Attachment of a cap to a substrate-based device with in situ monitoring of bond quality
First Claim
1. A method for bonding a cap to a substrate, the method comprising:
- providing a ring-cap assembly comprising;
the cap having a cap top surface, a cap bottom surface and being characterized by a cap width; and
an interposer ring comprising a ring material transparent at an illumination wavelength, the ring having a ring top surface, a ring bottom surface, and being characterized by a ring width greater than the cap width, wherein the ring top surface is attached to the cap bottom surface to form the ring-cap assembly such that a peripheral portion of the ring projects outwards beyond the overlying cap, and wherein the portion of the ring bottom surface underlying the projecting peripheral portion of the ring comprises a plurality of downwardly extending fingers;
providing the substrate having a substrate top surface;
positioning the ring-cap assembly so that the plurality of fingers overlies predetermined portions of the substrate top surface; and
creating a first bond between a first one of the plurality of fingers and a corresponding first predetermined portion of the substrate top surface while illuminating and observing the first predetermined portion at the illumination wavelength through the projecting peripheral portion of the ring to determine a quality measure of the first bond.
4 Assignments
0 Petitions
Accused Products
Abstract
Embodiments generally relate to methods for bonding a cap to a substrate. In one embodiment, the method comprises first providing a ring-cap assembly, comprising a cap and an interposer ring comprising a ring material transparent at an illumination wavelength. A peripheral portion of the ring projects outwards beyond the overlying cap. The portion of the ring bottom surface underlying the projecting peripheral portion of the ring comprises a plurality of downwardly extending fingers. The method further comprises positioning the ring-cap assembly so that the plurality of fingers directly overlies predetermined portions of the substrate top substrate, creating a first bond between a first one of the plurality of fingers and a corresponding first predetermined portion of the substrate top surface, while illuminating and observing the first predetermined portion at the illumination wavelength through the projecting peripheral portion of the ring to determine a quality measure of that first bond.
-
Citations
19 Claims
-
1. A method for bonding a cap to a substrate, the method comprising:
-
providing a ring-cap assembly comprising; the cap having a cap top surface, a cap bottom surface and being characterized by a cap width; and an interposer ring comprising a ring material transparent at an illumination wavelength, the ring having a ring top surface, a ring bottom surface, and being characterized by a ring width greater than the cap width, wherein the ring top surface is attached to the cap bottom surface to form the ring-cap assembly such that a peripheral portion of the ring projects outwards beyond the overlying cap, and wherein the portion of the ring bottom surface underlying the projecting peripheral portion of the ring comprises a plurality of downwardly extending fingers; providing the substrate having a substrate top surface; positioning the ring-cap assembly so that the plurality of fingers overlies predetermined portions of the substrate top surface; and creating a first bond between a first one of the plurality of fingers and a corresponding first predetermined portion of the substrate top surface while illuminating and observing the first predetermined portion at the illumination wavelength through the projecting peripheral portion of the ring to determine a quality measure of the first bond. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
-
-
14. A method for bonding a plurality of caps to a substrate, the method comprising:
-
providing a plurality of ring-cap assemblies, each ring-cap assembly comprising; one of the plurality of caps, each cap having a cap top surface, a cap bottom surface and being characterized by a cap width; and an interposer ring comprising a ring material transparent at an illumination wavelength, the ring having a ring top surface, a ring bottom surface, and being characterized by a ring width greater than the cap width, wherein the ring top surface is attached to the cap bottom surface to form the ring-cap assembly such that a peripheral portion of the ring projects outwards beyond the overlying cap, and wherein the portion of the ring bottom surface underlying the projecting peripheral portion of the ring comprises a plurality of downwardly extending fingers; providing the substrate having a substrate top surface; and for each of said plurality of ring-cap assemblies, carrying out the following steps in turn; first, positioning the assembly so that the plurality of fingers of the first assembly overlies predetermined portions of the substrate top surface; and second, creating a first bond between a first one of the plurality of fingers of the assembly and a corresponding first predetermined portion of the substrate top surface while illuminating and observing the first predetermined portion at the illumination wavelength through the projecting peripheral portion of the ring to determine a quality measure of the first bond. - View Dependent Claims (15)
-
-
16. A method for bonding a plurality of caps to a substrate, the method comprising:
-
providing a plurality of ring-cap assemblies, each ring-cap assembly comprising; one of the plurality of caps, each cap having a cap top surface, a cap bottom surface and being characterized by a cap width; and an interposer ring comprising a ring material transparent at an illumination wavelength, the ring having a ring top surface, a ring bottom surface, and being characterized by a ring width greater than the cap width, wherein the ring top surface is attached to the cap bottom surface to form the ring-cap assembly such that a peripheral portion of the ring projects outwards beyond the overlying cap, and wherein the portion of the ring bottom surface underlying the projecting peripheral portion of the ring comprises a plurality of downwardly extending fingers; providing the substrate having a substrate top surface; positioning the plurality of assemblies so that the plurality of fingers of each assembly overlies predetermined portions of the substrate top surface; and creating a plurality of first bonds at substantially the same time, each of said first bonds corresponding to a separate one of said plurality of assemblies, wherein each of said first bonds is created between a first one of the plurality of fingers of an assembly and a corresponding first predetermined portion of the substrate top surface while illuminating and observing the first predetermined portion at the illumination wavelength through the projecting peripheral portion of the corresponding ring to determine a quality measure of the corresponding first bond. - View Dependent Claims (17, 18, 19)
-
Specification