Image detector with lens assembly and related methods
First Claim
Patent Images
1. An electronic device comprising:
- a substrate comprising a dielectric layer, and a plurality of electrically conductive traces over said dielectric layer;
an image sensor integrated circuit (IC) over said substrate; and
a lens assembly above said substrate and comprisinga spacer above said substrate,a first adhesive layer over said spacer,at least one lens aligned with said image sensor IC and over said first adhesive layer,a second adhesive layer surrounding a peripheral surface of said at least one lens and said first adhesive layer, anda baffle over said at least one lens and said second adhesive layer.
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Abstract
An electronic device may include a substrate, an image sensor IC over the substrate, and a lens assembly above the substrate. The lens assembly may include a spacer above the substrate, a first adhesive layer over the spacer, a lens aligned with the image sensor IC and over the first adhesive layer, a second adhesive layer surrounding a peripheral surface of the lens and the first adhesive layer, and a baffle over the lens and the second adhesive layer.
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Citations
25 Claims
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1. An electronic device comprising:
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a substrate comprising a dielectric layer, and a plurality of electrically conductive traces over said dielectric layer; an image sensor integrated circuit (IC) over said substrate; and a lens assembly above said substrate and comprising a spacer above said substrate, a first adhesive layer over said spacer, at least one lens aligned with said image sensor IC and over said first adhesive layer, a second adhesive layer surrounding a peripheral surface of said at least one lens and said first adhesive layer, and a baffle over said at least one lens and said second adhesive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A lens assembly for an electronic device having a substrate comprising a dielectric layer, and a plurality of electrically conductive traces over the dielectric layer, and an image sensor integrated circuit (IC) over the substrate, the lens assembly comprising:
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a spacer above the substrate; a first adhesive layer over said spacer; at least one lens aligned with the image sensor IC and over said first adhesive layer; a second adhesive layer surrounding a peripheral surface of said at least one lens and said first adhesive layer; and a baffle over said at least one lens and said second adhesive layer. - View Dependent Claims (11, 12, 13)
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14. A method making a plurality of lens assemblies comprising:
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adhesively joining a lens wafer to a spacer wafer with a first adhesive layer, the lens wafer comprising a plurality of lenses; forming a plurality of recesses extending through the lens wafer and first adhesive layer, and into the spacer wafer, each recess being between adjacent lenses; filling the recesses with a second adhesive layer; adhesively joining a baffle wafer onto the second adhesive layer; and dicing the joined-together spacer wafer, lens wafer, and baffle wafer to define the plurality of lens assemblies. - View Dependent Claims (15, 16, 17, 18)
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19. A method making an electronic device comprising:
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forming a substrate comprising a dielectric layer, and a plurality of electrically conductive traces over the dielectric layer; forming an image sensor integrated circuit (IC) over the substrate; and forming a lens assembly above the substrate, the lens assembly comprising a spacer above the substrate, a first adhesive layer over the spacer, at least one lens aligned with the image sensor IC and over the first adhesive layer, a second adhesive layer surrounding a peripheral surface of the at least one lens and the first adhesive layer, and a baffle over the at least one lens and the second adhesive layer. - View Dependent Claims (20, 21, 22, 23, 24, 25)
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Specification