Integrated connector modules for extending transformer bandwidth with mixed-mode coupling using a substrate inductive device
First Claim
1. An integrated connector module, comprising:
- a connector housing having a plurality of substrate inductive devices disposed therein, at least one of the substrate inductive devices comprising;
a substrate comprising one or more via-in-via connections and one or more single via connections, each of the one or more via-in-via connections comprising an inner via and an outer via separated from the inner via by a non-conductive material; and
a toroidal core disposed adjacent to the one or more via-in-via connections and the one or more single via connections;
wherein presence of both the one or more via-in-via connections and the one or more single via connections is configured to adjust a ratio of leakage inductance to distributed capacitance of the at least one of the substrate inductive devices.
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Accused Products
Abstract
An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.
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Citations
20 Claims
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1. An integrated connector module, comprising:
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a connector housing having a plurality of substrate inductive devices disposed therein, at least one of the substrate inductive devices comprising; a substrate comprising one or more via-in-via connections and one or more single via connections, each of the one or more via-in-via connections comprising an inner via and an outer via separated from the inner via by a non-conductive material; and a toroidal core disposed adjacent to the one or more via-in-via connections and the one or more single via connections; wherein presence of both the one or more via-in-via connections and the one or more single via connections is configured to adjust a ratio of leakage inductance to distributed capacitance of the at least one of the substrate inductive devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated connector module, comprising:
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a connector housing having a plurality of substrate inductive devices disposed therein, at least one of the substrate inductive devices comprising; a substrate comprising a plurality of via-in-via connections and a plurality of single via connections, the plurality of via-in-via connections each comprising an inner via and an outer via separated from the inner via by a non-conductive material; and a toroidal core; wherein the plurality of single via connections and some of the plurality of the via-in-via connections are disposed on an external periphery of the toroidal core, and other ones of the plurality of via-in-via connections are disposed on an internal periphery of the toroidal core; and wherein the plurality of via-in-via connections and the plurality of single via connections are configured to correct an inductive/capacitive ratio of the at least one of the substrate inductive devices. - View Dependent Claims (10, 11, 12, 13, 14)
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15. An integrated connector module, comprising:
a connector housing having a plurality of substrate inductive devices disposed therein, at least one of the substrate inductive devices comprising; a substrate comprising a plurality of via-in-via connections and a plurality of single via connections, each of the via-in-via connections comprising an inner via and an outer via separated from the inner via by a non-conductive material; a toroidal core disposed adjacent to the via-in-via connections and the single via connections; a first trace which joins at least a portion of a first via-in-via connection disposed on an inner periphery of the toroidal core to a first one of the single via connections disposed on an outer periphery of the toroidal core; and a second trace which joins at least a portion of the first via-in-via connection disposed on the inner periphery of the toroidal core to a second one of the single via connections disposed on the outer periphery of the toroidal core, the first trace and the second trace being configured to at least partially overlap. - View Dependent Claims (16, 17, 18, 19, 20)
Specification