Measuring device for measuring distance

• US 9,310,197 B2
• Filed: 05/25/2012
• Issued: 04/12/2016
• Est. Priority Date: 05/26/2011
• Status: Active Grant

• Current Assignee: Hilti Aktiengesellschaft (Hilti Martin Family Trust)
• Original Assignee: Hilti Aktiengesellschaft (Hilti Martin Family Trust)
• Inventors: Gogolla, Torsten, Tiefenthaler, Stefan, Seifert, Helmut, Schusser, Gero
• Primary Examiner(s): Ratcliffe, Luke
• Assistant Examiner(s): Rodriguez, Vicente
• Application Number:
  US13/481,396
• Publication Number:
  US 20130135604A1
• Time in Patent Office: 1,418 Days
• Field of Search: 356/4.01
• US Class Current: 1/1
• CPC Class Codes: G01C 3/08 Use of electric radiation detectors
• CPC Class Codes: G01S 17/08 for measuring distance only indirect measurement G01S17/46; active triangulation systems G01S17/48
• CPC Class Codes: G01S 7/4812 transmitted and received beams following a coaxial path
• CPC Class Codes: G01S 7/4813 Housing arrangements
• CPC Class Codes: G01S 7/4972 Alignment of sensor

Abstract

A measuring device and a method for adjusting the measuring device is disclosed. The device includes a first electro-optical component, a second electro-optical component, a beam-shaping optical element, an optics carrier, and a printed circuit board. The optics carrier includes a first receptacle, where the first electro-optical component is mounted in the first receptacle, and a second receptacle, where the beam-shaping optical element is mounted in the second receptacle. The printed circuit board includes a third receptacle, where the second electro-optical component is mounted in the third receptacle. The first electro-optical component and the beam-shaping optical element are adjustable relative to the optics carrier in a direction of a respective optical axis of the first electro-optical component and the beam-shaping optical element and the second electro-optical component is adjustable and fixable in a plane essentially perpendicular to an optical axis of the second electro-optical element.

Claims

1. A measuring device for measuring a distance between a reference mark and a target object, comprising:

a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;

a beam-shaping optical element;

a beam-splitting optical element, wherein the laser beam or the reception beam is deflectable by the beam-splitting optical element;

a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, a second receptacle, wherein the beam-shaping optical element is mounted in the second receptacle, and a third receptacle, wherein the beam-splitting optical element is mounted in the third receptacle;

a printed circuit board including a further receptacle, wherein the second electro-optical component is mounted in the further receptacle; and

a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;

wherein, during an adjustment of the measuring device, the first electro-optical component and the beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and the beam-shaping optical element, and the second electro-optical component is adjustable and fixable only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component, such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.

2. The measuring device according to claim 1, wherein, during the adjustment of the measuring device, the printed circuit board is adjustable relative to the monolithic optics carrier in the plane and a contact surface of the monolithic optics carrier abuts the printed circuit board in a direction of the associated optical axis of the second electro-optical component.

3. The measuring device according to claim 1, wherein the second electro-optical component is disposed on a side of the printed circuit board that faces the monolithic optics carrier.

4. The measuring device according to claim 1, wherein the second electro-optical component is adjustable relative to the printed circuit board in the plane.

5. The measuring device according to claim 1, wherein the second electro-optical component is disposed on a rear side of the printed circuit board facing away from the monolithic optics carrier.

6. The measuring device according to claim 1, wherein the monolithic optics carrier is a metallic material.

7. The measuring device according to claim 1, wherein the connecting device is a screwed connector.

8. The measuring device according to claim 1, wherein the connecting device is an adhesive and a screwed connector.

9. A method for adjusting a measuring device, wherein the measuring device comprises:

a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;

a beam-shaping optical element;

a beam-splitting optical element, wherein the laser beam or the reception beam is deflectable by the beam-splitting optical element;

a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, and a second receptacle, wherein the beam-shaping optical element is mounted in the second receptacle, and a third receptacle, wherein the beam-splitting optical element is mounted in the third receptacle;

wherein the first electro-optical component and the beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and the beam-shaping optical element;

a printed circuit board including a further receptacle, wherein the second electro-optical component is mounted in the further receptacle; and

a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;

and comprising the steps of;

adjusting the first electro-optical component and the beam-shaping optical element relative to the monolithic optics carrier in the direction of the associated respective optical axis of the first electro-optical component and the beam-shaping optical element;

abutting the printed circuit board against the monolithic optics carrier; and

adjusting the second electro-optical component only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.

10. The method according to claim 9, wherein the step of adjusting the second electro-optical component only in the plane essentially perpendicular to the associated optical axis of the second electro-optical component includes the step of adjusting the printed circuit board relative to the monolithic optics carrier in the plane.

11. The method according to claim 9, wherein the second electro-optical component is disposed on a side of the printed circuit board that faces the monolithic optics carrier.

