Integrated connector modules for extending transformer bandwidth with mixed-mode coupling using a substrate inductive device

• US 9,312,059 B2
• Filed: 10/18/2013
• Issued: 04/12/2016
• Est. Priority Date: 11/07/2012
• Status: Expired due to Fees

• Current Assignee: Pulse Electronics Incorporated (Yageo Corporation)
• Original Assignee: Pulse Electronics Incorporated (Yageo Corporation)
• Inventors: Dinh, Thuyen, Saboori, Mohammad, Greene, Mark, Abedmamoore, Hamlet
• Primary Examiner(s): NGUYEN, TUYEN T
• Application Number:
  US14/057,900
• Publication Number:
  US 20140127944A1
• Time in Patent Office: 907 Days
• Field of Search: 336/65, 336/83, 336/200, 336/232, 336/225, 336/229
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 17/06 with core substantially closed in itself, e.g. toroid
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 27/28 Coils; Windings; Conductive connections
• CPC Class Codes: H01F 41/04 for manufacturing coils coils for transformer or inductances H01F27/28
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01F 5/00 Coils superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Claims

1. An integrated connector module, comprising:

a connector housing having a plurality of substrate inductive devices disposed therein, at least one of the substrate inductive devices comprising;

a substrate comprising one or more via-in-via connections and one or more single via connections, each of the one or more via-in-via connections comprising an inner via and an outer via separated from the inner via by a non-conductive material; and

a toroidal core disposed adjacent to the one or more via-in-via connections and the one or more single via connections;

wherein presence of both the one or more via-in-via connections and the one or more single via connections is configured to adjust a ratio of leakage inductance to distributed capacitance of the at least one of the substrate inductive devices.

2. The integrated connector module of claim 1, wherein the substrate comprises a multi-layer substrate comprising four (4) conductive layers comprising two (2) outer layers and two (2) inner layers;

wherein the inner via is coupled to the two (2) outer layers and the outer via is coupled to the two (2) inner layers.

3. The integrated connector module of claim 2, wherein the non-conductive material comprises a parylene coating.

4. The integrated connector module of claim 1, wherein the substrate comprises a thickness that is greater than a height of the toroidal core.

5. The integrated connector module of claim 4, further comprising an adjacent substrate and a buffer material, the buffer material being disposed between the toroidal core and the adjacent substrate in order to accommodate thermal expansion during soldering operations.

6. The integrated connector module of claim 5, wherein the one or more via-in-via connections and the one or more single via connections collectively form the windings for a transformer with approximately half of the inner vias comprising a primary winding and the other half of the inner vias comprising a secondary winding for the transformer.

7. The integrated connector module of claim 1, wherein the substrate comprising the one or more via-in-via connection comprises a plurality of via-in-via connections;

a first via-in-via connection comprises a portion of a primary winding for a transformer for the inner via connection; and

a second via-in-via connection comprises a portion of a secondary winding for the transformer for the outer via connection.

8. The integrated connector module of claim 7, wherein the plurality of via-in-via connections collectively form the windings for a transformer with approximately half of the inner via connections comprising a primary winding and the other half of the inner via connections comprising a secondary winding for the transformer.

9. An integrated connector module, comprising:

a connector housing having a plurality of substrate inductive devices disposed therein, at least one of the substrate inductive devices comprising;

a substrate comprising a plurality of via-in-via connections and a plurality of single via connections, the plurality of via-in-via connections each comprising an inner via and an outer via separated from the inner via by a non-conductive material; and

a toroidal core;

wherein the plurality of single via connections and some of the plurality of the via-in-via connections are disposed on an external periphery of the toroidal core, and other ones of the plurality of via-in-via connections are disposed on an internal periphery of the toroidal core; and

wherein the plurality of via-in-via connections and the plurality of single via connections are configured to correct an inductive/capacitive ratio of the at least one of the substrate inductive devices.

10. The integrated connector module of claim 9, wherein the substrate that includes the plurality of via-in-via connections comprises a multi-layer substrate comprising four (4) conductive layers further comprising two (2) outer layers and two (2) inner layers;

wherein the inner via of a respective via-in-via connection is coupled to the two (2) outer layers and the outer via of the respective via-in-via connection is coupled to the two (2) inner layers.

11. The integrated connector module of claim 10, wherein the non-conductive material comprises a parylene coating.

12. The integrated connector module of claim 10, wherein the substrate comprises a thickness that is greater than a height of the toroidal core.

13. The integrated connector module of claim 9, wherein the external periphery of the toroidal core comprises fewer via-in-via connections than single via connections.

14. The integrated connector module of claim 9, wherein the internal periphery of the toroidal core further comprises one or more single via connections.

15. An integrated connector module, comprising:

a connector housing having a plurality of substrate inductive devices disposed therein, at least one of the substrate inductive devices comprising;

a substrate comprising a plurality of via-in-via connections and a plurality of single via connections, each of the via-in-via connections comprising an inner via and an outer via separated from the inner via by a non-conductive material;

a toroidal core disposed adjacent to the via-in-via connections and the single via connections;

a first trace which joins at least a portion of a first via-in-via connection disposed on an inner periphery of the toroidal core to a first one of the single via connections disposed on an outer periphery of the toroidal core; and

a second trace which joins at least a portion of the first via-in-via connection disposed on the inner periphery of the toroidal core to a second one of the single via connections disposed on the outer periphery of the toroidal core, the first trace and the second trace being configured to at least partially overlap.

16. The integrated connector module of claim 15, wherein a width of the first trace and a width of the second trace are different.

17. The integrated connector module of claim 15, further comprising a third trace which joins at least a portion of a second via-in-via connection disposed on the inner periphery of the toroidal core to at least a portion of a third via-in-via connection disposed on the outer periphery of the toroidal core.

18. The integrated connector module of claim 17, further comprising a buffer material, the buffer material being disposed between the toroidal core and the substrate in order to accommodate thermal expansion during soldering operations.

19. The integrated connector module of claim 15, wherein an inner via of a respective via-in-via connection comprises a portion of a primary winding for a transformer;

and

wherein an outer via for the respective via-in-via connection comprises a portion of a secondary winding for the transformer.

20. The integrated connector module of claim 15, wherein an inner via of a respective via-in-via connection comprises a portion of a secondary winding for a transformer;

and

wherein an outer via for the respective via-in-via connection comprises a portion of a primary winding for the transformer.