Apparatus and method for dissipating heat

• US 9,307,682 B2
• Filed: 04/30/2013
• Issued: 04/05/2016
• Est. Priority Date: 04/30/2013
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Fujieda, Tadaomi, Aono, Tatsuhito
• Primary Examiner(s): PAPE, ZACHARY
• Application Number:
  US13/873,862
• Publication Number:
  US 20140321058A1
• Time in Patent Office: 1,071 Days
• Field of Search: 36167946-67954, 361688-723, 165 804- 805, 165/104.33, 257/715, 257/E23.088, 174/15.2
• US Class Current: 1/1
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps
• CPC Class Codes: H05K 7/2099 Liquid coolant with phase change
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

An apparatus includes a display. The display may include a frame disposed at a bottom surface of the display. The apparatus may include a semiconductor chip. A heat pipe constructed of a thermally conductive material may be affixed to the frame. A surface of the heat pipe may oppose the semiconductor chip at a predetermined distance from the semiconductor chip.

Claims

1. An apparatus comprising:

a display including a frame disposed at a bottom surface of the display;

a semiconductor chip;

a heat pipe affixed to the frame, the heat pipe being comprised of a thermally conductive material, wherein a surface of the heat pipe is adjacent to the semiconductor chip at a predetermined distance from the semiconductor chip; and

a battery, wherein

the battery includes a recess having three surfaces formed in an exterior portion of the battery and having a size corresponding to a size of the heat pipe and the recess is arranged on the battery to correspond to a location at which the heat pipe is affixed to the frame.

2. The apparatus of claim 1, wherein

the heat pipe includes at least one flat surface.

3. The apparatus of claim 1, wherein

the heat pipe is arranged within the recess.

4. The apparatus of claim 1, wherein

a liquid is enclosed within the heat pipe, and

the heat pipe includes a high temperature region configured to collect steam generated in response to heating the liquid.

5. The apparatus of claim 4, wherein:

the heat pipe includes a low temperature region configured to collect condensed steam from the high temperature region, and

the low temperature region is connected to the high temperature region such that the condensed steam flows from the low temperature region to the high temperature region.

6. The apparatus of claim 1, wherein

the recess is arranged on the battery such that a positive electrode and a negative electrode of the battery are split in two or more parts.

7. The apparatus of claim 6, wherein

the positive electrode is provided on a first side of the recess and the negative electrode is provided on a second side of the recess.

8. The apparatus of claim 1, wherein

the semiconductor chip is disposed on the frame.

9. The apparatus of claim 8, wherein

the semiconductor chip is disposed on the frame on a first side of the recess.

10. The apparatus of claim 9, further comprising:

another semiconductor chip disposed on the frame on a second side of the recess that it opposite to the first side of the recess.

11. An apparatus comprising:

a display including a frame disposed at a bottom surface of the display;

a semiconductor chip;

a heat dissipation means for dissipating heat from the semiconductor chip, wherein the heat dissipation means is affixed to the frame, the heat dissipation means is comprised of a thermally conductive material, and a surface of the heat dissipation means opposes the semiconductor chip at a predetermined distance from the semiconductor chip; and

a battery, wherein

the battery includes a recess having three surfaces formed in an exterior portion of the battery and having a size corresponding to a size of the heat dissipation means and the recess is arranged on the battery to correspond to a location at which the heat dissipation means is affixed to the frame.