Sensor device regulation and related systems and methods

• US 9,310,200 B2
• Filed: 06/26/2013
• Issued: 04/12/2016
• Est. Priority Date: 07/03/2012
• Status: Active Grant

• Current Assignee: Sony Semiconductor Solutions Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Kabasawa, Hidetoshi, Watanabe, Shigeto
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US13/927,299
• Publication Number:
  US 20140007682A1
• Time in Patent Office: 1,021 Days
• Field of Search: 734/93, 734/31, 735/041.2, 735/041.4, 735/040.4, 735/040.2, 735/041.6
• US Class Current: 1/1
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01C 19/5656 the devices involving a micromechanical structure
• CPC Class Codes: G01P 1/023 for acceleration measuring devices

Abstract

A sensor device includes a sensor element; and a wiring substrate having a first joint surface electrically joined with the sensor element, a substrate body that contains an organic insulating material and in which an electronic component is embedded, and a regulation part that regulates the first joint surface from deforming.

Claims

1. A sensor device comprising:

a sensor element; and

a wiring substrate comprising;

a first joint surface electrically joined with the sensor element,

a substrate body that contains an organic insulating material and in which an electronic component is embedded, and

a regulation part that regulates deformation of the first joint surface caused by thermal expansion or contraction of the sensor element.

2. The sensor device according to claim 1, wherein

the first joint surface is disposed on the substrate body;

and

the regulation part includes a core part embedded in the substrate body.

3. The sensor device according to claim 2, wherein

the core part is annularly disposed around the electronic component.

4. The sensor device according to claim 3, wherein

the wiring substrate further includes a second joint surface that faces the first joint surface;

and

the substrate body further includes

a first wiring layer disposed on a side of the first joint surface, and

a second wiring layer that is disposed on a side of the second joint surface and faces the first wiring layer with the core part and the electronic component interposed therebetween.

5. The sensor device according to claim 2, further comprising a shield part that is disposed on the first joint surface and covers the sensor element.

6. The sensor device according to claim 5, wherein

the regulation part further includes a first joint part that joins the shield part and the core part.

7. The sensor device according to claim 6, wherein

an absolute value of a difference of linear expansion coefficients of the shield part and the sensor element is smaller than an absolute value of a difference of linear expansion coefficients of the organic insulating material and the sensor element.

8. The sensor device according to claim 2, wherein

an absolute value of a difference of linear expansion coefficients of the core part and the sensor element is smaller than an absolute value of a difference of linear expansion coefficients of the organic insulating material and the sensor element.

9. The sensor device according to claim 1, wherein

the regulation part includes a base material of an inorganic insulating material disposed between the sensor element and the substrate body;

and

the first joint surface is disposed on the base material.

10. The sensor device according claim 9, wherein

the regulation part further includes a core part embedded in the substrate body.

11. The sensor device according to claim 10, wherein

the regulation part further includes a second joint part that joins the base material and the core part.

12. The sensor device according to claim 9, wherein

the base material is mounted on the substrate body;

and

the wiring substrate further includes an adhesive layer that is filled in between the base material and the substrate body.

13. The sensor device according to claim 9, wherein

the base material is disposed opposite to the first joint surface and further includes a third joint surface that is electrically joined with the electronic component.

14. The sensor device according to claim 9, further comprising a shield part that is disposed on the wiring substrate and covers the sensor element.

15. The sensor device according to claim 14, wherein

the shield part is disposed on the first joint surface.

16. The sensor device according to claim 15, wherein

the substrate body includes a fourth joint surface that faces the base material;

and

the shield part is disposed on the fourth joint surface and covers the base material and the sensor element.

17. The sensor device according to claim 9, wherein

the substrate body has a longitudinal elastic modulus smaller than that of the base material.

18. The sensor device according to claim 1, wherein

the sensor element faces the electronic component with the first joint surface interposed therebetween.

19. The sensor device according to claim 1, wherein

the sensor element is a gyrosensor.