Method of forming an electronic article
First Claim
1. A method of forming an electronic article having a perimeter and comprising a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed as a layer on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the layer of the silicone encapsulant, said method comprising the steps of:
- depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article; and
laminating the superstrate, the optoelectronic element, and the curable silicone composition to form the electronic article,wherein the curable silicone composition has an complex viscosity of from 10,000 to 50,000,000 cPs at 25°
C. as measured at 1 radian per second at 1 to 5% strain, andwherein during the step of laminating the curable silicone composition cures to form the silicone encapsulant and air escapes from the interior of the electronic article to the perimeter of the electronic article through the at least one passage to form a layer of the curable silicone composition and the curable silicone composition cures to form the layer of the silicone encapsulant.
2 Assignments
0 Petitions
Accused Products
Abstract
An electronic article has a perimeter and includes a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the silicone encapsulant. The electronic article is formed using a method that includes the step of depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article. The method also includes laminating the superstrate, the optoelectronic element, and the curable silicone composition. The curable silicone composition has a complex viscosity of from 10,000 to 50,000,000 cPs at 25° C. as measured at 1 radian per second at 1 to 5% strain. During lamination, the curable silicone composition cures to form the silicone encapsulant and air escapes from through the at least one passage.
5 Citations
17 Claims
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1. A method of forming an electronic article having a perimeter and comprising a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed as a layer on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the layer of the silicone encapsulant, said method comprising the steps of:
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depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article; and laminating the superstrate, the optoelectronic element, and the curable silicone composition to form the electronic article, wherein the curable silicone composition has an complex viscosity of from 10,000 to 50,000,000 cPs at 25°
C. as measured at 1 radian per second at 1 to 5% strain, andwherein during the step of laminating the curable silicone composition cures to form the silicone encapsulant and air escapes from the interior of the electronic article to the perimeter of the electronic article through the at least one passage to form a layer of the curable silicone composition and the curable silicone composition cures to form the layer of the silicone encapsulant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming a photovoltaic cell module having a perimeter and comprising a superstrate having a light transmittance of at least 70 percent as determined by UV/Vis spectrophotometry using ASTM E424-71 (2007) (ASTM International, formerly American Society for Testing and Materials), a photovoltaic cell disposed on the superstrate, and a silicone encapsulant disposed as a layer on the photovoltaic cell and sandwiching the photovoltaic cell between the superstrate and the layer of the silicone encapsulant, said method comprising the steps of:
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depositing the curable silicone composition on the photovoltaic cell in a pattern defining at least one passage extending from an interior of the photovoltaic cell module to a perimeter of the photovoltaic cell module; and laminating the superstrate, the photovoltaic cell, and the curable silicone composition to form the photovoltaic cell module, wherein the curable silicone composition has an complex viscosity of from 80,000 to 200,000 cPs at 25°
C. as measured at 1 radian per second at 1 to 5% strain, andwherein during the step of laminating the curable silicone composition cures to form the silicone encapsulant and air escapes from the interior of the photovoltaic cell module to the perimeter of the photovoltaic cell module through the at least one passage to form a layer of the curable silicone composition and the curable silicone composition cures to form the layer of the silicone encapsulant. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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Specification