Module and electronic apparatus

• US 9,316,499 B2
• Filed: 05/23/2012
• Issued: 04/19/2016
• Est. Priority Date: 05/31/2011
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Sakuma, Masayasu, Kobayashi, Yoshihiro, Kitamura, Shojiro, Chino, Taketo, Ogami, Michiharu
• Primary Examiner(s): Williams, Hezron E
• Assistant Examiner(s): Shabman, Mark A
• Application Number:
  US13/478,850
• Publication Number:
  US 20120304768A1
• Time in Patent Office: 1,427 Days
• Field of Search: 734/93
• US Class Current: 1/1
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719

Abstract

A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.

Claims

1. A module comprising:

a first substrate that includes an analog circuit;

a second substrate that includes a digital circuit;

a third substrate that includes a first sensor device;

a fourth substrate that includes a second sensor device;

a first connecting portion that connects the first substrate and the second substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility;

a second connecting portion that connects the first substrate and the third substrate so as to electrically connect the analog circuit and the first sensor device, and that has flexibility; and

a third connecting portion that connects the first substrate and the fourth substrate, or the third substrate and the fourth substrate so as to electrically connect the analog circuit and the second sensor device, wherein the third connecting portion has flexibility,

wherein the first connecting portion, the second connecting portion, and the third connecting portion may be bent such that the first substrate, second substrate, third substrate, and fourth substrate are orthogonal to each other,

wherein the first substrate further includes a third sensor device that is electrically connected to the analog circuit,

wherein the first substrate and the second substrate are opposite to each other,

wherein the third sensor device is positioned on a face of the first substrate that is opposite to the second substrate.

2. The module according to claim 1,

wherein the first substrate, the third substrate, and the fourth substrate are disposed to be orthogonal to each other.

3. The module according to claim 1,

wherein each of the first sensor device, the second sensor device, and the third sensor device is an acceleration sensor or an angular velocity sensor.

4. The module according to claim 3,

wherein detection axes of the first sensor device, the second sensor device, and the third sensor device are orthogonal to each other.

5. The module according to claim 1, further comprising:

a fifth substrate that includes a connector for an interface; and

a fourth connecting portion that connects the second substrate and the fifth substrate so as to electrically connect the digital circuit and the connector.

6. The module according to claim 1,

wherein at least one of the first substrate and the second substrate has a cut-out portion, and

at least one of the first connecting portion and the second connecting portion extends from the cut-out portion.

7. The module according to claim 1,

wherein the analog circuit includes at least one of a power supply circuit, an amplifying circuit, and an analog/digital converting circuit, and

the digital circuit includes a microcontroller.

8. The module according to claim 1, further comprising:

a supporting member that has a plurality of fixing faces,

wherein the first substrate, the second substrate, and the third substrate are disposed along the fixing faces, respectively.

9. An electronic apparatus comprising:

the module according to claim 1.