Detecting defects on a wafer using template image matching

• US 9,311,698 B2
• Filed: 01/09/2013
• Issued: 04/12/2016
• Est. Priority Date: 01/09/2013
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation
• Original Assignee: KLA-Tencor Corporation
• Inventors: Chu, Xing, Lauber, Jan A., Runyon, J. Rex
• Primary Examiner(s): Dunphy, David F
• Application Number:
  US13/737,677
• Publication Number:
  US 20140193065A1
• Time in Patent Office: 1,189 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: G06T 2207/20012 Locally adaptive
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/0004 Industrial image inspection
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

Various embodiments for detecting defects on a wafer are provided. Some embodiments include matching a template image, in which at least some pixels are associated with regions in the device having different characteristics, to output of an electron beam inspection system and applying defect detection parameters to pixels in the output based on the regions that the pixels in the output are located within to thereby detect defects on the wafer.

Claims

1. A computer-implemented method for detecting defects on a wafer, comprising:

generating a template image using information about a device being formed on a wafer, wherein at least some pixels in the template image are associated with regions in the device having different characteristics;

acquiring output of an electron beam inspection system for the wafer;

separating the template image into different regions that correspond to different regions in the device prior to acquiring the output;

determining which of the different regions in the device that the pixels in the template image are located in based on results of said separating prior to acquiring the output;

matching the template image to the output based on patterns in the template image and the output;

identifying the regions in the device that pixels in the output are located within based on the pixels of the template image that match the pixels in the output and the different regions in the device in which the pixels of the template image are located, wherein said generating, said acquiring, said separating, said determining, said matching, and said identifying are performed prior to defect detection performed for the wafer; and

applying defect detection parameters to the pixels in the output based on the regions in the device that the pixels in the output are located within to thereby detect defects on the wafer, wherein said generating, said acquiring, said separating, said determining, said matching, said identifying, and said applying are performed using a computer system.

2. The method of claim 1, wherein the information comprises design data for the device.

3. The method of claim 1, wherein the information comprises a high resolution image of the device being formed on the wafer.

4. The method of claim 1, wherein determining which of the different regions in the device that the pixels in the template image are located in is performed based on properties of the device, defects of interest, known nuisance defects, or some combination thereof.

5. The method of claim 1, wherein at least one of the regions in the device corresponds to only a single contact within a repeating memory cell structure of the device.

6. The method of claim 1, wherein at least some of the regions in the device correspond to different types of contacts within a repeating memory cell structure of the device.

7. The method of claim 1, wherein at least one of the regions in the device corresponds to an oxide area between contacts in a repeating memory cell structure of the device, and wherein said applying is not performed for the oxide area.

8. The method of claim 1, further comprising generating multiple template images using the information about the device, wherein each of the multiple template images is generated for one of multiple pixel sizes and optical conditions for the electron beam inspection system.

9. The method of claim 1, wherein the template image corresponds to a unit cell within an array region of the device, and wherein said matching comprises matching the template image to the pixels in the output corresponding to one unit cell in the array region based on the patterns and propagating the matching throughout the array region based on information about the unit cell and the array region.

10. The method of claim 1, wherein the template image corresponds to a unit cell within an array region of the device, and wherein said matching is performed for an entire row and column of unit cells within a care area in the array region.

11. The method of claim 1, wherein the template image corresponds to a unit cell within an array region of the device, and wherein said matching is performed for every unit cell within the array region.

12. The method of claim 1, wherein said identifying comprises overlaying a region segmentation scheme onto the pixels in the output that match the template image.

13. The method of claim 1, wherein the defect detection parameters comprise whether or not to perform defect detection in one or more of the regions in the device and for the regions in the device in which the defect detection is to be performed, a threshold that depends on the regions in the device in which the pixels in the output are located, and wherein the threshold is to be applied to a difference between the pixels in the output and reference pixels.

14. The method of claim 1, wherein said applying comprises averaging multiple pixels in the output corresponding to multiple unit cells in an array region of the device to generate a reference image, subtracting the reference image from a test image in the output that corresponds to one of the multiple unit cells to generate a difference image, and applying the defect detection parameters to the difference image based on the regions in the device that pixels in the difference image are located within.

15. The method of claim 1, further comprising automatically associating the detected defects with the regions in the device in which they are located.

16. The method of claim 1, further comprising classifying the detected defects based on the regions in the device in which they are located.

17. The method of claim 1, wherein each contact type in the device is associated with a different one of the regions in the device, the method further comprising displaying density of the detected detects in said each contact type.