12. The method according to claim 9, wherein the step of adjusting the second electro-optical component only in the plane essentially perpendicular to the associated optical axis of the second electro-optical component includes the step of adjusting the second electro-optical component relative to the printed circuit board in the plane.

13. The method according to claim 9, wherein the second electro-optical component is disposed on a rear side of the printed circuit board facing away from the monolithic optics carrier.

14. The method according to claim 9, wherein the monolithic optics carrier is a metallic material.

15. A measuring device for measuring a distance between a reference mark and a target object, comprising:

a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;

a beam-shaping optical element;

a beam-splitting optical element, wherein the laser beam or the reception beam is deflectable by the beam-splitting optical element;

a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, and a second receptacle, wherein the beam-shaping optical element is mounted in the second receptacle, and wherein the beam-splitting optical element is an aperture mirror and is integrated into the monolithic optics carrier;

a printed circuit board including a third receptacle, wherein the second electro-optical component is mounted in the third receptacle; and

a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;

wherein, during an adjustment of the measuring device, the first electro-optical component and the beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and the beam-shaping optical element, and the second electro-optical component is adjustable and fixable only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component, such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.

16. A method for adjusting a measuring device, wherein the measuring device comprises:

a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;

a beam-shaping optical element;

a beam-splitting optical element, wherein the laser beam or the reception beam is deflectable by the beam-splitting optical element;

a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, and a second receptacle, wherein the beam-shaping optical element is mounted in the second receptacle, and wherein the beam-splitting optical element is an aperture mirror and is integrated into the monolithic optics carrier;

wherein the first electro-optical component and the beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and the beam-shaping optical element;

a printed circuit board including a third receptacle, wherein the second electro-optical component is mounted in the third receptacle; and

a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;

and comprising the steps of;

adjusting the first electro-optical component and the beam-shaping optical element relative to the monolithic optics carrier in the direction of the associated respective optical axis of the first electro-optical component and the beam-shaping optical element;

abutting the printed circuit board against the monolithic optics carrier; and

adjusting the second electro-optical component only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.

17. A measuring device for measuring a distance between a reference mark and a target object, comprising:

a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;

a first beam-shaping optical element and a second beam-shaping optical element which differs from the first beam-shaping optical element, wherein the first and second beam-shaping optical elements shape the laser beam and the reception beam;

a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, a second receptacle, wherein the first beam-shaping optical element is mounted in the second receptacle, and a third receptacle, wherein the second beam-shaping optical element is mounted in the third receptacle;

a printed circuit board including a further receptacle, wherein the second electro-optical component is mounted in the further receptacle; and

a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;

wherein, during an adjustment of the measuring device, the first electro-optical component and/or the first beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and/or the first beam-shaping optical element, the second beam-shaping optical element is only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the second beam-shaping optical element, and the second electro-optical component is adjustable and fixable only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component, such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.

18. A method for adjusting a measuring device, wherein the measuring device comprises:

a first electro-optical component and a second electro-optical component which differs from the first electro-optical component, wherein the first and second electro-optical components include a beam source generating a laser beam and a detector detecting a reception beam;

a first beam-shaping optical element and a second beam-shaping optical element which differs from the first beam-shaping optical element, wherein the first and second beam-shaping optical elements shape the laser beam and the reception beam;

a monolithic optics carrier including a first receptacle, wherein the first electro-optical component is mounted in the first receptacle, a second receptacle, wherein the first beam-shaping optical element is mounted in the second receptacle, and a third receptacle, wherein the second beam-shaping optical element is mounted in the third receptacle;

wherein the first electro-optical component and/or the first beam-shaping optical element are only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the first electro-optical component and/or the first beam-shaping optical element and wherein the second beam-shaping optical element is only adjustable relative to the monolithic optics carrier in a direction of an associated respective optical axis of the second beam-shaping optical element;

a printed circuit board including a further receptacle, wherein the second electro-optical component is mounted in the further receptacle; and

a connecting device, wherein the monolithic optics carrier is connectable to the printed circuit board by the connecting device;

and comprising the steps of;

adjusting the first electro-optical component and/or the first beam-shaping optical element relative to the monolithic optics carrier in the direction of the associated respective optical axis of the first electro-optical component and/or the first beam-shaping optical element;

adjusting the second beam-shaping optical element relative to the monolithic optics carrier in the direction of the associated respective optical axis of the second beam-shaping optical element;

abutting the printed circuit board against the monolithic optics carrier; and

adjusting the second electro-optical component only in a plane essentially perpendicular to an associated optical axis of the second electro-optical component such that no gap develops between the printed circuit board and the second electro-optical component in a direction of the associated optical axis of the second electro-optical component and such that no solder bridge exists between the printed circuit board and the second electro-optical component.