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Ceramic encapsulation of an implantable device

  • US 9,308,381 B2
  • Filed: 06/17/2014
  • Issued: 04/12/2016
  • Est. Priority Date: 06/17/2013
  • Status: Active Grant
First Claim
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1. An implantable device, comprising:

  • a flexible carrier configured for implantation in a subject;

    at least one pair of modulation electrodes associated with the carrier;

    an antenna configured to receive an electrical signal disposed on the flexible carrier;

    a circuit electrically coupling the antenna to the at least one pair of modulation electrodes; and

    a rigid housing having an upper portion and a lower portion,whereinone or more of the upper portion or the lower portion is constructed of ceramic, andat least one of the antenna and the circuit are located within the rigid housing.

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