18. A non-transitory computer-readable medium containing program instructions stored therein for causing a computer system to perform a computer-implemented method for detecting defects on a wafer, wherein the computer-implemented method comprises:

generating a template image using information about a device being formed on a wafer, wherein at least some pixels in the template image are associated with regions in the device having different characteristics;

acquiring output of an electron beam inspection system for the wafer;

separating the template image into different regions that correspond to different regions in the device prior to acquiring the output;

determining which of the different regions in the device that the pixels in the template image are located in based on results of said separating prior to acquiring the output;

matching the template image to the output based on patterns in the template image and the output;

identifying the regions, in the device that pixels in the output are located within based on the pixels of the template image that match the pixels in the output and the different regions in the device in which the pixels of the template image are located, wherein said generating, said acquiring, said separating, said determining, said matching, and said identifying are performed prior to defect detection performed for the wafer; and

applying defect detection parameters to the pixels in the output based on the regions in the device that the pixels in the output are located within to thereby detect defects on the wafer.

19. A system configured to detect defects on a wafer, comprising:

an electron beam inspection subsystem configured to acquire output for a wafer; and

a computer subsystem configured to;

generate a template image using information about a device being formed on the wafer, wherein at least some pixels in the template image are associated with regions in the device having different characteristics;

separate the template image into different regions that correspond to different regions in the device prior to acquisition of the output by the electron beam inspection subsystem;

determine which of the different regions in the device that the pixels in the template image are located in based on results of separating the template image into the different regions prior to acquisition of the output by the electron beam inspection subsystem;

match the template image to the output based on patterns in the template image and the output;

identify the regions in the device that pixels in the output are located within based on the pixels of the template image that match the pixels in the output and the different regions in the device in which the pixels of the template image are located, wherein the computer subsystem is further configured to generate the template image, separate the template image, determine which of the different regions, match the template image, and identify the regions prior to defect detection performed for the wafer; and

apply defect detection parameters to the pixels in the output based on the regions in the device that the pixels in the output are located within to thereby detect defects on the wafer.

20. The system of claim 19, wherein the information comprises design data for the device.

21. The system of claim 19, wherein the information comprises a high resolution image of the device being formed on the wafer.

22. The system of claim 19, wherein the computer subsystem is further configured to determine which of the different regions in the device that the pixels in the template image are located in based on properties of the device, defects of interest, known nuisance defects, or some combination thereof.

23. The system of claim 19, wherein at least one of the regions in the device corresponds to only a single contact within a repeating memory cell structure of the device.

24. The system of claim 19, wherein at least some of the regions in the device correspond to different types of contacts within a repeating memory cell structure of the device.

25. The system of claim 19, wherein at least one of the regions in the device corresponds to an oxide area between contacts in a repeating memory cell structure of the device, and wherein the defect detection parameters are not applied to the pixels within the oxide area.

26. The system of claim 19, wherein the computer subsystem is further configured to generate multiple template images using the information about the device, and wherein each of the multiple template images is generated for one of multiple pixel sizes and optical conditions for the electron beam inspection subsystem.

27. The system of claim 19, wherein the template image corresponds to a unit cell within an array region of the device, and wherein the computer subsystem is further configured to match the template image to the output by matching the template image to the pixels in the output corresponding to one unit cell in the array region based on the patterns and propagating the matching throughout the array region based on information about the unit cell and the array region.

28. The system of claim 19, wherein the template image corresponds to a unit cell within an array region of the device, and wherein the computer subsystem is further configured to match the template image to the output for an entire row and column of unit cells within a care area in the array region.

29. The system of claim 19, wherein the template image corresponds to a unit cell within an array region of the device, and wherein the computer subsystem is further configured to match the template image to the output for every unit cell within the array region.

30. The system of claim 19, wherein the computer subsystem is further configured to identify the regions that the pixels in the output are located within by overlaying a region segmentation scheme onto the pixels in the output that match the template image.

31. The system of claim 19, wherein the defect detection parameters comprise whether or not to perform defect detection in one or more of the regions in the device and for the regions in the device in which the defect detection is to be performed, a threshold that depends on the regions in the device in which the pixels in the output are located, and wherein the threshold is to be applied to a difference between the pixels in the output and reference pixels.

32. The system of claim 19, wherein the computer subsystem is further configured to apply the defect detection parameters by averaging multiple pixels in the output corresponding to multiple unit cells in an array region of the device to generate a reference image, subtracting the reference image from a test image in the output that corresponds to one of the multiple unit cells to generate a difference image, and applying the defect detection parameters to the difference image based on the regions in the device that pixels in the difference image are located within.

33. The system of claim 19, wherein the computer subsystem is further configured to automatically associate the detected defects with the regions in the device in which they are located.

34. The system of claim 19, wherein the computer subsystem is further configured to classify the detected defects based on the regions in the device in which they are located.

35. The system of claim 19, wherein each contact type in the device is associated with a different one of the regions in the device, and wherein the computer subsystem is further configured to display density of the detected defects in said each contact type.