Apparatus and method for dissipating heat
First Claim
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1. An apparatus comprising:
- a display including a frame disposed at a bottom surface of the display;
a semiconductor chip;
a heat pipe affixed to the frame, the heat pipe being comprised of a thermally conductive material, wherein a surface of the heat pipe is adjacent to the semiconductor chip at a predetermined distance from the semiconductor chip; and
a battery, whereinthe battery includes a recess having three surfaces formed in an exterior portion of the battery and having a size corresponding to a size of the heat pipe and the recess is arranged on the battery to correspond to a location at which the heat pipe is affixed to the frame.
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Abstract
An apparatus includes a display. The display may include a frame disposed at a bottom surface of the display. The apparatus may include a semiconductor chip. A heat pipe constructed of a thermally conductive material may be affixed to the frame. A surface of the heat pipe may oppose the semiconductor chip at a predetermined distance from the semiconductor chip.
18 Citations
11 Claims
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1. An apparatus comprising:
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a display including a frame disposed at a bottom surface of the display; a semiconductor chip; a heat pipe affixed to the frame, the heat pipe being comprised of a thermally conductive material, wherein a surface of the heat pipe is adjacent to the semiconductor chip at a predetermined distance from the semiconductor chip; and a battery, wherein the battery includes a recess having three surfaces formed in an exterior portion of the battery and having a size corresponding to a size of the heat pipe and the recess is arranged on the battery to correspond to a location at which the heat pipe is affixed to the frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An apparatus comprising:
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a display including a frame disposed at a bottom surface of the display; a semiconductor chip; a heat dissipation means for dissipating heat from the semiconductor chip, wherein the heat dissipation means is affixed to the frame, the heat dissipation means is comprised of a thermally conductive material, and a surface of the heat dissipation means opposes the semiconductor chip at a predetermined distance from the semiconductor chip; and a battery, wherein the battery includes a recess having three surfaces formed in an exterior portion of the battery and having a size corresponding to a size of the heat dissipation means and the recess is arranged on the battery to correspond to a location at which the heat dissipation means is affixed to the frame.
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Specification