Mass transfer tool manipulator assembly

• US 9,308,649 B2
• Filed: 02/25/2013
• Issued: 04/12/2016
• Est. Priority Date: 02/25/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: LuxVue Techonology Corporation (Apple Inc.)
• Inventors: Golda, Dariusz, Higginson, John A., Bibl, Andreas, Parks, Paul Argus, Bathurst, Stephen Paul
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US13/776,158
• Publication Number:
  US 20140241843A1
• Time in Patent Office: 1,142 Days
• US Class Current: 1/1
• CPC Class Codes: B25J 15/0052 multiple gripper units or multiple end effectors
• CPC Class Codes: B25J 15/0085 with means for applying an electrostatic force on the object to be gripped
• CPC Class Codes: B25J 17/0208 Compliance devices
• CPC Class Codes: B25J 7/00 Micromanipulators specimen supports for investigating or analysing materials G01N23/2204; associated with microscopes G02B21/32; means for supporting or positioning the objects or the material in discharge tubes H01J37/20
• CPC Class Codes: B25J 9/0015 Flexure members, i.e. parts of manipulators having a narrowed section allowing articulation by flexion
• CPC Class Codes: B25J 9/1015 using additional, e.g. microadjustment of the end effector
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67721 the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames H01L21/6773 takes precedence
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 2224/75251 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75252 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75282 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/7565 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/75723 Electrostatic holding means
• CPC Class Codes: H01L 2224/75725 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75823 Pivoting mechanism
• CPC Class Codes: H01L 2224/759 Means for monitoring the connection process
• CPC Class Codes: H01L 2224/75901 using a computer, e.g. fully- or semi-automatic bonding
• CPC Class Codes: H01L 2224/7592 Load or pressure adjusting means, e.g. sensors
• CPC Class Codes: H01L 2224/7598 : specially adapted for batch processes
• CPC Class Codes: H01L 2224/75984 : of other portions
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1461 : MEMS

Abstract

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Claims

1. A mass transfer tool manipulator assembly, comprising:

a housing;

a tip-tilt-z flexure including a top flexure component, a bottom flexure component, and a flexible coupling connecting the top flexure component with the bottom flexure component, wherein the top flexure component joins with the housing;

an actuator assembly operably coupled with the bottom flexure component, wherein actuation of the actuator assembly moves the bottom flexure component relative to the top flexure component; and

a micro pick up array mount having a pivot platform coupled with a compliant element, and a displacement sensor integrated with the compliant element, wherein the micro pick up array mount is coupled with the bottom flexure component.

2. The mass transfer tool manipulator assembly of claim 1, wherein the top flexure component and the bottom flexure component each comprise a flange.

3. The mass transfer tool manipulator assembly of claim 1, further comprising a distribution plate coupling the actuator assembly with the bottom flexure component.

4. The mass transfer tool manipulator assembly of claim 1, further comprising a base laterally around the pivot platform, wherein the compliant element is between the pivot platform and the base, wherein the compliant element is coupled with the pivot platform at an inner pivot and coupled with the base at an outer pivot.

5. The mass transfer tool manipulator assembly of claim 4, wherein the compliant element comprises a beam, wherein the displacement sensor comprises a strain gauge, and wherein the strain gauge is attached to the beam.

6. The mass transfer tool manipulator assembly of claim 5, further comprising a reference strain gauge adjacent to the strain gauge on the beam, wherein the strain gauge and the reference strain gauge provide adjacent legs in a half Wheatstone bridge.

7. The mass transfer tool manipulator assembly of claim 3, further comprising a temperature sensor on the pivot platform.

8. The mass transfer tool manipulator assembly of claim 7, further comprising a heating element over the pivot platform.

9. The mass transfer tool manipulator assembly of claim 4, further comprising a base operating voltage contact on the base in electrical connection with a pivot platform operating voltage contact on the pivot platform.

10. The mass transfer tool manipulator assembly of claim 4, further comprising a base clamp contact on the base in electrical connection with a clamp electrode at a bonding site on the pivot platform.

11. The mass transfer tool manipulator assembly of claim 4, further comprising a bonding site on the pivot platform, wherein the bonding site comprises a metal selected from the group consisting of:

gold, copper, and aluminum.

12. The mass transfer tool manipulator assembly of claim 8, further comprising a displacement sensor contact on the base in electrical connection with the displacement sensor.

13. The mass transfer tool manipulator assembly of claim 12, further comprising a position sensing module in electrical connection with the displacement sensor through the displacement sensor contact.

14. The mass transfer tool manipulator assembly of claim 13, wherein the displacement sensor contact is in electrical connection with the position sensing module through a flex circuit.

15. The mass transfer tool manipulator assembly of claim 13, wherein the displacement sensor contact is in electrical connection with the position sensing module through a spring contact.

16. The mass transfer tool manipulator assembly of claim 13, further comprising an insulation plate between the heating element and the position sensing module, wherein the base is coupled with the insulation plate, and wherein the insulation plate couples the micro pick up array mount with the distribution plate.

17. The mass transfer tool manipulator assembly of claim 1, further comprising a micro pick up array having a substrate supporting an electrostatic transfer head, the micro pick up array joinable with the pivot platform.