Electronic system with heat extraction and method of manufacture thereof
First Claim
Patent Images
1. An electronic system comprising:
- a substrate;
an electrical device over the substrate; and
a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape formed using an extrusion mechanism, and the extruded shape including a base portion and a V-beam shape extending from the base portion, the V-beam shape including a first non-horizontal portion and a second non-horizontal portion, the base portion attached to the substrate, the first non-horizontal portion and the second non-horizontal portion extending outwardly from the base portion with the first non-horizontal portion and the second non-horizontal portion formed at an angle less than 90 degrees from the base portion.
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Abstract
An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism.
271 Citations
7 Claims
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1. An electronic system comprising:
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a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape formed using an extrusion mechanism, and the extruded shape including a base portion and a V-beam shape extending from the base portion, the V-beam shape including a first non-horizontal portion and a second non-horizontal portion, the base portion attached to the substrate, the first non-horizontal portion and the second non-horizontal portion extending outwardly from the base portion with the first non-horizontal portion and the second non-horizontal portion formed at an angle less than 90 degrees from the base portion. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification