Semiconductor device

• US 9,312,192 B2
• Filed: 08/08/2014
• Issued: 04/12/2016
• Est. Priority Date: 03/28/2012
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Horio, Masafumi, Nakamura, Hideyo
• Primary Examiner(s): ENAD, CHRISTINE A
• Application Number:
  US14/455,098
• Publication Number:
  US 20140361424A1
• Time in Patent Office: 613 Days
• Field of Search: 257/704
• US Class Current: 1/1
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 23/041 the container being a hollow construction having no base used as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/043 the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
• CPC Class Codes: H01L 23/051 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/209 : Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A semiconductor device includes: a plurality of semiconductor modules, each of which includes a semiconductor circuit having a circuit board on which at least one or more semiconductor chips are mounted; and a module storage case that accommodates the plurality of semiconductor modules which are arranged in parallel. In the module storage case, a plurality of pairs of positioning guide members, which position and guide the semiconductor modules, are formed on opposite surfaces forming a module storage region for accommodating the semiconductor modules so as to protrude inward and to face each other, so that a distance between the plurality of semiconductor modules in a longitudinal direction can be selected. A pair of fitting concave portions, which are fitted to the pair of positioning guide members, are formed at both ends of each semiconductor module in the longitudinal direction.

Claims

1. A semiconductor device comprising:

a semiconductor module comprising a fitting portion; and

a module storage case configured to accommodate a plurality of the semiconductor modules and comprising a plurality of positioning guide members configured to position the semiconductor modules at selectable distances between the plurality of semiconductor modules,

wherein a plurality of pairs of the positioning guide members are disposed on opposite sides of the module storage case so as to protrude inward and face each other, to provide the selectable distances between the plurality of semiconductor modules in a longitudinal direction, and

wherein fitting concave portions, which are fitted to a pair of positioning guide members, are disposed at respective ends of the semiconductor module in the longitudinal direction.

2. The semiconductor device according to claim 1, wherein:

the semiconductor module comprises a semiconductor circuit having a circuit board on which at least one semiconductor chip is mounted,

the module storage case is configured to accommodate the plurality of semiconductor modules arranged in parallel.

3. The semiconductor device according to claim 2, wherein:

cap insertion concave portions are disposed in one surface of each of the plurality of semiconductor modules at both ends in the longitudinal direction,

an attachment hole, having a fixing tool inserted therein, extends through the bottom of the cap insertion concave portion to the other surface,

an insulating cap, which insulates the fixing tool, is fitted to the cap insertion concave portion, and

the fitting concave portions are formed in the insulating cap.

4. The semiconductor device according to claim 3,

wherein the insulating cap comprises an inner cylindrical portion that is fitted to the cap insertion concave portion and has two open ends and an outer cylindrical portion that is connected to the outside of the inner cylindrical portion, formed coaxially with the inner cylindrical portion, and has an open lower end, and

the fitting concave portion is disposed in the outer cylindrical portion.

5. The semiconductor device according to claim 4,

wherein a fitting protrusion of the module storage case comprises a snap-fitting convex portion disposed at a position corresponding to an opening portion of the outer cylindrical portion of the insulating cap, and

wherein a snap-fitting concave portion fitted to the snap-fitting convex portion is disposed in the fitting concave portion of the outer cylindrical portion of the insulating cap.

6. The semiconductor device according to claim 5,

wherein the module storage case accommodates the plurality of semiconductor modules such that a heat dissipation portion disposed in each of the plurality of semiconductor modules faces the opening portion, and

wherein the fixing tools are inserted into the attachment holes of the semiconductor modules, which correspond to attachment insertion holes, through the attachment insertion holes, with the heat dissipation portions coming into contact with a cooler, to fix the plurality of semiconductor modules to the cooler.

7. A semiconductor device comprising:

a semiconductor module comprising a fitting portion; and

a module storage case accommodating the semiconductor module and comprising a plurality of positioning guide members, the semiconductor module being movably coupled with the module storage case via the fitting portion such that the semiconductor module is disposed in a first location when coupled with a first positioning guide member and is disposed in a second location different from the first location when coupled with a second positioning guide member different from the first positioning guide member,

wherein the fitting portion comprises a first concave fitting portion and a second concave fitting portion spaced apart from the first concave fitting portion,

wherein the first positioning guide member comprises a first convex positioning guide member and a second convex positioning guide member,

wherein the second positioning guide member comprises a third convex positioning guide member and a fourth convex positioning guide member,

wherein the first concave fitting portion is coupled with the first convex positioning guide member and the second concave fitting portion is coupled with the second convex positioning guide member when the semiconductor module is disposed in the first location, and

wherein the first concave fitting portion is coupled with the third convex positioning guide member and the second concave fitting portion is coupled with the fourth convex positioning guide member when the semiconductor module is disposed in the second location.

8. The semiconductor device according to claim 7, wherein the first concave fitting portion and the second concave fitting portion are disposed on opposite sides of the semiconductor module from each other.