LED illuminating device comprising light emitting device including LED chips on single substrate

• US 9,312,304 B2
• Filed: 02/20/2015
• Issued: 04/12/2016
• Est. Priority Date: 01/22/2010
• Status: Active Grant

• Current Assignee: Heavy Duty Lighting LLC (Ni, Wang & Massand, PLLC)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Hata, Toshio, Agatani, Makoto, Ishizaki, Shinya, Nada, Tomokazu
• Primary Examiner(s): Tran, Minh-Loan
• Application Number:
  US14/627,239
• Publication Number:
  US 20150171141A1
• Time in Patent Office: 417 Days
• Field of Search: 257/98, 257/99, 257/100
• US Class Current: 1/1
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 5/048 the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses
• CPC Class Codes: F21V 5/10 comprising photoluminescent material
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.

Claims

1. An LED illuminating device comprising:

a mounting surface;

a light emitting device mounted on said mounting surface, including;

(i) a substrate having a primary surface and a back surface that is faced toward said mounting surface,

(ii) a plurality of LED chips positioned around a center of the primary surface of the substrate,

(iii) a resin frame formed on the primary surface of the substrate and provided annularly so as to surround a mounting area in which the plurality of LED chips are provided, the resin frame having light reflectivity,

(iv) a sealing resin provided on the mounting area, and

(v) an anode-side electrode land and a cathode-side electrode land which are electrodes electrically connected to a voltage supply circuit in said LED illuminating device and to the plurality of LED chips, the anode-side electrode land and the cathode-side electrode land being provided on the primary surface of the substrate and outside the resin frame; and

a lens located above the light emitting device and apart from the sealing resin.

2. The LED illuminating device of claim 1, further comprising:

a first external wiring line connected to the anode-side electrode land, extending from the anode-side electrode land to beneath said mounting surface; and

a second external wiring line connected to the cathode-side electrode land, extending from the anode-side electrode land to beneath said mounting surface.

3. The LED illuminating device of claim 1, wherein said mounting surface has a round shape in a top view.

4. The LED illuminating device of claim 3, further comprising a radiator fin provided around said LED illuminating device.

5. The LED illuminating device of claim 1, wherein the substrate has a rectangular shape in the top view.

6. The LED illuminating device of claim 5, wherein the substrate has a longer side of 15 mm and a shorter side of 12 mm.

7. The LED illuminating device of claim 5, wherein the anode-side electrode land and the cathode-side electrode land are located near corners of the substrate.

8. The LED illuminating device of claim 7, wherein the anode-side electrode land is opposite to the cathode-side electrode land with respect to the sealing resin.

9. The LED illuminating device of claim 1, wherein the resin frame has a circular shape in a top view.

10. The LED illuminating device of claim 9, wherein the sealing resin contacts with the resin frame.

11. The LED illuminating device of claim 10, wherein the sealing resin has a dome shape that projects upward in a cross section view.

12. The LED illuminating device of claim 11, wherein the peak of the dome shape is higher than the top of the resin frame.

13. The LED illuminating device of claim 12, wherein the resin frame has a dome shape in a cross section view.

14. The LED illuminating device of claim 10, wherein the anode-side electrode land is opposite to the cathode-side electrode land with respect to the sealing resin.