extending generally perpendicularly from at least one of the surface of the substrate and the second surface of the carrier plate, each binary protrusion having a generally constantly-shaped cross section along the axis of the extension.

4. A transducer apparatus according to claim 3 wherein the constantly-shaped cross section is a rectangular cross section.

5. A transducer apparatus according to claim 1 wherein at least one of the first array of protrusions and the second array of protrusions comprises multi-step protrusions each multi-step protrusion having a first step extending generally perpendicularly from at least one of the surface of the substrate and the second surface of the carrier plate, the first step having a first shaped cross section, the first shaped cross section being generally constantly-shaped along the axis of the extension and having a second step extending from the first step, the second step having a second shaped cross section, the second shaped cross section being generally constantly-shaped along the axis of the extension, the second step having a smaller cross sectional area than the first.

6. A transducer apparatus according to claim 1 wherein at least one of the first array of protrusions and the second array of protrusions comprises tapered protrusions, each tapered protrusion extending from at least one of the surface of the substrate and the second surface of the carrier plate, each tapered protrusion having a base with a first cross section shape, and extending along the axis of the extension from the base to a second cross-section shape, and continuously tapering between the base and the second section shape.

7. A transducer apparatus according to claim 6 wherein the bases of the tapered protrusions are substantially adjacent and are arranged to tessellate.

8. A transducer apparatus according to claim 6 wherein the second cross-section shape is a point such that the protrusion has the form of a pyramid.

9. A transducer apparatus according to claim 1 wherein the predetermined centre frequency is within the range 1 MHz to 100 MHz.

10. A transducer apparatus according to claim 1 wherein a layer of adhesive is provided between the carrier plate and the substrate, and the adhesive has a thickness equal to at least a third of the wavelength of the signal predetermined centre frequency in the adhesive.

11. A method of arranging a transducer unit at a substrate, for acoustic communications through the substrate, comprising:

forming a first array of protrusions at a surface of the substrate;

providing a transducer unit for generating or receiving an acoustic signal at a predetermined centre frequency;

providing a carrier plate, having a first surface for accommodating the transducer unit;

forming a second array of protrusions upon a second surface of the carrier plate opposite the first surface; and

fixing the transducer unit onto the first surface of the carrier plate, the carrier plate being secured in position relative to the substrate such that the first array of protrusions opposes and is separated from the second array of protrusions by an inter-arrays medium that is different than the substrate such that the transducer unit is arranged to receive/transmit acoustic signals via the carrier plate, the second array of protrusions, the inter-arrays medium, and the first array of protrusions.

12. A method according to claim 11 wherein the transducer unit comprises an active piezoelectric element.

13. A method according to claim 11 wherein forming at least one of the first array of protrusions and the second array of protrusions is by embossing the respective surface of the transducer unit and substrate.

14. A method according to any of claims 11 wherein forming at least one of the first array of protrusions and the second array of protrusions comprises:

attaching a covering at the surface of the substrate or the carrier plate;

forming the protrusions at the covering.

15. A method according to claim 14 wherein the substrate is steel and the covering is formed from copper.

16. A carrier plate for attachment to an active piezoelectric element, the carrier plate comprising:

an array of reflection-loss mitigating protrusions for mitigating acoustic impedance loss in a transducer apparatus operating at a predetermined centre-frequency, and in an environment comprising a predetermined medium,

wherein the array of reflection-loss mitigating protrusions are dimensioned and arranged such that the distance between the median point on a first protrusion and the median point on an adjacent protrusion is less than the wavelength of an acoustic wave in the plate at the predetermined centre-frequency, and is less than the wavelength of an acoustic wave in the predetermined medium at the predetermined centre-frequency,

wherein the protrusions are pyramid-shaped and arranged to tessellate at their bases, and

wherein each pyramid has a height equal to or greater than 0.8 times the wavelength of the acoustic wave in the predetermined medium at the predetermined centre-frequency.

17. The plate according to claim 16 wherein the predetermined medium is fluid, and the plate is part of a sonar system.

18. The plate according to claim 16 wherein each pyramid has a height equal to or greater than 1.5 times the wavelength of the acoustic wave in the predetermined medium at the predetermined centre-frequency.